SiO_2-CeO_2复合氧化物对硅片的抛光性能评价

用合成的S iO2-CeO2复合氧化物对单晶硅片进行抛光,测定其抛光速率与制备条件及浆料配制条件之间的关系。结果表明:经800℃煅烧后制得的硅铈摩尔比nS iO2∶nCeO2为2∶1的复合氧化物对硅片具有最大的抛蚀速率。与此同时,选用三乙醇胺和六偏磷酸钠分别作为浆料的pH调节剂和分散剂可以获得理想的浆料分散性和悬浮稳定性。确定了抛光浆料的最佳pH值和固含量分别为11和4%。     

Stabilization of gamma alumina slurry for chemical-mechanical polishing of copper

Stabilization of gamma-alumina suspension for chemical-mechanical polishing (CMP) of copper was investigated. Citric acid and poly(acrylic acid) (PAA) (M(w)=5000) were used as dispersant. The stability of suspension was evaluated from the changes in viscosity, particle size and zeta potential. It appears that metastable gamma-alumina mainly due to its high specific surface area and to the presence of aluminol groups on its surface is progressively transformed to bayerite (beta-Al(OH)(3)) by hydration procedure. Citric acid molecules were adsorbed onto gamma-alumina surface effectively and exhibited the excellent hydration inhibition effect. Although citrate-alumina surface complexes give barrier to the flocculation, the repulsion potential is based mainly on the electrostatic repulsion, thereby steric hindrance caused by the adsorption of these small molecules is very weak. The electrosteric repulsion, which provides more effective dispersion stability than electrostatic repulsion force, can be expected by using polyelectrolyte such as PAA; however, adsorbed layers of PAA onto solid/liquid interface are loosely formed. Therefore, a large amount of PAA was required to inhibit the surface hydration of gamma-alumina suspension, thereby the excess addition of PAA decreased the electrosteric repulsion and re-bridging of the dispersant between particles caused an increase in suspension viscosity. Therefore, synergistic effect can be expected in mixed dispersant system of citric acid and PAA, since small citric acid molecules are adsorbed faster than PAA, inhibiting the progress of surface hydration, and then adsorbed PAA layers exhibit the effective electrosteric repulsion interaction between particles with a small amount compared with PAA alone. It was revealed that the gamma-alumina slurry dispersed by mixed dispersant exhibited the improved removal rate of Cu layer by CMP polishing test.     

高精度中小11径非球面修抛技术研究

为实现高精度中小口径非球面的加工,介绍了一种非球面修抛技术。基于Preston假设,将抛光过程描述成一个线性方程,计算得到材料的去除量与抛光时间、抛光压力和零件转速之间的函数关系。设计了整体修抛法和环带修抛法两种方法,在数控抛光的基础上,对口径为Ф117mm的凹抛物面和口径为Ф17mm凸双曲面进行修抛,修抛后非球面的面形精度PV值为0．184μm,RMS均小于0．032μm,达到了工程化应用要求,实现了中小口径非球面的高精度加工。     

高精度棱镜的快速抛光技术

本文以加工斯米特屋脊棱镜（ △９０°＝ ±５″） 为例，阐述了实现对高精度棱镜快速抛光的意义；介绍了高精度棱镜快速抛光技术的构成及其所应具备的保证条件     

Mathematical modelling of influence functions in computer-controlled polishing: Part I

Computer-controlled polishing (CCP) is commonly used to finish high-quality surfaces, such as optical lenses. Based on magnetorheological finishing (MRF), a mathematical model to calculate the polishing tool characteristic (influence function) was developed and verified experimentally. The first part of this paper introduces the model to predict the size and shape of an influence function. The second part of this paper describes the calculation of the distribution of material removal within the size of an influence function. The model supersedes the current cumbersome procedure for determining an influence function and thus results in considerably improved and more economical manufacture. Furthermore, the model enables the quality of the final surface to be enhanced when polishing complex, for example aspherical or free-form, workpiece geometries and provides the first step in the application of time-variant influence functions.     

绿色环保化学机械抛光液的研究进展

原子级加工制造是实现半导体晶圆原子尺度超光滑表面的有效途径.作为大尺寸高精密功能材料的原子级表面制造的重要加工手段之一,化学机械抛光(chemical mechanical polishing,CMP)凭借化学腐蚀和机械磨削的耦合协同作用,成为实现先进材料或器件超光滑无损伤表面平坦化加工的关键技术,在航空、航天、微电子等众多领域得到了广泛应用.然而,为了实现原子层级超滑表面的制备,CMP工艺中常采用的化学腐蚀和机械磨削方法需要使用具有强烈腐蚀性和高毒性的危险化学品,对生态系统产生了不可逆转的危害.因此,本文以绿色环保高性能抛光液作为对象,对加工原子量级表面所采用的化学添加剂进行分类总结,详尽分析在CMP过程中化学添加剂对材料表面性质调制的作用机理,为在原子级尺度下改善表面性质提供可参考的依据.最后,提出了CMP抛光液在原子级加工研究中面临的挑战,并对未来抛光液发展方向作出了展望,这对原子尺度表面精度的进一步提升具有深远的现实意义.     

CVD金刚石化学机械抛光工艺研究

本文提出采用化学机械抛光的新工艺实现传统方法无法达到的超光滑、低损伤的表面抛光.本文在对金刚石氧化的化学热动力学研究基础上,配制了以高铁酸钾为主要氧化剂的化学机械抛光液,指出加快化学机械抛光过程金刚石氧化的工艺措施.研制了用于CVD金刚石化学机械抛光的可加热抛光头和摩擦力测量装置,着重研究了CVD金刚石的化学机械抛光工艺.试验得到最佳的抛光工艺参数:抛光压力为266.7 kPa,抛光盘转速为70 r/min,抛光头转速为23 r/min,抛光温度为50℃.化学机械抛光的摩擦系数在0.060 ～0.065范围内变化,为混合润滑状态.     

能动抛光磨盘的有限元法分析

 能动磨盘在光学抛光时随磨盘移动位置和旋转角度不同而产生不同的变形以实时与大口径被抛光工件表面实现良好的吻合。模拟了能动磨盘的工作过程，探讨了用于光学抛光的可行性。以加工直径1.5m，f1/2的抛物面光学元件为例，用有限元法对能动磨盘能够产生的变形进行了仿真计算，结果表明能动磨盘能够以较高精度产生旋转对称或非对称的二次曲面。     

氧化硅/氧化铁复合磨粒用于硬盘基片的抛光研究

本文以HNO3、NaOH、Fe(NO3)3和SiO2浆料为原料,采用沉淀法制备了1种SiO2/Fe2O3复合磨粒,通过X射线衍射仪(XRD)、飞行时间二次离子质谱仪(TOF-SIMS)和扫描电子显微镜(SEM)对其结构进行表征,结果表明Fe2O3包覆到SiO2的表面,复合粒子具有很好的分散性.用UNIPOL-1502抛光机研究了所制备复合磨粒在镍磷敷镀的硬盘基片中的抛光性能,抛光后硬盘基片的表面粗糙度Ra由抛光前的8.87nm降至3.73nm;抛光后表面形貌的显微镜观测结果表明新制备的复合磨粒表现出较好的抛光性能.     

聚氨酯抛光片在透镜高效生产中的应用

本文对聚氨酯抛光片的性能、特点作了概要介绍，在透镜生产中应用聚氨酯抛光片单块加工及成盘加工的方法分别作了讨论，以及众多的工艺因素作了较为详细的分析，介绍了常出现的光圈异常现象的排除方法，从而达到稳定、高效的目的。