Mode beating in spot-size converter lasers

An anomalous modulation in the wavelength spectrum has been observed in lasers with spot-size converters. This intensity modulation is shown to be caused by beating between the fundamental lasing mode and radiation modes in the taper. This results in a periodic modulation in the net gain spectrum, which causes wavelength jumps between adjacent net gain maxima, and a drive current dependent spectral width that is expected to affect system performance. The amplitude of this spectral modulation is reduced significantly by either using an angled rear-facet which reflects the beating radiation modes away from the laser axis, or by using a nonlinear, adiabatic taper.     

抽运激光在光靶中的局域及其对X射线激光特性的影响

新型X射线靶设计为:由SiO2和TiO2组成具有12个周期的一维光子晶体,在它的中间嵌入光靶材料层作为缺陷层,SiO2,TiO2和光靶层的光学厚度分别为λ4、λ4和λ2,λ为抽运激光波长.与普通平板光靶相比,当抽运光垂直照射到这种光靶时,靶层内部的光强将提高2个数量级,所以抽运激光的阈值强度将降低2个数量级,这有利于X射线激光的小型化.在同样的抽运激光照射下,X射线激光的强度将提高4个数量级,转换效率也将提高约4个数量级.由于平均电离度随抽运激光强度的提高而提高,所以采用这种光靶有利于使X射线激光向短波长推进. 关键词： X射线激光 光子晶体 光波局域     

碳纳米管锁模双包层光纤激光器的实验研究

本文采用双包层掺镱光纤作为增益介质,用单壁碳纳米管作为饱和吸收体,获得最高输出功率为336 mW的锁模脉冲激光.用飞秒激光诱导水击穿法直接在单模光纤上制备出D形区,通过在D形光纤上滴涂单壁碳纳米管溶液,成功制备出碳纳米管饱和吸收体,并对其饱和吸收特性进行测试,发现其调制深度为27％.利用该饱和吸收体作为锁模器件,制备出具有环形腔结构的锁模光纤激光器.当抽运功率为4W时,获得了脉宽为93.8 fs,中心波长为1083.8 nm,3 dB谱宽为8.6 nm,重复频率为5.59 MHz,平均功率为336 mW的飞秒脉冲激光输出.     

888 nm LD抽运Nd∶YVO4被动锁模皮秒振荡器

报道了基于888 nm半导体抽运Nd∶YVO4晶体连续被动锁模的皮秒振荡器。通过热激发抽运方式改善激光器的热性能,提高锁模振荡器输出的平均功率与单脉冲能量。利用半导体可饱和吸收体(SESAM)实现激光器锁模运转的启动与维持。在抽运功率为60 W时,获得最大输出功率为15 W,重复频率为53 MHz的皮秒脉冲输出,光-光转换效率为24%。在输出功率为15 W时脉冲宽度为45 ps。     

一种基于布拉格反射波导的表面等离子体激光光源（英文）

设计了一种基于布拉格反射波导的新型表面等离子体激光光源。这种光源结构简单,便于集成,可以在室温电泵浦的条件下工作,同时可以输出约毫瓦量级的表面等离子激光,相比于文献报道中纳米尺度的纳瓦级表面等离子体激光光源要高很多。该表面等离子体激光光源发射波长为808 nm,布拉格反射波导所提供的倾斜激光光线在我们设计的准Otto模型中可以直接耦合成为表面等离子体。     

10 GHz可调谐主动锁模光纤环形激光器研究

采用主动锁模技术 ,在光纤环形激光器中实现了脉冲重复率为 10GHz、脉冲宽度为 10ps、线宽为 0 171nm的激光输出 ,波长调谐范围达 37 8nm。实验结果表明 ,主动锁模光纤激光器由于其输出脉冲窄、脉冲啁啾小、波长调谐方便及与光纤系统兼容等优点 ,有望成为未来超高速光通信系统中的理想光源。     

基于半导体环形激光器的高速双向双信道混沌保密通信

提出了一种利用半导体环形激光器(SRLs)的新型高速双向、双信道混沌保密通信系统. 在该系统中, 首先利用交叉双光反馈对驱动激光器的顺时针模式和逆时针模式的混沌延时特征进行抑制. 然后将此混沌信号注入到一对响应激光器对应的顺时针模和逆时针模中, 以实现带宽的增强及混沌同步. 最后基于响应激光器之间的混沌同步, 实现高速率、双向、双信道的混沌保密通信. 通过对驱动激光器在交叉双光反馈作用下的混沌特性、以及响应激光器在不同条件下的同步特性进行了相关理论和仿真研究, 结果表明: 驱动激光器在合适的交叉双光反馈作用下可以产生延时特性被良好隐藏的顺时针模式和逆时针模式混沌信号; 在该混沌信号的注入下, 响应激光器输出的混沌信号带宽可以得到明显增强; 通过设置合适注入强度值和频率失谐值, 响应激光器之间可实现高质量的等时混沌同步. 最后, 对系统的双向、双信道混沌保密通信特性进行了讨论. 当10 Gbit/s信号传输距离为10 km时, 解调信息Q因子值仍可保持在6以上.     

共振线俘获对碰撞激发X光激光增益特性的影响

 以类氖-锗离子为例,用逃逸概率方法研究了共振线俘获效应对电子碰撞激发X光激光增益特性的影响。对波长为19.6nm,23.2nm和23.6nm等三条激光线,讨论了增益特性对增益区宽度ΔR和介质速度梯度dV/dZ的依赖关系.     

Enhancing visibility through fog

A technique is proposed for enhancing visibility through dense fog. The technique assumes that retroreflecting elements are present in the field obscured by fog. An infrared laser beam scans the scene and the retroreflected light is focused, detected and suitably employed to obtain an instant picture of all retroreflectors facing the point of observation. The first experimental results are encouraging.     

Cutting by a high power laser at a long distance without an assist gas for dismantling

As the applications of laser processing progress, new fields of use are being investigated, including dismantling with power lasers. To fulfil our dismantling requirements we propose a new laser method that we have called the laser dismantling (LD) process. This cutting method uses a high-power laser at a long distance, without an assist gas, and with a focal length of the system of 1 m to 10 m. Precision and accuracy in the process are not the same as for laser cutting for production and assembly. The first application of the laser dismantling process, on which we demonstrate our method, is the dismantling of obsolete nuclear plants with remote controlled, or automatic, robots in irradiated environments. For our demonstrator, the beam from a Nd:YAG laser was focused by a multimode optical fibre. The objectives of this paper are: to discuss the criteria for determining the theoretical feasibility of LD; to discuss issues related to future industrial implementation by introducing the process's basic principles; and to compare LD with classical laser processing, which differs not only in the consideration of cutting quality and speed, but also in the cutting irregularities that could be accepted.