Application of multiple-beam white-light fringes for measuring the refraction and dispersion of mica

Multiple-beam white-light interference fringes are applied to measure the two refractive indices of a mica sample and their dispersion across the visible spectrum. In addition, the mica birefringence and its dispersion are measured. A mica sample of dimensions 2 × 5 mm² and an immersion liquid of nearly the same refractive index are used. Only a single shot interferogram is needed to measure all the aforementioned parameters. Cauchy's and a modified single-term Sellmeier dispersion formula are used for fitting the experimental data and extracting the parameters required.     

Application of the holographic carrier fringe and FFT technique for deformation measurement

This paper describes a holographic system based on the use of fibre optics and automatic spatial carrier fringe pattern analysis. Carrier fringes are generated by simply translating the object beam between two exposures. Single-mode optical fibres are used to transfer both the object and reference beams. The fast Fourier transform method is used to process the interferograms: it extracts phase from fringe patterns resulting from the interference of tilted wavefronts. The method is illustrated by measuring the deformation of an arbitrarily clamped, uniformly loaded circular plate. The results are given for the perspective plot of the out-of-plane deformation field, the maps of wrapped and unwrapped phase, and a contour map of the unwrapped phase.     

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

There is a compelling need to experimentally understand solder joint deformation behavior at high temperatures over an extended period of time. Accordingly, the deformation behavior of solder joints in a Ceramic Ball Grid Array (CBGA) package mounted on an organic FR4 board under extended dwell time at a high temperature has been studied using laser moiré interferometry. The warpage and the in-plane horizontal deformation of the ceramic substrate and the organic board as a function of time were determined. The variation of the normal strains and shear strains in the solder joints with time were also investigated. It was found that increased sensitivity was necessary to accurately determine the strains in the small sized solder joints. A new method utilizing carrier fringes to increase the sensitivity of the moiré interferometry system is proposed and has been used to determine the strains in the small sized solder joints. Increased sensitivity can be obtained merely by changing the incident angle of the laser light on the surface of the specimen, thereby making it unnecessary to use expensive phase shifting apparatus with the traditional laser moiré system.     

The identification of fringe positions in speckle patterns

This paper two methods of identifying fringe positions in speckle patterns. The first uses local directional averaging to track fringes, while the second uses standard image processing techniques to connect the patterns into a form where the fringes can be identified.     

Analysis of the fringes visibility generated by a lateral cyclic shear interferometer in the retrieval of the three-dimensional surface information of an object

We report the evaluation of the topography of an object with projected fringes generated with a lateral cyclic shear interferometer (CSI) and we then compare the topography recovery obtained with the proposed method with the one obtained from a coordinate measuring machine (CMM). We also study how the fringes visibility along the z axis affects the retrieval. Finally, we discuss the advantages and drawbacks of this profilometry system.     

A novel raster-scanning method to fabricate ultra-fine cross-gratings for the generation of electron beam moiré fringe patterns

The resolution of the electron beam moiré method depends on the line frequency of the grating. Recently, more and more effort has been devoted to increase the frequency, and a novel method for producing high-resolution electron beam gratings is presented in this work. Cross-gratings with a frequency up to 14,832 lines/mm (67 nm pitch) were successfully fabricated using a common scanning electron microscope without a dedicated pattern generation system. The quality of the grating was high enough to produce high-quality moiré fringe patterns. In this method, the ultra-fine cross-grating can be fabricated only through one-directional scanning on the resist, which can improve the grating quality and significantly reduces the fabrication time. The number of control parameters for grating fabrication could be reduced to two compared to the six parameters required by conventional methods, which facilitates the use of the electron beam moiré method. The frequency of the fabricated grating is linearly proportional to the exposure magnification. Thus, the frequency of the grating can be accurately predetermined, and the null field can be easily obtained in the electron beam moiré method. The quality of the fabricated gratings was illustrated by the obtained micrographs and moiré fringe patterns. The full-field local strain near an induced crack was studied to verify the application potential of this method.