粉末粒度离散性对NdFeB磁性能的影响

制备了一种NdFeB永磁材料,探讨了制粉前处理方式对粉末离散性、粒径及成品NdFeB永磁体结构与性能的影响。原材料经熔炼、粗破碎后,采用高速风选和高压氢爆2种制粉前处理方式,然后采用同样的成型、烧结和回火工艺制备得到(PrNd)32.3Nb0.70Al0.60Cu0.20B1.03Fe65.17合金,并系统研究了该合金的显微结构和磁性能。结果表明:高压氢爆处理后得到的粉末粒度呈单分散性,粉末粒径较细,所制备得到的磁体样品的微观结构均匀性也较好;高压氢爆处理后制得的磁体样品剩余磁通密度比高速风选制粉方式得到的磁体样品高0.047 T,内禀矫顽力高 193.4 kAm－1,最大磁能积高24.6 kJm－３。     

ZnO nanorod arrays with tunable size and field emission properties on an ITO substrate achieved by an electrodeposition method

In the present work,vertically aligned ZnO nanorod arrays with tunable size are successfully synthesized on nonseeded ITO glass substrates by a simple electrodeposition method.The effect of growth conditions on the phase,morphology,and orientation of the products are studied in detail by X-ray diffraction(XRD),scanning electron microscopy(SEM),and transmission electron microscopy(TEM).It is observed that the as-prepared nanostructures exhibit a preferred orientation along c axis,and the size and density of the ZnO nanorod can be controlled by changing the concentration of ZnCl2.Field emission properties of the as-synthesized samples with different diameters are also studied,and the results show that the nanorod arrays with a smaller diameter and appropriate rod density exhibit better emission properties.The ZnO nanorod arrays show a potential application in field emitters.     

Mn4+掺杂对BiFeO3陶瓷微观结构和电学性能的影响研究

利用传统的固相反应法制备了BiFe_1-xMn_xO₃ (x= 0-0.20)陶瓷样品, 研究了不同Mn⁴⁺掺杂量对BiFeO₃陶瓷密度、物相结构、显微形貌、 介电性能和铁电性能的影响.实验结果表明:所制备的BiFe_1-xMn_xO₃ 陶瓷样品的钙钛矿主相均已形成,具有良好的晶体结构, 且在掺杂量x=0.05附近开始出现结构相变.随着Mn⁴⁺添加量的增加, 体系的相结构有从菱方钙钛矿向斜方转变的趋势,且样品电容率大幅度增大, 而介电损耗也略有增加;在测试频率为10⁴ Hz条件下, BiFe_0.85Mn_0.15O₃ (ε_r=1065)的 ε_r是纯BiFeO₃ (ε_r=50.6)的22倍; 掺杂后样品的铁电极化性能均有不同程度的提高,可能是由于Mn⁴⁺稳定性优于 Fe³⁺,高价位Mn⁴⁺进行B位替代改性BiFeO₃陶瓷, 能减少Bi³⁺挥发,抑制Fe³⁺价态波动,从而降低氧空位浓度,减小样品的电导和漏电流.     

多孔微结构光纤中飞秒激光脉冲超连续谱的产生

报道了利用800nm飞秒激光脉冲在多孔微结构光纤中产生超连续谱展宽的现象，连续谱展宽范围为440—890nm.基于标量波近似理论对微结构光纤包层的有效折射率和基模的有效面积以及光纤的色散特性进行了计算，发现微结构光纤具有特殊的控制色散和波导特性的能力，对超连续谱展宽的机理进行了初步解释.本文的理论分析和实验结果有较好的一致性，认为即使包层由无序填充气线组成的多孔微结构光纤也可以出现超连续谱展宽效应. 关键词： 多孔微结构光纤 超连续谱 有效折射率 色散     

数字全息技术的原理和应用

数字全息是随着现代计算机和CCD技术发展而产生的一种新的全息成像技术．文章主要介绍数字全息技术的基本原理，数字全息重建中的主要方法以及数字全息技术以其独特的优点在各个领域中的应用．     

我国半导体物理研究进展

简单地回顾了近年来我国半导体物理研究的进展,它包括三个方面,半导体超晶格、微结构;半导体表面、界面和杂质、缺陷;以及半导体新材料、新结构,这些进展说明,半导体物理研究在当代物理学和高技术的发展中都占有突出的地位,它仍是一门年轻的、富有生命力的学科,预期在将来有更大的发展。     

沉积在液体衬底上连续铝薄膜的微观结构

研究了沉积在硅油衬底表面的连续铝薄膜的微结构及其表面形貌.与沉积在单晶硅表面的铝薄膜相比,两种铝薄膜均属颗粒结构,但硅油表面的铝薄膜具有颗粒尺寸较小、大小不均匀,表面起伏较大等特点,而且在该铝薄膜边缘的下表面,有一明显的波纹状楔型结构,其斜率仅为10^-4—10^-5.实验结果表明：这一现象是由于液体衬底的热膨胀行为引起的.此外对样品的晶态也进行了研究. 关键词： 铝薄膜 液体衬底 微观结构     

Microstructural stability and age-hardening behavior of Re-added dual two-phase Ni3Al and Ni3V intermetallic alloys

The effect of Re addition on the microstructure and hardening behaviour of the dual two-phase Ni₃Al (L1₂) and Ni₃V (D0₂₂) intermetallic alloy was investigated by scanning electron microscopy, transmission electron microscopy and Vickers hardness test. The two-phase eutectoid microstructure accompanying the Re-rich precipitates were observed in the channel region of the alloys in which Re substituted for Ni but not in those in which Re substituted for Al and V. The concomitant addition of Nb (or Ta) with Re more stabilized the two-phase eutectoid microstructure and consequently more induced the fine precipitates in the channel region. The annealing at temperatures below the eutectoid temperature was necessary to induce the fine precipitates in the channel region and thereby result in the precipitation hardening. The fine precipitation in the channel region and related hardening was attributed to the alloying feature so that Re is soluble in the A1 (fcc) phase at high temperatures and becomes less soluble in the two intermetallic phases decomposed from the A1 phase at low temperatures.     

Superthermostability of nanoscale TIC-reinforced copper alloys manufactured by a two-step ball-milling process

A Cu-TiC alloy, with nanoscale TiC particles highly dispersed in the submicron-grained Cu matrix, was manufactured by a self-developed two-step ball-milling process on Cu, Ti and C powders. The thermostability of the composite was evaluated by high-temperature isothermal annealing treatments, with temperatures ranging from 727 to 1273 K. The semicoherent nanoscale TiC particles with Cu matrix, mainly located along the grain boundaries, were found to exhibit the promising trait of blocking grain boundary migrations, which leads to a super-stabilized microstructures up to approximately the melting point of copper (1223 K). Furthermore, the Cu-TiC alloys after annealing at 1323 K showed a slight decrease in Vickers hardness as well as the duplex microstructure due to selective grain growth, which were discussed in terms of hardness contributions from various mechanisms.     

Fe-B-Si非晶钎焊W/CLF-1接头组织和性能研究

通过电弧熔炼制备了Fe75B16.67Si8.33非晶合金,通过真空钎焊获得了钨/低活化钢接头.通过对钎焊接头表面形貌、微观组织、成分和力学性能的表征,发现在1250℃保温10min下所获得的钎焊接头界面无孔洞、裂纹等宏观缺陷,接头组织中生成了Fe固溶体、Fe3B和FeWB金属间化合物,拉伸强度高达450MPa.