Polyimide/hollow silica sphere hybrid films with low dielectric constant

Abstract

Polyimide (PI)/hollow silica (HS) sphere hybrid films with low dielectric constant values (low-k) were synthesized via thermal imidization process using pyromellitic dianhydride (PMDA)/4,4′-oxydianiline (ODA) as the polymer matrix and HS spheres as inorganic particles with the closed air voids. The monodispersed HS spheres were synthesized via a one-step process, which means that the formation of silica shells and dissolution of the core particles (polystyrene particles) occurs in the same medium. The HS particles have uniform size of ca. 1.5 μm in diameter and ca. 100 nm in shell thickness. PI/HS sphere hybrid films synthesized using mixture of polyamic acid (PAA) and HS spheres prepared via one-pot process, which means that the production of PAA and HS spheres mixture occurs with the polymerization of PMDA and ODA in the same bottle. HS spheres of two different kinds (pristine HS spheres (PHS spheres) and amine-modified HS spheres (AHS spheres)) were used for the preparation of the hybrid films. With the varying contents of AHS spheres in the range of 1–10 wt%, the dielectric constants of the PI/AHS sphere hybrid films were reduced from 3.1 of pure PI to 1.81 by incorporating 5 wt% AHS. The dielectric constants of the PI/PHS sphere hybrid films were reduced to 1.86 by incorporating 5 wt% PHS. Organic–inorganic hybrid porous polyimides may be expected as prime candidates for polymeric insulators due to their high thermal stability, good mechanical properties, solvent resistance, and low-k.     

On-line measurement of the RMS radius of gyration and molecular weight of polyimide precursor fractions eluting from a size-exclusion chromatograph

The recent introduction of multiangle light-scattering detectors for size-exclusion chromatography has made possible the measurement of the root mean square radius of gyration (R_g) and molecular weight (M) of polymer fractions eluting from a size-exclusion chromatography column. The characterization of the dimensions of a polymer may be accomplished with only a few milligrams. The dimensions of a polyimide precursor prepared by the condensation of the meta-diethyl ester of pyromellitic dianhydride with para-phenylene diamine have been measured with this technique. The dependence of R_g on M across the distribution is compared with that predicted for a freely rotating chain, and with other similar polymers measured with hydrodynamic techniques.     

Stress in polyimide coatings

The effect of film thickness on in-plane molecular orientation and stress in polyimide films prepared from pyromellitic dianhydride with 4,4′-oxydianline was investigated using a prism coupling technique to measure the refractive index. Film thickness was controlled by varying both solution concentration and spinning conditions. Birefringence, the difference between the in-plane and out-of-plane refractive indices, was used to characterize the in-plane molecular orientation. The observed birefringence is a combination of the birefringence resulting from molecular orientation and the birefringence induced by the residual stress present in the films. The birefringence decreases with increasing film thickness over the range of thicknesses studied (3–20 μm) indicating that the molecular orientation decreases with increasing film thickness. The in-plane coefficient of linear thermal expansion (CTE), controlled by the level of orientation in the film, increases from 18 to 32 × 10^?6/°C over the same thickness range. The birefringence of free-standing films was lower than that of adhered films due to the release of residual stress in the film once the film is removed from the substrate. The residual film stress arises primarily from the mismatch in CTEs between the polyimide film and the substrate to which the film is adhered. Thus, since the film anisotropy decreases with increasing thickness, the film stress increases with increasing thickness. Residual stress calculated by integrating the product of the film modulus and the CTE mismatch assuming temperature-dependent properties is comparable to experimentally measured film stress. Ignoring the temperature dependence of the film properties leads to an overestimation of stress. Moisture uptake was used to study the stress dependence of the optical properties. Moisture uptake increases both the in-plane and out-of-plane refractive indices by equal amounts in free-standing films due to an isotropic increase in the polarizability. In adhered films, an increase in moisture uptake leads to a decrease in the birefringence due to a swelling-induced decrease in the residual film stress. © 1994 John Wiley & Sons, Inc.     

季胺盐对共混聚酰亚胺膜气体除湿性能的影响

季胺盐对共混聚酰亚胺膜气体除湿性能的影响;共混改性;聚酰亚胺;季胺盐;亲水性;除湿     

Preparation and alignment properties of photosensitive polyimide containing benzophenone in main chain

ABSTRACT

In order to study the effect of benzophenone (BP) group in the main chain on the photo-alignment behaviour of cinnamoyl groups, a novel photosensitive polyimide (BTDA-PI-CA) is synthesised by 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 2,2-bis(3-amino-4-hydroxyphenyl)-hexafluoropropane (AHHFP) and cinnamoyl chloride. The BTDA-PI-CA films exhibit good alignment performance after the non-polarised ultraviolet ageing lamp exposure, which is due to the polyimide with BP group can be used to improve the photosensitivity. Moreover, the thermal stability of the LC cells is pretty good and the pretilt angle of the LC cells is 0.5, which can be used in parallel mode LCD.     

