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41.
A thermal stable aromatic polyimide (PI) with side‐chain second‐order nonlinear optical (NLO) chromophores has been developed. The PI was prepared by the ring‐opening polyaddition of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride with a new diamine having two N‐ethyl‐N‐[4‐[(6‐chlorobenzothiazol‐2‐yl)diazenyl]phenyl]‐2‐aminoethanol units as the NLO chromophore, followed by poling during or after the thermal imidization process. The resulting PI had number and weight‐average molecular weights (Mn, Mw) of 25,000 and 80,000, respectively, and a relatively high glass transition temperature of 180°C. The second harmonic coefficient (d33) of PI at the wavelength of 1.064 μm was 138 pm/V (329.6 × 10−9 esu) and remained unchanged at elevated temperatures. The corona poling process of the NLO‐substituted poly(amic acid) to the PI was also studied in detail by measuring the second harmonic generation (SHG) from the polymer films. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1321–1329, 1999  相似文献   
42.
2,2,′3,3′‐Biphenyltetracarboxylic dianhydride (2,2,′3,3′‐BPDA) was prepared by a coupling reaction of dimethyl 3‐iodophthalate. The X‐ray single‐crystal structure determination showed that this dianhydride had a bent and noncopolanar structure, presenting a striking contrast to its isomer, 3,3,′4,4′‐BPDA. This dianhydride was reacted with aromatic diamines in a polar aprotic solvent such as N,N‐dimethylacetamide (DMAc) to form polyamic acid intermediates, which imidized chemically to polyimides with inherent viscosities of 0.34–0.55 dL/g, depending on the diamine used. The polyimides from 2,2,′3,3′‐BPDA exhibited a good solubility and were dissolved in polar aprotic solvents and polychlorocarbons. These polyimides have high glass transition temperatures above 283°C. Thermogravimetric analyses indicated that these polyimides were fairly stable up to 500°C, and the 5% weight loss temperatures were recorded in the range of 534–583°C in nitrogen atmosphere and 537–561°C in air atmosphere. All polyimides were amorphous according to X‐ray determination. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1425–1433, 1999  相似文献   
43.
Aliphatic polyimides containing adamantyl units (APIs) were prepared by the poly(addition/condensation) of a dianhydride bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic 2,3 : 5,6-dianhydride with a rigid diamine, 1,3-diaminoadamantane or 3,3′-diamino-1,1′-biadamantyl, and a flexible diamine, 4,4′-methylenebis(cyclohexylamine) or 1,4-cyclohexanediamine. One-step polymerizations were conducted at 80–200°C in m-cresol, producing APIs with inherent viscosities up to 0.53 dL g−1. These APIs are soluble in haloalkanes, m-cresol, and sulfuric acid and show high thermal stability and excellent transparency. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3584–3590, 1999  相似文献   
44.
Diamine 3,3‐bis[4‐(4‐aminophenoxy)‐3‐methylphenyl]phthalide (BAMP) was derived from the o‐cresolphthalein, and then it was polycondensated with various aromatic dicarboxylic acids and dianhydrides to synthesize polyamides (PAs) and polyimides (PIs), respectively. PAs have inherent viscosities of 0.78–2.24 dL/g. Most of the PAs are readily soluble in a variety of solvents such as DMF, DMAc, and NMP and afforded transparent and tough films from DMAc solutions. The cast films have tensile strengths of 75–113 MPa as well as initial moduli of 1.71–2.97 GPa. These PAs have glass transition temperatures (Tgs) in the range of 242–325°C, 10% weight loss temperatures occur up to 473°C, and char yields are between 57 and 64% at 800°C in nitrogen. PIs were first synthesized to form polyamic acids (PAAs) by a two‐stage procedure that included a ring‐opening reaction, followed by thermal or chemical conversion to polyimides. Inherent viscosities of PAAs are between 0.71 and 1.63 dL/g. Most of the PIs obtained through the chemical cyclodehydration procedure are soluble in NMP, o‐chlorophenol, m‐cresol, etc., and they have inherent viscosities of 0.58–1.32 dL/g. Tgs of these PIs are in the range of 270–305°C and show 10% weight loss temperatures up to 477°C. PIs obtained through the thermal cyclodehydration procedure have tensile strengths of 72–142 MPa, elongations at break of 8–19%, and initial moduli of 1.80–2.72 GPa. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 455–464, 1999  相似文献   
45.
