基于电源、地桥的电源网络布线后优化

随着集成电路规模的不断增大,电源网络的重要性日趋显著,电源网络的分布直接影响芯片的电压降(IR-drop)。一种布线后通过在空闲处插入电源桥和地桥的方法,可以在不增加芯片面积的情况下,改善IR-drop效应。实验结果表明在芯片布局利用率不高的情况下(70~75%),该方法可以使IR-drop得到明显的优化。     

深亚微米下芯片电源网络的设计和验证

随着芯片集成度的逐渐提高,芯片单位面积所消耗的功耗也越来越大,因此,可靠的电源网络设计和验证已成为芯片设计成败的关键因素之一。在以往。集成电路（IC）设计工程师往往根据经验来设计电源网络,但工艺到0．18um,这往往会引起芯片功能失效。根据这个问题。本文首先介绍电压降（IR-Drop）和电子迁移率（Electro-migration）现象和对芯片性能的影响;其次,提出一种有效的电源网络设计和验证方法,并在芯片的物理设计初期对电源网络作可靠性估计;最后,经过椭圆曲线加密芯片（ECC＆RSA）的流片,表明采用该方法设计的芯片,工作情况良好。     

Maximum oscillation frequencies and ft sensitivities of two groups of single-VFOA active-RC oscillators

Two groups of three active-RC oscillators that use a single voltage feedback op amp (VFOA) are compared. Linear analysis using a first-order VFOA model shows that all six oscillators have the same maximum oscillation frequency (OF) of 16.67% of the op amp gain-bandwidth product (GBP), despite the fact that based on an ideal VFOA the gain required in the oscillator amplifier section is 3 for one group and 1.5 for the other.Sensitivity of OF to op amp GBP is found to be the same for both groups. Simulation results using a nonlinear VFOA macromodel give good agreement with linear analysis.