声速测量及声波的波动学规律研究

声速除了可利用共振干涉法和相位比较法测量外,还可以用干涉、衍射及“洛埃镜”反射等方法测量．声速实验的改进,不仅可扩展声速测量的方法,而且也可加深学生对波动学规律和本质的理解．     

利用宽带声场干涉结构特性对移动船只距离的连续估计

浅海移动船只的宽带辐射声场在距离-频率上通常表现为有规则的干涉条纹结构,这些条纹的特性(数目和斜率)可用波导不变量理论来表征并已被用于多种水声反演问题中,如沉积层声学参数反演和宽带声源距离的估计。基于波导不变量理论和干涉条纹的结构特性,利用扩展卡尔曼滤波器分析移动船只LOFAR图中干涉条纹的距离-频率特征可对其距离进行连续估计。该方法不需要海洋环境的信息和前向拷贝声场计算,具有较高的计算效率。海试数据处理结果和GPS数据计算结果比较一致,证实了本方法的准确性。试验数据处理同样证实该方法对初始距离的选择有着较高的稳健性。     

激光驱动飞片的线面成像VISAR测速技术

以激光驱动飞片速度场诊断为例,展示线面同时成像任意反射面速度干涉仪（VISAR）技术在超高速碰撞研究中的应用前景。将传统VISAR改为成像干涉结构,用变像管扫描相机和高速光电分幅相机分别记录作为信号载体的梳状干涉条纹随时间的变化,实现靶面一条线上各点速度历程和多个时刻二维靶面上所有点速度相对分布的测量。所研制的线面同时成像VISAR具有10 m的空间分辨和约15 m/s的速度分辨能力。用其测量了激光驱动铝膜飞片的速度场,直观给出飞片的演化发展过程。实验结果表明,线面同时成像VISAR技术可以为激光驱动飞片、超高速碰撞等领域的理论研究和数值模拟提供有效比对实验数据。     

群集建筑中大跨裙摆屋盖风荷载特性的数值模拟研究

以苏州太平金融大厦为工程背景,针对其大跨裙摆屋盖的风荷载作用,首先采用RNG k-ε模型模拟分析了其平均风压分布规律,以及风向变化对屋盖表面风荷载体型系数的影响;其次,引入干扰因子IF,探讨了周边建筑对大跨裙摆屋盖风荷载的气动干扰作用。结果表明:0°风向下,走廊上方屋盖两侧区域出现“上吸下顶”的叠加作用;90°风向下屋盖北侧飘带末端区域受到狭道风效应出现正压集中现象;风向变化对大跨裙摆屋盖的风荷载体型系数分布影响较大;且周围建筑物对大跨裙摆屋盖的气动干扰效应明显,主要表现为风压“遮挡效应”,而局部区域表现为风压“放大效应”。     

高纯氧化镝电感耦合等离子体原子发射光谱法摄谱分析时光谱干扰校正方法的研究

本文建立了高纯氧化镝样品ICP摄谱分析时干扰系数法校正光谱干扰的方法。测定了镝基体对14种稀土杂质元素20条灵敏分析线的干扰系数(KCT)。并有效地校正了镝基体造成的光谱干扰,获得满意的结果。     

非球面检测中最佳入射球面波和最佳参考球面波的确定

为了能够对非球面光学元件面型进行高精度的干涉检测,提出了一种确定最佳入射球面波和最佳参考球面波的新方法。该方法通过计算分析入射球面波与非球面反射波干涉条纹密度,确定最佳入射球面波的波源位置;通过计算分析在干涉图记录平面CCD上干涉条纹的密度,确定非球面检测时参考球面波波源的最佳位置。应用该理论与方法,不仅可明确非球面检测时CCD等光路元件选型的具体策略,而且可用于指导非球面检测调试过程,并能够通过对干涉图的深入分析,获得更多被测非球面的信息。     

双相干点光源干涉的一般分析

讨论了双相干点光源的三维空间干涉场的一般数学描述,分析了3个不同截面处的干涉强度的空间分布情况,并给出了相干相长点的计算机模拟图样.该结果也适用于其他类型波的相干叠加场分布.     

迈克尔逊干涉仪中补偿板与干涉条纹

通过分析缺失补偿板的迈克尔逊干涉仪中的附加光程差,推出干涉条纹满足的方程式,并用计算机模拟了动镜移动过程中变化的干涉条纹,与实验结果相一致.     

Machine interference in automated cells

This paper presents a simulation and an analytical modeling of the machine interference problem in manufacturing cells. Each machine experiences two types of stoppage which are to be served by a robot. Several combinations of the distributions of the stoppages, service distributions, and service disciplines are studied. We determine the optimal number of machines assigned to the robot under different operating conditions such that the expected total cost of the manufacturing cell is minimized.This research is based on Mr. Norton's M.S. thesis, which was conducted at Rutgers.     

EMI shielding and dynamic mechanical analysis of graphene oxide-carbon nanotube-acrylonitrile butadiene styrene hybrid composites

Carbon nanomaterials such as carbon nanotubes (CNTs), graphene and their hybrid have been studied extensively. Despite having excellent properties of CNTs and graphene have not yet been fully realized in the polymer composites. During fabrication agglomeration of CNTs and restacking of graphene is a serious concern that results in the degradation of properties of nanomaterials into the final composites. To improve the dispersion of CNTs and restacking graphene, in the present research work, we focused on the hybridization of graphene oxide and CNTs. Multiwalled carbon nanotubes (MWCNTs), functionalized carbon nanotubes (FCNTs), and graphene oxide-carbon nanotubes (GCNTs) reinforced acrylonitrile butadiene styrene (ABS) composites were prepared separately by vacuum filtration followed by hot compression molding. Further, dynamic mechanical analysis (DMA), and electromagnetic interference (EMI) shielding properties of ABS composites reinforced carbon nanofillers were investigated. The dynamic mechanical properties of polymers strongly depend on the adhesion of fillers and polymer, entanglement density of polymer chains in the presence of carbon fillers. The dynamic mechanical characteristics such as storage, loss modulus, and damping factor of prepared composites were significantly affected by the incorporation of MWCNTs, FCNTs, and GCNTs. Maximum EMI shielding effectiveness of −49.6 dB was achieved for GCNT-ABS composites which were highest compared to MWCNTs-ABS composites (−38.6 dB) and FCNTs-ABS composites (−36.7 dB) in the Ku band (12.4–18 GHz). These results depict the great potential of GCNTs-ABS composites to be used in various applications of efficient heat dissipative EMI shielding materials for electronic devices.