Photopiezoelectric Composites of Azobenzene‐Functionalized Polyimides and Polyvinylidene Fluoride

Light is a readily available and sustainable energy source. Transduction of light into mechanical work or electricity in functional materials, composites, or systems has other potential advantages derived from the ability to remotely, spatially, and temporally control triggering by light. Toward this end, this work examines photoinduced piezoelectric (photopiezoelectric) effects in laminate composites prepared from photoresponsive polymeric materials and the piezoelectric polymer polyvinylidene fluoride (PVDF). In the geometry studied here, photopiezoelectric conversion is shown to strongly depend on the photomechanical properties inherent to the azobenzene‐functionalized polyimides. Based on prior examinations of photomechanical effects in azobenzene‐functionalized polyimides, this investigation focuses on amorphous materials and systematically varies the concentration of azobenzene in the copolymers. The baseline photomechanical response of the set of polyimides is characterized in cantilever deflection experiments. To improve the photomechanical response of the materials and enhance the electrical conversion, the polyimides are drawn to increase the magnitude of the deflection as well as photogenerated stress. In laminate composites, the photomechanical response of the materials in sequenced light exposure is shown to transduce light energy into electrical energy. The frequency of the photopiezoelectric response of the composite can match the frequency of the sequenced light exposing the films.

     

Effects of Aramid Fiber and Polytetrafluoroethylene on the Mechanical and Tribological Properties of Polyimide Composites in a Vacuum

Polyimide composites filled with aramid fiber (AF) and polytetrafluoroethylene (PTFE) were prepared by hot press molding. The thermal, mechanical, and tribological properties of the composites were studied systematically. The friction and wear behavior, sliding against GCr15 steel balls, were evaluated in a ground-based wear in space simulation facility using a ball-on-disk tribosystem. The morphologies of the worn surfaces during the sliding process of the composites were analyzed by scanning electron microscopy to reveal the wear mechanism. It was found that the heat-resisting performance and the hardness of the composites were minimally affected by the additives. The flexural strength of polyimide/AF/PTFE (PI-3) decreased when PTFE was added. The wear resistance increased and the coefficient of friction decreased due to the effect of both fillers. In vacuum, the friction coefficients of polyimide (PI-1), polyimide/AF (PI-2), and PI-3 increased slightly with sliding velocity, while the opposite results were obtained in air. With the increase of air pressure the friction coefficients of the samples increased.     

Polyimide‐Polydimethylsiloxane Copolymers. Evaluation of the Thermal and Electrical Properties

Poly(dimethylsiloxane‐amic‐acid)s have been prepared starting from a fluorinated dianhydride, namely 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, and a mixture of an aromatic diamine and bis(aminopropyl)‐oligodimethylsiloxane of controlled molecular weight, in different ratios. A solution imidization procedure was used to convert them quantitatively to the corresponding polyimides. The polymers, easily soluble both in polar (N‐methylpyrrolidone) and less polar (chloroform) solvents, were prepared for film‐forming by casting from solution. The thermal behavior in dependence on composition was evaluated by thermogravimetric analysis and differential scanning calorimetry. The kinetic processing of thermogravimetric data was carried out using the Flynn‐Wall‐Ozawa and Kissinger methods. Electrical insulating properties of some polymer films were evaluated on the basis of dielectric constant and dielectric loss tangent and their variation with frequency.     

Preparation and properties of thermally stable polyimides derived from asymmetric trifluoromethylated aromatic diamines and various dianhydrides

A novel method for the preparation of an asymmetric fluorinated aromatic diamine, 3,4′-bis(4-amino-2-trifluoromethylphenoxy)-benzophenone was investigated. This new diamine containing trifluoromethyl side group was synthesized from the nucleophilic substitution reaction of 2-chloro-5-nitrobenzotrifluoride and 3,4′-dihydroxybenzo phenone in the presence of potassium carbonate, followed by catalytic reduction with SnCl₂·6H₂O and concentrated hydrochloric acid. This novel diamine was used to react with different commercially available aromatic tetracarboxylic dianhydrides to prepare polyimides via thermal or chemical imidization. The polyimide properties such as inherent viscosity, solubility, thermal and surface properties were investigated to illustrate the contribution of the trifluoromethyl group and the asymmetry structure of the polyimide. The polyimides obtained had good thermal stability and the glass transition temperature values ranged from 225 to 267 °C. All of these novel polyimides held 10% weight loss at the temperature above 543 °C in air and left more than 47% residue even at 800 °C in nitrogen. The inherent viscosities of the obtained polyimides were above 0.73 dL/g and were easily dissolved in both polar, aprotic solvents and some low-boiling-point solvents. Moreover, these PI films had dielectric constants of 2.94-3.53 (1 kHz), with moisture absorption in the range of 0.07-0.34 wt%. In comparison of the PIs (5) series with the analogous symmetric PIs (6) series based on 4,4′-bis(4-amino-2-trifluoromethylphenoxy)-benzophenone, the (5) series revealed better solubility, low dielectric constant and moisture absorption.