Catalytic and kinetic spectrophotometric method for determination of vanadium(V) by 2,3,4-trihydroxyacetophenonephenylhydrazone

A new catalytic and kinetic spectrophotometric method for the determination of vanadium(V) was studied using 2,3,4-trihydroxyacetophenonephenylhydrazone (THAPPH) as an analytical reagent. The present method was developed on the catalytic effect of vanadium on oxidation of THAPPH by hydrogen peroxide in hydrochloric acid–potassium chloride buffer (pH = 2.8) at the 20th minute. The metal ion has formed 1:2 (M:L) complex with THAPPH. Beer’s law was obeyed in the range 20–120 ng/mL of V(V) at λ_max 390 nm. The sensitivity of the method was calculated in terms of molar absorptivity (1.999 × 10⁵ L mol⁻¹cm⁻¹) and Sandell’s sensitivity (0.000254 μg cm⁻²), shows that this method is more sensitive. The standard deviation (0.0022), relative standard deviation (0.56%), confidence limit (±0.0015) and standard error (0.0007) revealed that the developed method has more precision and accuracy. The stability constant was calculated with the help of Asmu’s (9.411 × 10⁻¹¹) and Edmond’s & Birnbaum’s (9.504 × 10⁻¹¹) methods at room temperature. The interfering effect of various cations and anions was also studied. The present method was successfully applied for the determination of vanadium(V) in environmental and alloy samples. The method’s validity was checked by comparing the results obtained with atomic-absorption spectrophotometry and also by evaluation of results using F-test.     

从专利角度探讨Sn-Zn无铅焊料研究现状

无铅焊料的研发及专利权的保护是我国电子行业亟待解决的问题。文中结合中国专利权的特点,描述了世界各国在无铅焊料专利上的竞争以及Sn-Zn无铅焊料的专利申请状况,并据此分析了Sn- Zn无铅焊料的研发及应用状况、专利Sn-Zn无铅焊料的特点以及应用障碍,以期对我国自主知识产权的Sn-Zn无铅焊料的研发及无铅专利保护有所帮助。     

光电子显微术的原理和应用

近十年来,光电子显微技术取得了长足进步并已商业化。光电子显微是一种高衬度的成像技术,对材料表面电子结构高度敏感。本文介绍光电子显微镜的成像原理,并着重分析其衬度机制。简要总结光电子显微术在表面结构分析,表面化学,磁学,以及半导体器件表征等方面的应用。目前光电子显微术的两个重要发展方向是利用同步辐射光源和脉冲激光光源做激发源;利用脉冲激光的多光子激发光电子显微术可以对较高功函数（大于光子能量）的材料成像;而脉冲时间分辨光电子显微术可用来研究表面瞬态电子的弛豫动力学机制。文章介绍了在实现飞秒时间分辨以及多光子激发的光电子显微方面的进展。我们利用多光子光电显微术对溅射制备的纳米结构银薄膜表面进行成像,结果表明多光子成像照片上存在一些高强度的亮点,而在单光子成像照片未观察到类似现象。推测这些亮点源于纳米结构银表面的等离子激元的高局域选择性激发。文章还介绍了利用光电子显微术原位观察CuZnAl形状记忆合金的热诱导相变。     

微量元素添加对多元Sn-Bi系焊料合金组织与性能的影响

传统焊料合金由于熔点温度高,不能满足部分有机基板、温度敏感器件以及3D封装等多层封装形式的低温封装要求.以Sn-Bi合金为基体,通过添加微量Ag、Cu、Co和Ni元素形成新型多元合金,对多元合金的熔化性能、润湿性能、微观组织和力学性能进行研究.结果 表明:微量元素的添加(质量分数0～1％)对多元Sn-Bi系合金的固相线...     

