OC门限流电路在串励电机控制中的研究

针对传统的以霍尔加磁环对电机电流进行检测再保护的电流限制的方法,提出了0C门硬件限流电路,该电路突破了传统的思路,不对电流进行采样,直接通过硬件电路对电机电流进行限州保护,即以设定的最大电流通过开关管所产生的压降作为0C门电路的参考值,以实际电流通过开关管所产生的压降作为比较值与参考值进行比较。当实际电流大于设定的最大电流时,0C门电路的输出关闭驱动开关管的控制电路,从而关断开关管,反之,当实际电流小于最大电流时,开关管正常工作,从而实现了对过电流进行快速的限制保护,确保了保护电路中的电流不会超过设定的最大电流。应用结果表明,该电路具有响应时间短,控制精度高,成本低等特点。所以其具有较高的应用推广价值。     

GaAs MMIC MESFET混频器性能比较

给出了几种 Ga As MESFET单片混频器结构与芯片测试结果比较。实验表明 ,在相同本振功率激励下 Ga As MMIC双栅混频器具有良好变频特性 ,栅混频器指标次之 ,漏混频器结构最简单 ,但变频特性不如前两种。另外 ,单片巴仑双平衡混频器具有高的动态范围和宽频段工作特点。     

Analysis of 3D NAND technologies and comparison between charge-trap-based and floating-gate-based flash devices

NAND flash chips have been innovated from two-dimension (2D) design which is based on planar NAND cells to three-dimension (3D) design which is based on vertical NAND cells. Two types of NAND flash technologies–charge-trap (CT) and floating-gate (FG) are presented in this paper to introduce NAND flash designs in detail. The physical characteristics of CT-based and FG-based 3D NAND flashes are analyzed. Moreover, the advantages and disadvantages of these two technologies in architecture, manufacture, interference and reliability are studied and compared.     

RS（255，247）译码器的FPGA实现

RS码是差错控制领域中一类重要的线性分组码,由于其出众的纠错能力,因而被广泛地应用于各种差错控制系统中,以满足对数据传输通道可靠性的要求。利用现场可编程门阵列（FPGA）技术由VHDL语言来实现RS（255,247）译码方案并应用于一种大容量的存储设备以提高数据传输和存储的可靠性。对所设计的硬件系统在ISE10．1平台上用VHDL进行了行为仿真和时序仿真,并给出了仿真波形图。     

高k电介质及其设备

"2007年11月,英特尔量产高k电介质45nm微处理器"。它表明高k电介质/金属栅极技术已商业化。它可确保摩尔定律至少再延续10年。但是,ITRS2006修正版指出,高k电介质/金属栅极在低静态功耗(LSTP)逻辑IC的预期应用时间是2008年,高k电介质/金属栅极在高性能和低功耗(LOP)IC的预期应用时间是2010年。制造高k电介质的设备是化学气相沉积(CVD)或原子层沉积(ALD)设备。制造金属栅极的设备是物理气相沉积(PVD)和ALD设备。     

SiO2 gate insulator defects,spatial distributions,densities, types,and sizes

Standard IC processes, as well as those involving the use of ionizing radiation, such as x-ray lithography etc., result in the generation of bulk defects, and interface states in the gate insulator, or underlying substrate, respectively, of insulated gate field effect transistors. Bulk defects are believed to be present as positively and negatively charged electron and hole traps, respectively, as well as neutral hole and “large” and “small” neutral electron traps. This paper provides a perspective of the current state of knowledge about the spatial distributions of large bulk defects, their areal densities, sizes, possible interrelationships among them, and the special cases of defects created by ion implanted silicon and oxygen, where knock-on effects have been simulated. It appears that bulk defects may all have their origin in neutral hole traps, (so-called E′ centers) and that when the insulator thickness is decreased to about 6-7 nm, defects are either no longer present, or, more likely, are incapable of trapping charge at room temperature because trapped carriers can either tunnel to one of the interfaces, or be annihilated by a reverse process. It appears possible also that the precursor of the several types of defects only forms at a “grown” silicon-silicon oxide interface. In theory, this would make it possible to grow defect free insulators by a combination of deposition and oxidation processes.     

全离子注入C波段功率单片放大器及内匹配功率单片放大器

报道了全平面C波段功率单片放大器及四单片合成放大器研究结果。单片放大器采用全离子注入工艺，均匀性好，平均成品率40％，可靠性高。工作频率4．7—5．2GHZ，中心频率5．0GHz处输出功率2．5W，增益15dB，功率附加效率31．5％。单片放大器芯片面积2．8mm×2．0mm，四路合成的4×MMIC频率范围不变，中心频率4．95GHz处输出功率8．2W，增益13dB，功率附加效率26％，四路合成效率接近80％。实验结果与理论预测基本吻合。     

Determination of the in-plane anisotropy field in hexagonal systems via rotational magnetization: Theoretical model and Monte Carlo simulations

The magnetic anisotropy field in thin films with in-plane uniaxial anisotropy can be deduced from the VSM magnetization curves measured in magnetic fields of constant magnitudes. This offers a new possibility of applying rotational magnetization curves to determine the first- and second-order anisotropy constant in these films. In this paper we report a theoretical derivation of rotational magnetization curve in hexagonal crystal system with easy-plane anisotropy based on the principle of the minimum total energy. This model is applied to calculate and analyze the rotational magnetization process for magnetic spherical particles with hexagonal easy-plane anisotropy when rotating the external magnetic field in the basal plane. The theoretical calculations are consistent with Monte Carlo simulation results. It is found that to well reproduce experimental curves, the effect of coercive force on the magnetization reversal process should be fully considered when the intensity of the external field is much weaker than that of the anisotropy field. Our research proves that the rotational magnetization curve from VSM measurement provides an effective access to analyze the in-plane anisotropy constant K ₃ in hexagonal compounds, and the suitable experimental condition to measure K ₃ is met when the ratio of the magnitude of the external field to that of the anisotropy field is around 0.2. Supported by the National Natural Science Foundation of China (Grant Nos. 90505007 and 10774061) Recommended by LI FaShen     

基于蛋清栅绝缘层的高性能C_(60)有机场效应晶体管(英文)

采用生物材料(蛋清)作为栅绝缘层制备了基于C60为有源层的有机场效应晶体管。器件展现出了合理的电学特性,场效应迁移率和阈值电压分别为2.59 cm2·V-1·s-1和1.25 V。有机场效应晶体管展现良好性能的原因是蛋清具有较高的介电常数及热退火后形成的光滑表面形貌。实验结果表明,对于制备有机场效应晶体管来说,蛋清是一种有前途的绝缘层材料。     

Atomic and Electronic Structures of Traps in Silicon Oxide and Silicon Oxynitride

Silicon oxide (SiO₂) and silicon oxynitride (SiO_xN_y) are two key dielectrics used in silicon devices. The excellent interface properties of these dielectrics with silicon have enabled the tremendous advancement of metal-oxide-semiconductor (MOS) technology. However, these dielectrics are still found to have pronounced amount of localized states which act as electron or hole traps and lead to the performance and reliability degradations of the MOS integrated circuits. A better understanding of the nature of these states will help to understand the constraints and lifetime performance of the MOS devices. Recently, due to the available of ab initio quantum-mechanical calculations and some synchrotron radiation experiments, substantial progress has been achieved in understanding the atomic and electronic nature of the defects in these dielectrics. In this review, the properties, formation and removal mechanisms of various defects in silicon oxide and silicon oxynitride films will be critically discussed. Some remarks on the thermal ionization energies in connection with the optical ionization energies of electron and hole traps, as well as some of the unsolved issues in these materials will be highlighted.