超声搅拌磁流变抛光液的声场仿真分析

为了探究超声搅拌磁流变抛光液的制备及优化工艺,利用多物理场数值计算方法,建立了超声搅拌磁流变抛光液的声场仿真模型。研究了20 kHz下不同液位深度、超声变幅杆探入深度、不同功率下磁流变抛光液的声场分布。通过测量磁流变抛光液的声场强度对声场仿真进行了验证。结果表明:随着距变幅杆距离的增加,声强逐渐减弱,高声强区域主要分布在换能器轴线附近。声强在距变幅杆输出端20 mm范围内急剧衰减,变幅杆最佳探入深度为10 mm,增大功率有助于空化区域的扩大。声场仿真结果与实验测量结果基本一致,对磁流变抛光液的制备提供了数值计算基础。     

抛光工艺参数对熔石英元件低频面形精度的影响

根据工件与抛光盘的相对运动关系及熔石英元件抛光加工材料去除模型,系统分析了转速比和偏心距等参数对材料去除函数的影响。通过理论分析和抛光加工实验,研究了不同工艺参数对低频段面形精度的影响规律。利用高分辨率检测仪器对熔石英元件低频面形误差进行了检测,优选出较佳的抛光工艺参数组合,并进行了相应的实验验证,提出了提高光学元件抛光加工低频面形质量的相应措施。     

高效线各工序的匹配

光学零件高效加工生产线建成后，工艺人员应解决的关键问题就是生产线内部各道工序之间的匹配。本文较系统地讨论了从铣磨、精磨到抛光各道工序之间在光圈、光学粗糙度、加工余量诸方面的匹配关系。这三个方面既互相独立、又互相影响。每道工序都要同时满足这三方面的要求，才能保证高效线的稳定、高产     

Novel cavitation fluid jet polishing process based on negative pressure effects

Traditional abrasive fluid jet polishing (FJP) is limited by its high-pressure equipment, unstable material removal rate, and applicability to ultra-smooth surfaces because of the evident air turbulence, fluid expansion, and a large polishing spot in high-pressure FJP. This paper presents a novel cavitation fluid jet polishing (CFJP) method and process based on FJP technology. It can implement high-efficiency polishing on small-scale surfaces in a low-pressure environment. CFJP uses the purposely designed polishing equipment with a sealed chamber, which can generate a cavitation effect in negative pressure environment. Moreover, the collapse of cavitation bubbles can spray out a high-energy microjet and shock wave to enhance the material removal. Its feasibility is verified through researching the flow behavior and the cavitation results of the negative pressure cavitation machining of pure water in reversing suction flow. The mechanism is analyzed through a computational fluid dynamics simulation. Thus, its cavitation and surface removal mechanisms in the vertical CFJP and inclined CFJP are studied. A series of polishing experiments on different materials and polishing parameters are conducted to validate its polishing performance compared with FJP. The maximum removal depth increases, and surface roughness gradually decreases with increasing negative outlet pressures. The surface becomes smooth with the increase of polishing time. The experimental results confirm that the CFJP process can realize a high material removal rate and smooth surface with low energy consumption in the low-pressure environment, together with compatible surface roughness to FJP.     

超薄光学元件精密加工关键技术

针对超薄光学元件在加工过程中因重力和磨头产生应力形变的特点,提出了一种高效、先进的超薄光学元件综合加工方法。该方法综合运用了精密铣磨、精密抛光、离子束修形等先进技术进行面形控制。在铣磨阶段采用受力分析和误差补偿的方法降低了元件变形引入的面形误差;在抛光阶段通过气囊抛光和沥青抛光的迭代实现了面形快速收敛;在离子束加工阶段充分利用其非接触、无应力的加工特点实现了高精度面形修正。实验选择径厚比为34(边长152 mm,厚度6.35 mm)的方形融石英材料进行加工实验。结果表明:在铣磨、抛光、修形阶段的各项指标都达到了精密光学元件的加工水平,最终的面形精度为PV=25 nm,RMS=1.5 nm。该加工方法可以广泛应用于超薄光学元件的高精度加工。     

Surface modification of ceria nanoparticles and their chemical mechanical polishing behavior on glass substrate