Effects on the evolution of microstructure and properties of low-silicon cast aluminum alloys in service

ABSTRACT

The microstructure evolution and property change of four kinds of low silicon cast aluminum alloy exposed to heat for 0–50?h at 200°C were studied by means of Brinell hardness test, tensile property test, friction and wear property test and XRD analysis. The results show that with increasing thermal exposure time, the tensile strength of each group of samples decreased and the amount of wear increased. The tensile strength of samples with more Si content decreased slowly. When the time increased to 50?h, the increase of wear loss was the largest. The hardness of samples after thermal exposure increases compared with that before thermal exposure. The residual stress of (311) diffraction crystal surface of AlSi3.5Mg0.66 under different thermal exposure time was measured. The type of residual stress changed from residual tensile stress to residual compressive stress after thermal exposure. There is an abnormal phenomenon that the hardness of the sample increased and the amount of wear increased, and it is evident that the distribution of residual stress was inhomogeneous after thermal exposure. It is found that with increasing thermal exposure time to 50?h, the average lattice distortion ε of the low-index crystal plane and the high-index crystal plane in the aluminum alloys gradually increased.     

二甲基甲酰胺中电沉积制备钐钴合金

稀土;恒电位电沉积;柠檬酸;二甲基甲酰胺中电沉积制备钐钴合金     

Photoelectron spectroscopy study of Pb/Ag(1 1 1) in the submonolayer range

The vacuum deposition of Pb onto Ag(1 1 1) gives rise to two different surface structures depending on coverage and deposition temperature. At room temperature (RT), low energy electron diffraction (LEED) reveals a sharp reconstruction completed at 1/3 Pb monolayer (ML). Beyond, a close-packed Pb(1 1 1) incommensurate overlayer develops. At low temperature (LT, ∼100 K) the incommensurate structure is directly observed whatever the coverage, corresponding to the growth of close-packed two-dimensional Pb(1 1 1) islands. Synchrotron radiation Pb 5d core-level spectra clearly demonstrate that in each surface structure all Pb atoms have essentially a unique, but different, environment. This reflects the surface alloy formation between the two immiscible metals in the reconstruction and a clear signature of the de-alloying process at RT beyond 1/3 ML coverage.     

A molecular dynamics study on melting point and specific heat of Ni<Subscript>3</Subscript>Al alloy

Using the Embedding Atom Method (EAM) for highly undercooled Ni₃Al alloy, the melting point and the specific heat were studied by a molecular dynamics simulation. The simulation of melting point was carried out by means of the sandwich method and the NVE ensemble method, and the results show a good agreement, whereas are larger than the experimental value of 1663 K. This difference is attributed to the influence of surface melting on experimental results, which causes the smaller measurements compared with the thermodynamic melting point. The simulated specific heat of Ni₃Al alloy weakly and linearly increases with the increase of undercooling in the temperature range from 800 K to 2000 K. Supported by the National Natural Science Foundation of China (Grant No. 50395101)     

Laser polishing of additive manufactured Ti alloys

Laser-based additive manufacturing has attracted much attention as a promising 3D printing method for metallic components in recent years. However, surface roughness of additive manufactured components has been considered as a challenge to achieve high performance. In this work, we demonstrate the capability of fiber laser in polishing rough surface of additive manufactured Ti-based alloys as Ti-6Al-4V and TC11. Both as-received surface and laser-polished surfaces as well as cross-section subsurfaces were analyzed carefully by White-Light Interference, Confocal Microscope, Focus Ion Beam, Scanning Electron Microscopy, Energy Dispersive Spectrometer, and X-ray Diffraction. Results revealed that as-received Ti-based alloys with surface roughness more than 5 µm could be reduce to less than 1 µm through laser polishing process. Moreover, microstructure, microhardness and wear resistance of laser-polished zone was investigated in order to examine the thermal effect of laser polishing processing on the substrate of additive manufactured Ti alloys. This proof-of-concept process has the potential to effectively improve the surface roughness of additive manufactured metallic alloy by local polishing method without damage to the substrate.