光致折射效应中空间电荷场建立过程的研究

本文推导了包含自衍射及非线性吸收影响、用以描述空间电荷场建立过程的微分方程组,阐明了周期性的空间电荷场与光强干涉条纹之间的相位差在建立过程中所起的作用,并推导了描述条纹倾斜和弯曲的微分方程。通过数值计算找到了硅酸铋(BSO)晶体中能量转移的规律,讨论了材料特性对过程快慢的影响,提出了用CW激光来探讨瞬态过程快慢的可能性。     

光滑激光脉冲作用下的强场自电离

本文研究了光滑激光脉冲作用下包含高阶离化的强场自电离过程,导出了其中的基本方程,得到了基态布居和光电子谱的一系列解析表达式。讨论了指数增长脉冲作用时的具体结果,发现高能谱比低能谱更能呈现出光电子谱在脉冲光作用下特有的多峰分裂。     

从困惑中解脱出来

 我是一个农民,曾考上西安交大电信系.由于患严重的风湿性心脏病和眼睛高度近视,体检没过关,未能上大学,回村后,自修理论物理,物理学史,自学英语、俄语、日语、德语、法语,能凭借词典阅读这几种文字的科学资料.我家地处川北山乡,交通不便,信息闭塞,图书资料匮乏,自身贫病交加,生活和学习十分困难.1988年10月,我从《国内报刊简明目录》上知道新创刊的《现代物理知识》,便订了一份.两年来,我是此杂志的热心读者.她以严谨的科学性、丰富的知识性,五光十色的趣味性,改变了我个人生活.为了研究物理学,我已决定终身不结婚,而《现代物理知识》就成了我的终身伴侣.她     

自集成透镜InGaAsP／InPDHLED及其离子束铣技术

本文报道在国内首次采用离子束铣技术研制自集成透镜InGaAsP/InP DH LED的实验结果。采用烘烤正性光致抗蚀剂来形成球状掩膜适合于离子束铣,且重复性很好。为了获得光洁的刻蚀表面,刻蚀条件均已最优化。     

布尔函数的对偶性和线性点

本文主要讨论了部分自对偶和部分反自对偶函数、部分线性函数以及具有线性点的函数的性质。     

Self-Mixing Interference in Dual-Polarization Microchip Nd：YAG Lasers

The self-mixing interference in dual-polarization microchip Nd: YA G lasers is demonstrated. Under optical feedback, the orthogonal polarization components of the laser would undergo antiphase intensity modulations; at high feedback level, the polarization switching appears. We also observe that the laser self-mixing sensitivity changes periodically with the frequency difference of orthogonal polarizations. An initial theoretical model is put out and agrees well with the experiments. The results are useful for self-mixing sensitivity enhancement and offer a new way of absolute distance measurement.     

Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface

We report a new approach for the self-assembly of cuboid micro-parts onto Si substrates to construct three-dimensional microstructures. To perform assembly, the Si substrates are prepared with a deep cavity array as binding sites. An aggregate composed of hundreds of uniformly aligned micro-parts is formed at the C10F18-H2O interface. The micro-parts are arranged by passing the substrate through the aggregate of micro-parts, thus the micro-parts are left on the substrate, and then the substrate is vibrated ultrasonically in the solution, making it possible for the micro-parts to fall into the cavities on the substrate. Finally the substrate is pulled out of the solution after assembly. This technique could give a high yield of up to 70%, providing a new method for micro-assembly.