SiC过渡层对氟化类金刚石薄膜附着特性的影响

采用射频反应磁控溅射法在316L不锈钢基片上分别沉积了两种薄膜:一种是氟化类金刚石薄膜(F-DLC),另一种是先镀上一定厚度的SiC过渡层再沉积F-DLC.着重研究了薄膜的附着力随过渡层制备条件的变化规律.结果显示,增加SiC过渡层后薄膜的附着力明显增加,且附着力随SiC过渡层的制备条件有所变化,在射频输入功率为200 W,沉积时间5min制备出的SiC过渡层上再沉积F-DLC时,附着力可达8.7 N,远高于未加过渡层时F-DLC膜的附着力(4 N).通过研究SiC的沉积速率曲线、表面形貌和红外光谱,探讨了SiC过渡层及其制备条件影响薄膜附着力的相关机制.     

极端环境下连续碳纤维增韧的陶瓷基复合材料的力学行为

连续纤维增韧的碳化硅复合材料(以下简称C/SiC),作为超高速飞行器热结构使用时,有可能在高温环境下受到高速撞击的作用,因此,掌握其在极端环境(高温、高应变率)下的力学性能是进行结构安全设计的基础。本文采用具有高温实验能力的分离式Hopkinson杆,在293~1273K温度范围内进行了动态压缩力学性能测试,研究了环境温度和加载速率对材料力学性能的影响。结果表明:C/SiC复合材料的高温压缩力学性能主要受应力氧化损伤和残余应力的共同影响。实验温度低于873K时,应力氧化损伤的影响很小,而由于增强纤维和基体界面残余应力的释放使界面结合强度增大,复合材料的压缩强度随温度的升高而增大;当实验温度高于873K时,应力氧化损伤加剧,其对压缩强度的削弱超过残余应力释放对强度的贡献,材料的压缩强度随温度的升高逐渐降低。由于应力氧化损伤受应变率的影响很大,当温度由873K升高至1273K时,高应变率下压缩强度降低的程度要比应变率为0.0001/s时低得多。     

SiC/C界面辐照性能的分子动力学研究

本文通过分子动力学模拟的方法,研究了5种含不同空间结构的SiC/C界面的材料受辐照后的缺陷分布随时间以及PKA位置的变化关系,并与单质SiC中缺陷分布情况进行对比.利用径向分布函数分析了辐照对界面原子排列情况的影响.研究结果表明,SiC/C界面的抗辐照能力明显低于SiC内部,不同的空间结构对界面缺陷数量存在一定影响.由径向分布函数推得界面区域石墨原子密度高则界面原子排列情况受辐照影响越大.     

SiC过渡层制备温度对碳化硅/氟化类金刚石复合薄膜血液相容性的影响

以316L不锈钢为基底,SiC晶体为靶材,Ar为源气体,采用磁控溅射法在不同温度下制备出系列SiC过渡层.然后以高纯石墨作靶,Ar和CHF_3为源气体,在同一工艺条件下再续镀一层氟化类金刚石(F-DLC)薄膜,形成SiC/F-DLC复合薄膜.研究表明,相比于F-DLC薄膜,复合薄膜的附着力显著增加,血液相容性明显改善.通过样品的拉曼和红外光谱分析了不同温度下制备的SiC过渡层以及复合薄膜结构的演变.结果表明,控制SiC过渡层制备温度可以有效调制过渡层中C=C键的比例以及—C—C—不饱和键的密度,复合薄膜中保留较高比例的芳香环式结构以及合适的F/C比是薄膜的血液相容性得以进一步改善的原因,SiC过渡层制备温度控制在500℃左右效果尤为明显.SiC薄膜和F-DLC两种薄膜的界面处形成一定比例的Si—C键和C=C键是导致复合薄膜附着力显著上升的直接原因.适当条件下在316L不锈钢和F-DLC薄膜之间增加SiC过渡层对于增强薄膜的附着力、改善其血液相容性是可行、有效的.     

Investigation of mixing processes of effusion cooling air and main flow in a single sector model gas turbine combustor at elevated pressure

Mixing processes between main flow and effusion cooling air are investigated in an effusion cooled, swirl-stabilized pressurized single sector gas turbine combustor using advanced laser diagnostics. Quantitative planar laser-induced fluorescence of the hydroxyl radical (OH-PLIF) and planar laser-induced fluorescence of nitric oxide, seeded to the effusion cooling air, (NO-PLIF) are employed in the primary zone and close to the effusion cooled liner. This data is used to identify mixing events at three stages of premixed combustion, i.e. mixing before reaction, mixing during reaction and mixing after reaction. A parametric study of swirl and cooling air mass flow is conducted to investigate the mutual interaction between flame and cooling air. Within the primary zone, a significant radial asymmetry of OH concentration is observed. This asymmetry is partly explained by the presence of effusion cooling air within the unburned fresh gas, leading to lowered OH concentration within local reaction zones and their post-flame equilibrium concentration. Near the effusion cooled liner, adiabatic mixing after reaction is the dominant process across all investigated operating conditions. Notable mixing before reaction is only observed for the first effusion hole on the center line at low swirl conditions.     

