Reverse blocking enhancement of drain field plate in Schottky-drain AlGaN/GaN high-electron mobility transistors

In this paper, we present the combination of drain field plate(FP) and Schottky drain to improve the reverse blocking capability, and investigate the reverse blocking enhancement of drain FP in Schottky-drain AlGaN/GaN high-electron mobility transistors(HEMTs). Drain FP and gate FP were employed in a two-dimensional simulation to improve the reverse blocking voltage(VRB) and the forward blocking voltage(VFB). The drain-FP length, the gate-FP length and the passivation layer thickness were optimized. VRBand VFBwere improved from-67 V and 134 V to-653 V and 868 V respectively after optimization. Simulation results suggest that the combination of drain FP and Schottky drain can enhance the reverse blocking capability significantly.     

横截面积参数对钛氧化物忆阻器导电特性的影响

纳米钛氧化物忆阻器的导电过程因自身参数的改变及不同机理的共存而呈现复杂特性,但现有研究缺乏针对横截面积参数的改变对忆阻器导电特性影响的讨论.基于杂质漂移及隧道势垒机理,本文分析了忆阻器导电过程,研究了横截面积参数与导电过程中各关键物理要素间的关联,并基于此,分别研究了钛氧化物横截面积及隧道势垒横截面积的改变对忆阻器导电特性的影响,分析了两者的区别与联系.验证了两种机理共存情况下,相对于钛氧化物横截面积的改变,隧道势垒横截面积的改变是引发忆阻器导电特性变化的主要因素,且是导致忆阻器非理想导电特性的可能因素.研究成果有助于进一步解释忆阻器导电过程的复杂性,并为优化忆阻器模型的构建提供依据.     

Total duration of negative surplus for a Brownian motion risk model with interest

In this paper,we consider the Brownian motion risk model with interest.The Laplace transform of the first exit time from the upper barrier before hitting the lower barrier is obtained.Using the obtained result and exploiting the limitation idea,we derive the Laplace transform of total duration of negative surplus.     

Mechanism of improving forward and reverse blocking voltages in AlGaN/GaN HEMTs by using Schottky drain

In this paper, we demonstrate that a Schottky drain can improve the forward and reverse blocking voltages(BVs)simultaneously in AlGaN/GaN high-electron mobility transistors(HEMTs). The mechanism of improving the two BVs is investigated by analysing the leakage current components and by software simulation. The forward BV increases from72 V to 149 V due to the good Schottky contact morphology. During the reverse bias, the buffer leakage in the Ohmicdrain HEMT increases significantly with the increase of the negative drain bias. For the Schottky-drain HEMT, the buffer leakage is suppressed effectively by the formation of the depletion region at the drain terminal. As a result, the reverse BV is enhanced from-5 V to-49 V by using a Schottky drain. Experiments and the simulation indicate that a Schottky drain is desirable for power electronic applications.     

Trapezoid mesa trench metal-oxide semiconductor barrier Schottky rectifier: an improved Schottky rectifier with better reverse characteristics

An improved structure of Schottky rectifier,called a trapezoid mesa trench metal-oxide semiconductor (MOS) barrier Schottky rectifier (TM-TMBS),is proposed and studied by two-dimensional numerical simulations.Both forward and especially better reverse I-V characteristics,including lower leakage current and higher breakdown voltage,are demonstrated by comparing our proposed TM-TMBS with a regular trench MOS barrier Schottky rectifier (TMBS) as well as a conventional planar Schottky barrier diode rectifier.Optimized device parameters corresponding to the requirement for high breakdown voltage are given.With optimized parameters,TM-TMBS attains a breakdown voltage of 186 V,which is 6.3% larger than that of the optimized TMBS,and a leakage current of 4.3×10 6 A/cm 2,which is 26% smaller than that of the optimized TMBS.The relationship between optimized breakdown voltage and some device parameters is studied.Explanations and design rules are given according to this relationship.     

离子簇合物(N_2)~+Ne_n(n=1,2,3)的从头计算研究

利用Ｇａｕｓｉａｎ９４量子化学从头算程序，选择ＵＭＰ２／６－３１１Ｇ方法，对Ｎ＋２Ｎｅｎ（ｎ＝１，２，３）的离子簇合物进行了几何全优化，并通过频率分析确认了体系的稳定构型，得到了各稳定簇合物的离解能．用ＵＨＦ／６－３１１Ｇ方法，计算了Ｎ＋２离子在ｎ个氖原子（ｎ＝１，２，３）氛围中的转动势垒．计算表明：线性结构是Ｎ＋２Ｎｅｎ（ｎ＝１，２）的最稳定结构；与Ｎ＋２Ｈｅｎ比较，Ｎ＋２Ｎｅｎ的诱导电荷更大，束缚势阱更深，各向导性明显，Ｎ＋２没有在原子氛围中的自由这些计算与Ｍａｉｅｒ实验结果一致．     

偏置退火对含氢Ti/n-GaAs Schottky势垒的控制作用

氢能使 Ti/n-GaAs Schottky势垒下降 0.18eV之多.零偏退火使含氢的Ti/n-GaAs Schottky势垒降低,而随后的反偏退火则使含氢的 Schottky势垒增加.2h以上,100℃反偏退火后其Schottky势垒高与反偏退火的偏压之间有一一对应的关系,偏压愈大,势垒越高。     

钛－镍－硅固相反应形成的镍硅化物/n-硅(100)接触的I-V-T研究

在不同退火温度下，有一薄层钛覆盖层的镍－硅经过固相反应生成了镍硅化物/n-硅(100)接触，研究了其在80K到室温的电流－电压（I-V）特性。低温I-V曲线在低偏压区的电流显著地比传统的热电子发射（TE）模型预计的要大。用基于Tung的夹断模型简化得到的双肖特基势垒模型分析了实测的I-V曲线，从中可以得到肖特基势垒不均匀性的量度。较高温度退火导致较大的势垒不均匀性，意味着硅化物薄膜均匀性的变坏。钛覆盖薄层可以稍微提高硅化镍的相转变温度，以及形成的一硅化镍的热稳定性。     

关于Schottky上界

本文用无穷乘积表示了Agard η-偏差函数,由此给出了0相似文献   

6H-SiC Schottky barrier source／drain NMOSFET with field-induced source／drain extension

A novel SiC Schottky barrier source/drain NMOSFET (SiC SBSD-NMOSFET) with field-induced source/drain (FISD) extension is proposed and demonstrated by numerical simulation for the first time. In the new device the FISD extension is induced by a metal field-plate lying on top of the passivation oxide, and the width of Schottky barrier is controlled by the metal field-plate. The new structure not only eliminates the effect of the sidewalls but also significantly improves the on-state current. Moreover, the performance of the present device exhibits very weak dependence on the widths of sidewalls.