Polyimide nanocomposites having low-k and UV shielding properties have been developed using fluorine functionalized graphene oxide and bis(quinoline amine) based polyimide. The polyimide was synthesized using bis(quinoline amine) and pyromellitic dianhydride at appropriate experimental conditions, and its molecular structure was confirmed through various spectral analysis such as FTIR and NMR. The polyimide (PI) composites were prepared using bis(quinoline amine), pyromellitic dianhydride, and separately filled with 1, 5, 10 wt% of fluorinated graphene oxide (FGO) through in situ polymerization. The polymer composites were characterized using thermo gravimetric analysis (TGA), X-ray powder diffraction (XRD), and scanning electron microscopy (SEM). In addition, the water contact angle, dielectric behavior, and UV–Vis shielding behavior of FGO/PI composites were evaluated. The value of the water contact angle of the polyimide was increased with increment of FGO in the polyimide matrix. The highest water contact angle of polyimide composites observed 108° was obtained for 15 wt% FGO reinforced polyimide composite. The value of the dielectric constant for neat, 1, 5, and 15 wt% FGO reinforced polyimide composites was obtained as 4.5, 3.7, 2.6, and 2.0, respectively. It is also observed from by UV–Vis spectroscopy analysis that the FGO reinforced polyimide composites have good UV shielding behavior.  相似文献   
46.
In order to decrease the resistance–capacitance delay and signal crosstalk in ultra large‐scale integrated circuits (ULSIC), dielectric materials with ultra low dielectric constants are developed to be the replacement of silicon dioxide. Introduction of air on the matrix material is an important method to reduce the dielectric constant, and polyimide (PI) is the most promising polymer to prepare porous matrix material for its distinct advantages. PI membrane with nanopores was prepared by the method of template method (i.e. thermolysis of polystyrene nanospheres in the matrix) following the synthesis of template. The nanoporous membrane was characterized by Fourier transformer infrared, scanning electron microscopy, thermogravimetric analysis, and the dielectric constant of which was measured. Results showed that uniform nanopores about 100–200 nm were formed in the PI membrane, and dielectric constant of which was decreased to 2.08 from 3.34. The nanoporous membrane can be applied as potential low‐k dielectric material in ULSIC. Copyright © 2015 John Wiley & Sons, Ltd.  相似文献   
47.
One of fluorinated polyimides was synthesized from 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) and 3,3′-dimethyl-4,4′-diaminodiphenylmethane (DMMDA) by two-steps method, which had good solubility and hydrophilicity. 6FDA-DMMDA polyimide was dissolved in chloroform (CHCl3) and cast on a glass substrate in a humid atmosphere. It was found that 6FDA-DMMDA/CHCl3 solution was easy to form ordered porous structure at high concentration, and the reason was discussed in detail. In addition, the influences of solution concentration, the atmosphere humidity, were also tested.  相似文献   
48.
A practical methodology for the correlation and prediction of the process–property performance of advanced materials is developed. The model polymer studied is PMDA-ODA polyimide. The connecting link between the process and the properties is the structural state of the polymer. An essential ingredient for a quantitative characterization of the system is a knowledge of its phase state and intrinsic molecular properties. The intrinsic molecular properties define the limiting performance properties available to the polymer. Anisotropic films and sheets produced by five different fabrication processes are examined. Maps of the molecular symmetry axis, the orientation function, and the thickness distributions of two 50-in.-wide sheets fabricated differently are measured nondestructively for process comparison. Four other film fabrication processes are examined and their three-dimensional orientation states determined and correlated. A three-dimensional orientation function triangular plot permits simultaneous representation of the different fabrication processes on the same figure and allows the investigator to choose the most economic and efficient fabrication route. The structure–property study includes the structural correlation and intrinsic molecular property determination of the anisotropic coefficient of thermal expansion (CTE), the anisotropic mechanical moduli and compliances, and the anisotropic dielectric constants. 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35: 777–788, 1997  相似文献   
49.
A series of new optically active aromatic polyimides containing axially dissymmetric 1,1′-binaphthalene-2,2-diyl units were prepared from optically pure (R)-(+)- or(S)-(−)-2,2′-bis(3,4-dicarboxyphenoxy)-1,1′-binaphthalene dianhydrides and various aromatic diamines via a conventional two-step procedure that included ring-opening polycondensation and chemical cyclodehydration. The optically pure isomer of dianhydride was prepared by a nucleophilic substitution of optically pure (R)-(+)- or(S)-(−)-1,1′-bi-2-naphthol with 4-nitrophthalonitrile in aprotic polar solvent and subsequent hydrolysis of the resultant tetranitrile derivatives, followed by the dehydration of the corresponding tetracarboxylic acids to obtain the dianhydrides. These polymers were readily soluble in common organic solvents such as N,N-dimethylacetamide, N-methyl-2-pyrrolidone, and m-cresol, etc., and have glass transition temperatures of 251–296°C, and 5% weight loss occurs not lower than 480°C. The specific rotations of the optically active polyimides ranged from +196° to +263°, and the optical stability and chiroptical properties of them were also studied. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 3287–3297, 1997  相似文献   
50.
New model compounds for poly[N,N′-bis(phenoxyphenyl)pyromellitimide] have been synthesized in order to investigate the formation of imine bonds which are proposed to form during the curing process and lead to crosslinking in the bulk polymer. Raman studies show that terminal amines can react with imide carbonyls during curing to form C?N bonds. The Raman band due to C?N appears at 1656 cm?1 and the band due to C?O closest to the imine bond is observed at 1742 cm?1. These results are in agreement with previously published results on vapor deposited polyimide films.  相似文献   
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