微波灰化/DUO-ICP-AES测定残渣燃料油中的铝、硅、钒

采用微波灰化技术消解残渣燃料油,用全谱直读DUO-ICP-AES同时测定残渣燃料油中的铝、硅、钒,优化了仪器工作参数和实验条件.结果表明,在质量浓度0 ～25.0 mg/L范围内铝、硅、钒的线性关系良好(r=0.999 70 ～0.999 99),检出限、回收率和相对标准偏差分别为0.005 ～0.050 mg/L、8...     

基于高维空间几何信息学的遥感图像去薄云算法

遥感图像中薄云的存在为遥感图像的判读带来了极大的影响,本文针对遥感图像中的薄云雾提出了一种基于高维空间几何信息学(High-Dimensional Space Geometrical Informatics)(HDSGI)的去云的新算法.基于HDSGI理论,将一副带有薄云的遥感图像作为高维空间中的一点,通过各向同性滤波...     

盐酸胍在阻挡层化学机械抛光中对速率选择性及表面形貌的影响

We propose an alkaline barrier slurry containing guanidine hydrochloride（GH） and hydrogen peroxide.The slurry does not contain any corrosion inhibitors, such as benzotriazole（BTA）. 3-inch samples of tantalum copper and oxide were polished to observe the removal rate. The effect of GH on removal rate selectivity along withhydrogenperoxidewasinvestigatedbycomparingslurrycontainingGHandH2O2withslurrycontainingonly GH. Details about the tantalum polishing mechanism in an alkaline guanidine-based slurry and the electrochemical reactions are discussed. The results show that guanidine hydrochloride can increase the tantalum polishing rate and the selectivity of copper and barrier materials. The variation of the dishing and wire line resistance with the polishing time was measured. The dishing value after a 300 mm pattern wafer polishing suggests that the slurry has an effective performance in topography modification. The result obtained from the copper wire line resistance test reveals that the wire line in the trench has a low copper loss.     

Alkaline barrier slurry applied in TSV chemical mechanical planarization

We have proposed a TSV （through-silicon-via） alkaline barrier slurry without any inhibitors for barrier CMP （chemical mechanical planarization） and investigated its CMP performance. The characteristics of removal rate and selectivity of Ti/SiO2/Cu were investigated under the same process conditions. The results obtained from 6.2 mm copper, titanium and silica show that copper has a low removal rate during barrier CMP by using this slurry, and Ti and SiO2 have high removal rate selectivity to Cu. Thus it may be helpful to modify the dishing. The TSV wafer results reveal that the alkaline barrier slurry has an obvious effect on surface topography correction, and can be applied in TSV barrier CME     

新型碱性精抛液对300mm铜膜全局平坦化的影响

The copper removal rate and uniformity of two types copper slurries were investigated, which was performed on the 300 mm chemical mechanical planarization （CMP） platform. The experiment results illustrate that the removal rate of the two slurries is nearly the same. Slurry A is mainly composed ofa FA/OI1 type chelating agent and the uniformity reaches to 88.32%. While the uniformity of slurry B is 96.68%, which is mainly composed of a FA/OV type chelating agent. This phenomenon demonstrates that under the same process conditions, the uniformity of different slurries is vastly different. The CMP performance was evaluated in terms of the dishing and erosion values. In this paper, the relationship between the uniformity and the planarization was deeply analyzed, which is mainly based on the endpoint detection mechanism. The experiment results reveal that the slurry with good uniformity has low dishing and erosion. The slurry with bad uniformity, by contract, increases Cu dishing significantly and causes copper loss in the recessed region. Therefore, the following conclusions are drawn： slurry B can improve the wafer leveling efficiently and minimize the resistance and current density along the line, which is helpful to improve the device yield and product reliability. This investigation provides a guide to improve the uniformity and achieve the global and local planarization. It is very significant to meet the requirements for 22 nm technology nodes and control the dishing and erosion efficiently.     

TEA CO2激光去除光纤涂敷层的实验研究

采用波长为10.6μm的高能TEA CO2激光去除SMF28光纤涂敷层,研究了激光脉冲数和能量密度与涂敷层去除效果之间的关系.实验证明,涂敷层去除厚度随激光能量密度的增加成对数增长,且在某个范围内去除效果存在一个最佳值.     

基于小波变换的核磁共振图像去噪方法

核磁共振图像(MRI)在医学诊断上具有重要的意义，但由于受成像方法限制，图像中一些重要的信息常被噪声所淹没，因此对核磁共振图像进行去噪处理是十分必要的。利用基于小波多尺度分解闲值去除MRI图像噪声可以取得较好的效果。在闲值选取上是根据小波分解后每层的特性，对各层分别选取，将此方法与基于Donoho软阈值去噪进行对比，发现此方法可以有效降低噪声，同时比较好地保持图像细节。     

像增强器视场缺陷检测方法研究

在数字式像增强器性能综合检测系统的基础上，研究了像增强器视场缺陷的检测方法。通过数字视频摄像机采集缺陷图像，利用数字图像处理方法确定缺陷性质，缺陷处理算法基于图像灰度特征而不是边缘特征提取。该方法适用于对检测对象有具体量化和定位要求，而不是简单的只有数量和形状特征要求的场合。实验表明，该检测方法能够较准确地检测像增强器的缺陷。     

微纳米颗粒的激光去除

微纳米颗粒的去除是半导体、微电子、微型机械、精密光学等高新技术中的关键问题,而常规清洗方法难以有效去 除。近年来国际上发展的DLC、SLC激光去除方法非常有效,本文对DLC、SLC的实验方法、去除机制、影响因素和规律等进 行综述,指出了存在的问题。     

用稻草黄原酸酯净化锌液的新方法

以稻草为主要原料制成重金属离子吸附剂，用来除去立德粉厂锌浸取液中的Cd^2 ,Ni^2 等离子，考察了溶液的PH值，吸附剂用量，反应时间和温度对杂质去除效果的影响。浸取液经处理后，Cd^2 ,Ni^2 的浓度分别从1086mg/L和15.4mg/L降至0.56mg/L和0.54mg/L，浸出液中锌的损失大约1％。