GaAlAs红外发光二极管1/f噪声研究

在宽范围偏置条件下,测量了GaAlAs红外发光二极管（IRLED）的低频噪声,发现1／f噪声幅值与偏置电流If^γ的r次方成正比,在小电流区,r≈1。在大电流区r≈2。建立了一个GaAlAs IRLED的1／f噪声模型,得到与实验一致的定性结果。基于该模型的分析表明．低电流区GaAlAs IRLED的1／f噪声源于体陷阱对非平衡载流子俘获和发射导致的扩散电流涨落,高电流区的1／f噪声源于结空间电荷区附近氧化层陷阱对该处表面势的调制而引起载流子表面复合速率的涨落。该研究结果为1／厂噪声表征GaAlAs IRLED的可靠性提供了实验基础与理论依据。     

硅基HgCdTe光伏器件的暗电流特性分析

对硅基HgCdTe中波器件进行了变温电流电压特性的测试和分析.测量温度从30K到240K,得到R0对数与温度的1000/T的实验曲线及拟合结果.同时选取60K、80K及110K下动态阻抗R与电压V的曲线进行拟合分析.研究表明在我们器件工作的温度点80K,零偏压附近主要的电流机制是产生复合电流和陷阱辅助隧穿电流.要提高器件的水平,必须降低陷阱辅助隧穿电流和产生复合电流对暗电流的贡献.     

单晶生长用AlN粉料的烧结提纯工艺实验研究

使用自主研发的钨系统中频感应加热炉对AlN粉料进行了烧结提纯处理实验,并用XRD、SEM、IGA和GDMS等表征方法分析了烧结后的样品.实验发现,高温(2 250℃)长时间(50 h)烧结提纯工艺效果显著,但AlN粉料损耗高达47.37％;而低温(小于2 000℃)分段式短时间(每段10h)烧结提纯工艺粉料损耗低于2％,但是提纯效果一般.通过对实验结果的综合分析,提出了一种AlN粉料烧结提纯的改进工艺,最终得到了氧含量仅238 ppm、碳含量135 ppm的高质量AlN单晶生长原料,并且显著增加了原料的利用率.     

Linear and Nonlinear Optical Absorptions of a Donor Impurity in Spherical Quantum Dots

An investigation of the optical properties of a hydrogenic donor in spherical parabolic quantum dots has been performed by using the matrix diagonalization method. The optical absorption coefficient between the ground （L = 0） and the first excited state （L = 1） have been examined based on the computed energies and wave functions. The results are presented as a function of the incident photon energy for the different values of the confinement strength. These results show the effects of the quantum size and the impurity on the optical absorption coefficient of a donor impurity quantum dot.     

Polaron in Bose-Einstein-Condensation System

We consider the motion of an impurity in a Bose-Einstein condensate system at T = 0 K with the contact interaztions for boson-boson and boson-impurity. Under the forward-scattering approximation, we obtain a Fr6hlich-like Hamiltonian for this system, which means that a polaron can be formed. The effective mass, the phonon number and the energy to form a polaron are obtained. We also discuss the validity of the forwardscattering approximation for this system.     

Simulation of plasma doping process by using the localized molecular dynamics method

Plasma doping is the candidate for semiconductor doping. Accurate simulation of the doping technology is needed for the advanced integrated circuit manufacturing. In this paper, the plasma doping process simulation is performed by using the localized molecular dynamics method. Models that involve the statistics of the implanted compositions, angles and energies are developed. The effect of the model on simulation results is studied. The simulation results about the doping concentration profile are supported by experimental data.     

杂质P对α-Fe中刃型位错上扭折电子结构的影响

利用离散变分方法和DMol方法，研究了P对bcc Fe中［100］(010)刃型位错上扭折电子结构的影响，计算了杂质偏聚能、原子间相互作用能、电荷密度及态密度.计算结果表明：微量P引入体系后，电荷发生了重新分布，P原子得到电子，其周围Fe原子失去电子，由于P原子的3p轨道与近邻Fe原子的3d4s4p轨道之间杂化，使P原子与近邻Fe原子间有较强的相互作用，不利于扭折的迁移，使位错运动受阻，有利于材料强度的提高.同时，杂质P原子与基体原子间的成键主要是d，p轨道起作用，使得它们之间的成键有较强的方向性，有可能     

高纯锗中浅受主的光热电离光谱

在液氦温度附近, 运用傅里叶变换光谱以及与之相连的磁光光谱系统, 对室温电阻率约为50Ω·cm的p型高纯锗样品进行了高灵敏度的光热电离光谱的研究.从实验上确定了高纯锗样品中浅杂质光热电离的最佳温度范围, 在该温度范围内测量了样品的光热电离光谱, 指出该样品中主要杂质为浅受主硼与铝. 对杂质谱线发生分裂的两种原因, 补偿性杂质导致的快速复合以及随机应力等, 进行了分析讨论.     

Characteristics of Sn-Doped Ge2Sb2Te5 Films Used for Phase-Change Memory

Sn-doped Ge2Sb2Te5 thin films deposited on Si（100）/SiO2 substrates by rf magnetron sputtering are investigated by a differential scanning calorimeter, x-ray diffraction and sheet resistance measurement. The crystallization temperatures of the 3.58 at.%, 6.92 at.% and 10.04 at.% Sn-doped Ge2Sb2Te5 thin films have decreases of 5.3, 6.1 and 0.9℃, respectively, which is beneficial to reduce the switching current for the amorphous-to-crystalline phase transition. Due to Sn-doping, the sheet resistance of crystalline Ge2Sb2Te5 thin films increases about 2-10 times, which may be useful to reduce the switching current for the amorphous-to-crystalline phase change. In addition, an obvious decreasing dispersibility for the sheet resistance of Sn-doped Ge2Sb2Te5 thin films in the crystalline state has been observed, which can play an important role in minimizing resistance difference for the phase-change memory cell element arrays.