To improve their chemical mechanical polishing (CMP) performance, ceria nanoparticles were surface modified with γ-aminopropyltriethoxysilane (APS) through silanization reaction with their surface hydroxyl group. The compositions, structures and dispersibility of the modified ceria particles were characterized by Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), field-emission scanning electron microscopy (FE-SEM), energy dispersive spectroscopy (EDS), laser particle size analyzer, zeta potential measurement and stability test, respectively. The results indicated that APS had been successfully grafted onto the surface of ceria nanoparticles, which led to the modified ceria nanoparticles with better dispersibility and stability than unmodified ceria particles in aqueous fluids. Then, CMP performance of the modified ceria nanoparticles on glass substrate was investigated. Experimental results showed that the modified ceria particles exhibited lower material removal rate (MRR) but much better surface quality than unmodified ceria particles, which may be explained by the hardness reduction of ceria particles, the enhancement of lubrication of the particles and substrate surfaces, and the elimination of the agglomeration among the ceria particles.     

大尺寸硅镜超光滑表面加工的面型控制

 使用机械-化学抛光法加工大尺寸单晶硅可获超光滑表面,但很难保证良好的面型。提出通过采用开圆孔并连续注入抛光剂的方法来避免抛光盘中心蜂窝眼的出现,可以保证得到良好的面型。最后实验达到较好的面型精度,PV值0.268λ,rms值0.065λ。     

CeO2-ZrO2复合氧化物的制备及协同抛光性能

Sub-micrometer ultra fine CeO₂-ZrO₂ mixed oxides have been prepared by milling solid cerium carbonate and zirconium oxy-chloride with ammonia and followed by filtering, drying and calcining procedures. The effects of Ce/Zr molar ratio, milling time and calcining temperature on the phase composition, particle size and morphology, surface charge, as well as the polishing property were investigated. The results show that the mixed oxide calcined at 1 000 ℃ is composed of cubic ceria doped with zirconium and tetragonal zirconia doped with cerium, and the phase composition varies with calcination temperature and the Ce/Zr molar ratio. The monoclinic zirconia is observed when decreasing calcination temperature and shortening milling time, demonstrating that milling and calcining can force the phase transformation from monoclinic zirconia to cerium stabilized tetragonal zirconia and zirconium doped cubic ceria solid solutions. The removal rate for the optical glass polishing varies with Ce/Zr molar ratio. A synergetic polishing effect is found when Ce/Zr molar ratio below 4, and the optimal Ce/Zr molar ratio is 1∶1. At the same time, the cubic ceria content, density, particle size and surface charge all increase when calcination temperature increasing from 800 ℃ to 1 100 ℃. However, the particle morphology changes from disperse quasi-sphere to irregular aggregation and the maximal removal rate for optical glass polishing lies at 1 000 ℃.These facts show that the polishing property of the synthesized ceria-zirconia mixed oxide is affected by the particle physical characteristics comprehensively.     

纳米磨料对硅晶片的超精密抛光研究

采用均相沉淀法制备了纳米CeO2和纳米Al2O3超细粉体,将所制备的超细粉体配制成抛光液并用于硅晶片化学机械抛光,考察了纳米磨料对硅晶片抛光效果及抛光机理的影响.结果表明,纳米CeO2磨料的抛光效果优于纳米Al2O3磨料,采用纳米CeO2磨料抛光硅晶片时可以得到在1μm×1μm范围内微观表面粗糙度Ra为0.089nm的超光滑表面,且表面微观起伏较小.     

Modelling the process of incoming problem reports on released software products

For big software developing companies, it is important to know the amount of problems of a new software product that are expected to be reported in a period after the date of release, on a weekly basis. For each of a number of past releases, weekly data are present on the number of such reports. Based on the type of data that is present, we construct a stochastic model for the weekly number of problems to be reported. The (non‐parametric) maximum likelihood estimator for the crucial model parameter, the intensity of an inhomogeneous Poisson process, is defined. Moreover, the expectation maximization algorithm is described, which can be used to compute this estimate. The method is illustrated using simulated data. Copyright © 2004 John Wiley & Sons, Ltd.