Comparison of HPLC enantioseparation of substituted binaphthyls on CD‐, polysaccharide‐ and synthetic polymer‐based chiral stationary phases

Retention and enantioseparation behavior of ten 2,2′‐disubstituted or 2,3,2′‐trisubstituted 1,1′‐binaphthyls and 8,3′‐disubstituted 1,2′‐binaphthyls, which are used as catalysts in asymmetric synthesis, was investigated on eight chiral stationary phases (CSPs) based on β‐CD, polysaccharides (tris(3,5‐dimethylphenylcarbamate) cellulose or amylose CSPs) and new synthetic polymers (trans‐1,2‐diamino‐cyclohexane, trans‐1,2‐diphenylethylenediamine and trans‐9,10‐dihydro‐9,10‐ethanoanthracene‐(11S,12S)‐11,12‐dicarboxylic acid CSPs). Normal‐, reversed‐phase and polar‐organic separation modes were employed. The effect of the mobile phase composition was examined. The enantiomeric separation of binaphthyl derivatives, which possess quite similar structures, was possible in different enantioselective environments. The substituents and their positions on the binaphthyl skeleton affect their properties and, as a consequence, the separation system suitable for their enantioseparation. In general, the presence of ionizable groups on the binaphthyl skeleton, substitution with non‐identical groups and a chiral axis in the 1,2′ position had the greatest impact on the enantiomeric discrimination. The 8,3′‐disubstituted 1,2′‐binaphthyl derivatives were the most easily separated compounds in several separation systems. From all the chiral stationary phases tested, cellulose‐based columns were shown to be the most convenient for enantioseparation of the studied analytes. However, the polymeric CSPs with their complementary behavior provided good enantioselective environments for some derivatives that could be hardly separated in any other chromatographic system.     

0.5 mm间距CSP焊接工艺研究

随着对各种电子产品，尤其是消费类电子产品的便携性和多功能的追求，CSP等新型封装器件(封装尺寸约为芯片本身尺寸的1．2倍)便应用到这些产品的设计中去。CSP器件的引脚间距有0．8mm、0．75mm、0．65mm、0．5mm等。为了便于以后产品设计和生产的需要，就CSP器件在PWB设计和焊接两方面进行研究，侧重于焊接方面。     

使用超薄型微细布线基板（MLTS）的高密度LSI封装

概述了超高密度薄型基板(MLTS)封装技术的概念、特征和工艺以及应用MLTS封装技术开发的高性能FCBGA和CSP。     

微电子封装技术的发展趋势

论述了微电子封装技术的现状与未来 ,介绍了微电子封装中几个值得注意的发展动向 ,同时 ,从中可以看出IC芯片与微电子封装技术相互促进 ,协调发展密不可分的关系。     

高密度组装电气互联新技术原理与研究方法

网络通信技术的高速发展围绕着小、轻、高速和高密度几个方向给IT市场提出了多样化的需求。介绍了高密度组装发展的现状和未来的发展趋势。CSP的研制使组装密度和性能得到提高，达到二维组装密度的极限；三维多芯片组装使组装密度达到一个新的高度，高速性能大大提高，同时力求降低制造成本。21世纪互联技术将继续沿着高密度和高速性方向发展。     

Chiral Separations in Normal‐phase Liquid Chromatography: Updating a Screening Strategy with a Chlorine‐containing Polysaccharide‐based Selector

The screening conditions of an existing column and mobile phase selection strategy for chiral compounds in normal‐phase high performance liquid chromatography (NP‐HPLC) were tested for their applicability on Chiralpak IC, which is a chiral stationary phase (CSP) made by immobilising cellulosic tris (3,5‐dichlorophenyl‐carbamate) on silica gel. In this study, the applicability of the optimization steps of the existing separation strategy was examined using 36 compounds representing the three possible resolution situations that occur after screening. The cumulative number of separated compounds is 27 (75.0 %), and the cumulative number of baseline separated compounds is 19 (52.8 %).     

非均匀取代淀粉衍生物手性固定相的制备及其手性识别能力

通过区域选择性方法制备了两种新型淀粉衍生物,分别为淀粉2-苯甲酸酯-3-(4-甲基苯基氨基甲酸酯)-6-(3,5-二氯苯基氨基甲酸酯)和淀粉2-苯甲酸酯-3-(3,5-二氯苯基氨基甲酸酯)-6-(4-甲基苯基氨基甲酸酯),将二者分别涂覆于氨丙基硅胶后用作液相色谱手性固定相。研究表明:所制备的手性固定相显示出特异的手性识别能力,其手性识别能力明显高于均匀取代淀粉衍生物——淀粉三(3,5-二氯苯基氨基甲酸酯),取代基的性质及在葡萄糖单元上的位置对手性固定相的手性识别能力有较大的影响。一些未在商品化的手性柱Chiralpak AD上得到有效分离的手性化合物在所制备的固定相上得到了更好的分离。所测试的8对对映体在淀粉2-苯甲酸酯-3-(4-甲基苯基氨基甲酸酯)-6-(3,5-二氯苯基氨基甲酸酯)固定相上均得到了分离,因而此固定相的手性识别能力较强,具有潜在的应用价值。     

9-蒽醛衍生化-高效液相色谱法拆分α-氨基酸甲酯和几种脂肪胺对映体

采用高效液相色谱法,以9-蒽醛为衍生试剂,在5种多糖衍生物的手性固定相(CSPs)上对几种α-氨基酸甲酯对映体进行了手性分离。色谱条件如下: 流动相为含3%～10%(v/v)异丙醇的正己烷溶液,流速为1.0 mL/min,检测波长为254 nm。结果表明,α-氨基酸甲酯-9-蒽醛亚胺衍生物在Chiralcel OD柱或Chiralcel OD-H柱上的手性分离结果优于其他CSPs,而且在Chiralcel OD柱或Chiralcel OD-H柱上全部得到了基线拆分(α=1.24～5.47, Rs=2.56～13.90), L-对映体在这两种色谱柱上的保留强于D-对映体。同时还考察了几种脂肪胺在5种多糖衍生物手性固定相上的对映体拆分效果,结果表明脂肪胺的9-蒽醛亚胺衍生物在Chiralcel OD柱或Chiralcel OD-H柱上的分离效果良好。该法可用于其他α-氨基酸酯和胺类化合物对映体的分析。     

内存芯片封装技术的发展

本文主介绍了国际上内存芯片封装技术的现状以及未来的发展等。     

无铅再流焊接PBGA空洞缺陷研究

随着密间距BGA、CSP器件的大量应用,该类器件在焊接中的空洞问题也越来越受到人们的重视.而无铅制程的导入使得这一问题表现得更加突出.基于对多个实际案例的解剖、分析、试验的统计数据基础上,对产品生产过程中所发生的PBGA、CSP的空洞现象进行了分类归纳.并一一研究了其形成机理、影响因素及抑制对策.