Composition depth profiles of Bi3.15Nd0.85Ti3O12 thin films studied by X-ray photoelectron spectroscopy

In the present work, X-ray photoelectron spectroscopy (XPS) was used to investigate the composition depth profiles of Bi_3.15Nd_0.85Ti₃O₁₂ (BNT) ferroelectric thin film, which was prepared on Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrates by chemical solution deposition (CSD). It is shown that there are three distinct regions formed in BNT film, which are surface layer, bulk film and interface layer. The surface of film is found to consist of one outermost Bi-rich region. High resolution spectra of the O 1s peak in the surface can be decomposed into two components of metallic oxide oxygen and surface adsorbed oxygen. The distribution of component elements is nearly uniform within the bulk film. In the bulk film, high resolution XPS spectra of O 1s, Bi 4f, Nd 3d, Ti 2p are in agreement with the element chemical states of the BNT system. The interfacial layer is formed through the interdiffusion between the BNT film and Pt electrode. In addition, the Ar⁺-ion sputtering changes lots of Bi³⁺ ions into Bi⁰ due to weak Bi-O bond and high etching energy.     

THE SERRE RELATIONS IN RINGEL－HALL ALGEBRAS

The author constructs the Casimir element of Hall algebras.By the method of Gabber-Kactheorem(see [4]),it is proved that the Serre relations are the defining relations in compositionalgebra.     

Impact of Ge-Sb-Te compound engineering on the set operation performance in phase-change memories

The phase-change memory (PCM) technology is considered as one of the most attractive non-volatile memory concepts for next generation data storage. It relies on the ability of a chalcogenide material belonging to the Ge-Sb-Te compound system to reversibly change its phase between two stable states, namely the poly-crystalline low-resistive state and the amorphous high-resistive state, allowing the storage of the logical bit. A careful study of the phase-change material properties in terms of the set operation performance, the program window and the electrical switching parameters as a function of composition is very attractive in order to enlarge the possible PCM application spectrum. Concerning the set performance, a crystallization kinetics based interpretation of the observed behavior measured on different Ge-Sb-Te compounds is provided, allowing a physics-based comprehension of the reset-to-set transition.     

Corrigendum to “On norms of composition operators acting on Bergman spaces” [J. Math. Anal. Appl. 291 (2004) 189-202]

A theorem and a corollary in the paper cited in the title were stated incorrectly, as was pointed out by Christopher Hammond. We now state correctly and prove both of them. These results still generalize and explain the geometric meaning of the Cowen-Hurst norm formula. We also include additional references and provide an example relevant for further study.     

Dirichlet空间上的循环复合算子

该文主要证明了在Dirichlet空间上由复合算子{C\-φ:φ∈Aut(D)}生成的代数为循环算子代数;同时对任意的解析映射φ:D→D,C\-φ都不可能为超循环算子给出了证明.     

Composition of stable set polyhedra

Barahona and Mahjoub found a defining system of the stable set polytope for a graph with a cut-set of cardinality 2. We extend this result to cut-sets composed of a complete graph minus an edge and use the new theorem to derive a class of facets.     

单位球上F(p,q,s)空间到Bloch型空间的复合算子

该文分别给出了单位球B上空间F(p, q, s)到空间β^α之复合算子C_{varphi}为有界算子和紧算子的充要条件.同时作为推论获得了Bloch型空间的相应结果.     

Qualification of plastic encapsulated microcircuits (PEM) for avionicsBased on ``Plastic Encapsulated Microcircuits (PEM) Qualification Testing'''', by J. A. Scalise, which appeared in the Proceedings of the 46th Electronic Components and Technology Conference, Orlando, FL, U.S.A., 28–31 May 1996, pp. 392–397. © 1996 IEEE.

Microcircuit package qualification testing is used to establish the reliability of integrated circuit processes and devices as they relate to part packaging. This paper presents the results of package qualification tests conducted on plastic encapsulated microcircuits (PEMs) and plastic discrete devices (diodes, transistors) used in avionics applications. Highly accelerated stress test (HAST) and temperature cycle (TC) test results, including part failure mechanisms and associated failure rates, are provided. A variety of plastic package styles and integrated circuit functions have been tested. Examples of package styles tested include small outline (SO), plastic leaded chip carrier (PLCC), thin small outline package (TSOP), plastic quad flat package (PQFP) and plastic dual-in-line (PDIP).Manufacturers' devices have been evaluated and various plastic compounds have been compared to determine which provide optimum reliability. The testing showed that package qualification performance of PEMs is affected by type of compound, passivation (including die coat) and die size. HAST failures are caused by moisture penetration of the package while temperature cycle failures result from coefficient of thermal expansion (CTE) mismatch effects.     

Hα∞到Hβ∞复合算子的线性组合

设B是N维复空间C^N中的开单位球,φ_i为B上的解析自映射,H_α^∞表示定义在单位球上的加权解析函数空间.本文主要研究的是从空间H_α^∞到H_β^∞上的复合算子线性组合■的紧致性,其中λ_i(i=1,2,…,M)是非零常数.另外,根据紧致性等价条件,得出算子差分对(C_φ1-C_φ2)-(C_φ3-C_φ1)是紧致的当且仅当C_φ1-C_φ2与C_φ3-C_φ1都是紧致的算子.     

Nearly m-embedded subgroups and solvability of finite groups

A subgroup A of a finite group G is called {1≤G}-embedded in G if for each two subgroups K≤H of G, where K is a maximal subgroup of H, A either covers the pair (K,H) or avoids it. Moreover, a subgroup H of G is called nearly m-embedded in G if G has a subgroup T and a {1≤G}-embedded subgroup C such that G?=?HT and H∩T≤C≤H. In this paper, we mainly prove that G is solvable if and only if its Sylow 3-subgroups, Sylow 5-subgroups and Sylow 7-subgroups are nearly m-embedded in G.