电子组装中PCBA清洗技术

清洗对于电子产品可靠性有着非常重要的影响,针对印制电路组件污染物进行了系统阐述,并对不同的清洗技术和工艺进行了总结归纳,讨论了影响清洗效果的各个因素及其检验规范,为实际生产起到了指导性作用。     

半导体制造中清洗技术的新动向

多年来习惯采用多槽浸渍式RCA清洗的半导体清洗领域里,正在兴起的是从多槽浸渍式向单片式处理转移。并出现了取代RCA法的新型清洗液与新的生产方法。正在开始对超临界流体清洗等下一代清洗技术的开发。概述这些半导体清洗技术的最新动向。     

荫罩双层清洗黑化技术的开发及应用

着重论述了彩色显像管荫罩清洗黑化工序,如何通过改进设备,优化生产工艺,达到产量翻番的目的。     

Overview of Cu contamination during integration in a dual damascene architecture for sub-quarter micron technology

A detailed study of copper contaminating steps performed during integration of multilevel Cu metallisation in dual damascene architecture has been performed. Contamination at the wafer back and the bevel edge should make it difficult to use the same equipment for conventional technology and new copper based technology. Several barrier materials have been claimed as efficient against copper diffusion. However, during process integration, contamination issues will be faced before deposition of the barrier layers. Heavy contamination can occur either during Cu chemical mechanical polishing (CMP) or during dielectric etching and via opening on top of contacted copper lines. These residues, concentrated at the dielectric surface, could result in current leakage and shorts between interconnection lines. Several cleaning solutions to remove metal contamination are reviewed and their efficiencies are compared.     

CMP后清洗技术发展历程

从80年代开始,结合当时最具代表性的CMP设备,分析当时的后清洗技术,如：多槽浸泡式化学湿法清洗、在线清洗、200mm集成清洗、300mm集成清洗及20nm以下的CMP后清洗趋势,每种后清洗技术都结合CMP设备明确分析其技术特色,优点和缺陷。全面阐述CMP工业界的后清洗发展历程。     

硅研磨片超声波清洗技术的研究

介绍了硅研磨片清洗的重要性,分析了影响硅研磨片质量的主要因素,即金属杂质和各种污染物.重点分析了硅研磨片表面沾污的原因,并且通过大量的实验分析得到了活性剂和碱性清洗液、去离子水的最佳体积比是0.20:1.00:10.0,清洗的最佳时间为3 min～5 min和最佳温度范围为40℃～50℃.     

Industrial Applications of Dimeric Surfactants: A Review

Dimeric surfactants also known as gemini surfactants have received lots of attention for high performance formulations in the various scientific and commercial products. Due to the greater amount of hydrocarbon per molecule, the critical micelle concentrations (CMC) of dimeric are typically one order of magnitude lower than the corresponding monomeric surfactant. They are ten to hundred times more efficient at reducing the surface tension of water and the interfacial tension of the oil-water interface than conventional surfactants. Besides, the Krafft temperatures of gemini surfactants with hydrophilic spacers are generally very low giving these surfactants the capacity to be used in cold water. These surfactants display a range of interesting properties, including elevated surface activity, extremely low CMC and extraordinary rheology and self-assimilation aspect. As a consequence of these properties, they have many potential applications include detergents and cleaning agents, cosmetics, textile, and dyeing, dispersion stabilization and emulsion polymerization, genetics science, pharmaceutical, and biological applications.      

An activated fluid stream – New techniques for cold water cleaning

Electrochemical, acoustic and imaging techniques are used to characterise surface cleaning with particular emphasis on the understanding of the key phenomena relevant to surface cleaning. A range of novel techniques designed to enhance and monitor the effective cleaning of a solid/liquid interface is presented. Among the techniques presented, mass transfer of material to a sensor embedded in a surface is demonstrated to be useful in the further exploration of ultrasonic cleaning of high aspect ratio micropores. In addition the effect of micropore size on the cleaning efficacy is demonstrated. The design and performance of a new cleaning system reliant on the activation of bubbles within a free flowing stream is presented. This device utilised acoustic activation of bubbles within the stream and at a variety of substrates. Finally, a controlled bubble swarm is generated in the stream using electrolysis, and its effect on both acoustic output and cleaning performance are compared to the case when no bubbles are added. This will demonstrate the active role that the electrochemically generated bubble swarm can have in extending the spatial zone over which cleaning is achieved.     

A computational simulation study on the acoustic pressure generated by a dental endosonic file: Effects of intensity,file shape and volume

One of the uses of ultrasound in dentistry is in the field of endodontics (i.e. root canal treatment) in order to enhance cleaning efficiency during the treatment. The acoustic pressures generated by the oscillation of files in narrow channels has been calculated using the COMSOL simulation package. Acoustic pressures in excess of the cavitation threshold can be generated and higher values were found in narrower channels. This parallels experimental observations of sonochemiluminescence. The effect of varying the channel width and length and the dimensions and shape of the file are reported. As well as explaining experimental observations, the work provides a basis for the further development and optimisation of the design of endosonic files.     

半导体材料加工过程的化学方法应用

在半导体材料的加工过程中,很多重要步骤都涉及到了化学作用,讨论了半导体材料加工过程中化学缓蚀、化学机械抛光和清洗步骤的化学作用原理,介绍了从化学角度分析和优化半导体加工工艺的观点。