高温空气下C/SiC复合材料断裂韧性实时测试和微观结构表征分析

为了研究高温空气下C/SiC复合材料断裂韧性和微观结构,采用单边切口梁三点弯曲法实时测试了C/SiC复合材料在高温空气下的断裂韧性,并采用电子扫描显微镜 (scanning electron microscope,SEM)和X 射线衍射分析仪 (X-ray diffraction, XRD)分析了复合材料在不同温度下的破坏断口和失效机制。研究结果表明随测试温度升高,C/SiC复合材料断裂韧性降低,材料的断裂形式由脆性断裂逐渐演变成塑性断裂。从室温升温到1 000 ℃测试温度条件下,C/SiC复合材料的断裂韧性由12.5 MPa·m1/2降低为10.96 MPa·m1/2,降幅仅为12%,C/SiC复合材料高温断裂韧性良好。不同温度下,材料呈现出不同形式的断裂形貌。常温下断口形貌主要可以看到纤维拔出的现象,随着温度的升高,该现象基本消失,断裂截面变得更平整,材料的强度主要取决于基体的强度。     

光学侧窗头罩致冷系统的研制工艺

当高速拦截器在空中高速飞行时,拦截器上的光学侧窗头罩需要合适的冷却系统以确保拦截器的工作正常。为了满足光学侧窗头罩冷却系统的要求,分别将内外两种冷却方式对光学侧窗头罩成像的影响进行了分析。提出了光学侧窗头罩内冷却窗口的研制工艺,从如何选择红外光学材料开始,对下料、粗磨、刻槽、精磨、抛光等光学加工环节分别进行了介绍,描述了光学侧窗头罩致冷系统的光学加工过程。重点介绍了如何在光学材料上加工出沟槽,完成光学侧窗头罩制冷窗口内冷却通道的加工工艺。     

Multi-physics design of microvascular materials for active cooling applications

This paper describes a framework for the design of microvascular polymeric components for active cooling applications. The design of the embedded networks involves complex and competing objectives that are associated with various physical processes. The optimization tool includes a PDE solver based on advanced finite element techniques coupled to a multi-objective constrained genetic algorithm. The resulting Pareto-optimal fronts are investigated in the optimization of these materials for void volume fraction, flow efficiency, maximum temperature, and surface convection objective functions.     

A mesoscopic modelling approach for direct numerical simulations of transition to turbulence in hypersonic flow with transpiration cooling

A rescaling methodology is developed for high-fidelity, cost-efficient direct numerical simulations (DNS) of flow through porous media, modelled at mesoscopic scale, in a hypersonic freestream. The simulations consider a Mach 5 hypersonic flow over a flat plate with coolant injection from a porous layer with 42 % porosity. The porous layer is designed using a configuration studied in the literature, consisting of a staggered arrangement of cylinder/sphere elements. A characteristic Reynolds number ${\mathit{Re}}_c$ of the flow in a pore cell unit is first used to impose aerodynamic similarity between different porous layers with the same porosity, $∊$, but different pore size. A relation between the pressure drop and the Reynolds number is derived to allow a controlled rescaling of the pore size from the realistic micrometre scales to higher and more affordable scales. Results of simulations carried out for higher cylinder diameters, namely 24 μm, 48 μm and 96 μm, demonstrate that an equivalent Darcy-Forchheimer behaviour to the reference experimental microstructure is obtained at the different pore sizes. The approach of a porous layer with staggered spheres is applied to a 3D domain case of porous injection in the Darcy limit over a flat plate, to study the transition mechanism and the associated cooling performance, in comparison with a reference case of slot injection. Results of the direct numerical simulations show that porous injection in an unstable boundary layer leads to a more rapid transition process, compared to slot injection. On the other hand, the mixing of coolant within the boundary layer is enhanced in the porous injection case, both in the immediate outer region of the porous layer and in the turbulent region. This has the beneficial effect of increasing the cooling performance by reducing the temperature near the wall, which provides a higher cooling effectiveness, compared to the slot injection case, even with an earlier transition to turbulence.     

Application of nanofluids to a heat pipe liquid-block and the thermoelectric cooling of electronic equipment

Microprocessor power dissipation is constantly increasing. An increase in microprocessor size has also resulted in higher heat fluxes. The growth of information technology has rapidly increased over the past few years, causing an increase in the demand for a microprocessor that has a very high computing ability. The previous generation of central processing units (CPU) had 1.17 billion transistors planted in it, which indicates that a significant amount of heat was generated. The total heat dissipation resulting from a high end CPU is approximately 110-140 W, which will increase if the CPU voltage and frequency increase. Conventional air-cooled cooling systems are no longer adequate to remove these heat fluxes. For a number of applications, direct air-cooling systems will have to be replaced or enhanced by other high performance compact cooling techniques. In this study, the application of nanofluids as the working fluid on a heat pipe liquid-block combined with thermoelectric cooling is investigated. The type and effect of volume concentrations of nanofluids, coolant temperature, and thermoelectricsystem as heat pumps of a PC on the CPU’s temperature are considered. The results obtained from this technique are compared to those from other conventional cooling techniques. The heat pipe liquid-block combined with the thermoelectric system has a significant effect on heat transfer from the CPU. The higher thermal performance heat pipe liquid-block and thermoelectric cooled system with nanofluids proved its potential as a working fluid.