Growth of Eu-doped GaN by gas source molecular beam epitaxy and its optical properties

Eu-doped GaN with various Eu concentrations were grown by gas source molecular beam epitaxy, and their structural and optical properties were investigated. With increasing Eu concentration from 0.1 to 2.2 at%, deterioration of the structural quality was observed by reflection high-energy electron diffraction, atomic force microscopy and X-ray diffraction. Such a deterioration may be caused by an enhancement of island growth and formation of dislocations. On the other hand, room temperature photoluminescence spectra showed red emission at 622 nm due to an intra-atomic f–f transition of Eu³⁺ ion and Fourier transform infrared spectra indicated an absorption peak at about 0.37 eV, which may be due to a deep defect level. The intensity of the red luminescence and the defect-related absorption peak increased with increasing Eu concentration, and a close correlation in the increasing behavior was observed between them. These results suggest that the deep defect level plays an important role in the radiative transition of Eu³⁺ ion in GaN and the optical process for the luminescence at 622 nm was discussed with relation to the defect.     

Investigation on the origin of crystallographic tilt in lateral epitaxial overgrown GaN using selective etching

The crystallographic tilt of the lateral epitaxial overgrown (LEO) GaN on sapphire substrate with SiN_x mask is investigated by double crystal X-ray diffraction. Two wing peaks beside the GaN 0002 peak can be observed for the as-grown LEO GaN. During the selective etching of SiN_x mask, each wing peak splits into two peaks, one of which disappears as the mask is removed, while the other remains unchanged. This indicates that the crystallographic tilt of the overgrown region is caused not only by the plastic deformation resulted from the bending of threading dislocations, but by the non-uniformity elastic deformation related with the GaN/SiN_x interfacial forces. The widths of these two peaks are also studied in this paper.     

Features of sputtering of nitrides and their components

The sputtering behaviour of hexagonal or wurtzite polycrystal nitrides of boron, aluminium, and gallium was explored employing methods of molecular dynamics. The sputtering yield Y of nitrides and the average energy ē ₁ of emitted particles were studied as dependent on the mass m ₁ of bombarding He, Li, B, N, Ne, Al, Ar, Ni, Ga, Kr, and Xe ions with the initial energy E ₀ between 200 and 10,000 eV. Y(m ₁) and ē ₁(m ₁) were researched upon for preferential sputtering of nitride components at low E ₀. It was revealed that the ratio between the sputtering yield of the light component and that of the heavy one depends on ion energy and mass. At E ₀=200 eV and m ₁=40, the ratio for BN, AlN, and GaN amounts to 1.2, 2.2, and 2.4, respectively. For nitride components, an anomalous dependence of sputtering on ion mass was found, its maximum occurring at a certain ratio m ₂/m ₁, where m ₂ is the averagè mass of two nitride components.     

Zr2N2Se: The First Zirconium(IV) Nitride Selenide by the Oxidation of Zirconium(III) Nitride with Selenium

The oxidation of zirconium(III) nitride (ZrN) with suitable amounts of selenium (Se) in the presence of sodium chloride (NaCl) as flux yields small yellow brownish platelets of the first zirconium(IV) nitride selenide with the composition Zr₂N₂Se. The new compound crystallizes in the hexagonal space group P6₃/mmc (no. 194) with a = 363.98(2) pm, c = 1316.41(9) pm (c/a = 3.617) and two formula units per unit cell. The crystallographically unique Zr⁴⁺ cations are surrounded by three selenide and four nitride anions in the shape of a capped trigonal antiprism. The Se^2– anions are coordinated by six Zr⁴⁺ cations as trigonal prism and the N^3– anions reside in tetrahedral surrounding of Zr⁴⁺ cations. These [NZr₄]¹³⁺ tetrahedra become interconnected via three edges each to form $\rm^{2}_{\infty}$ {[(NZr_4/4)₂]²⁺} double layers parallel to the (001) plane, which are held together by monolayers of Se^2– anions.     

Accelerated surface flattening by alternating Ga flow in hydride vapor phase epitaxy

GaN films were grown on c$c$-plane sapphire substrates by using hydride vapor phase epitaxy (HVPE) with a pulsed flow of HCl over Ga metal. NH₃${\mathrm{NH}}_3$ gas supply was controlled to flow in a constant rate or in a modulated way. The surface morphology dependence of these films on the various flow modulation schemes was investigated. Depending on the duty cycle of NH₃${\mathrm{NH}}_3$ flow, the surface morphology of GaN films was sensitively modified. This sensitive response of surface morphology of GaN films to the flow modulation was attributed to diffusion efficiency variation of Ga species under different gas environment. Under proper modulation conditions, flattened top-surface morphology of nucleated domains was found to be obtained.     

MOCVD growth of GaN on Si(1 1 1) substrates using an ALD-grown Al2O3 interlayer

GaN thin films have been grown on Si(1 1 1) substrates using an atomic layer deposition (ALD)-grown Al₂O₃ interlayer. This thin Al₂O₃ layer reduces strain in the subsequent GaN layer, leading to lower defect densities and improved material quality compared to GaN thin films grown by the same process on bare Si. XRD ω-scans showed a full width at half maximum (FWHM) of 549 arcsec for GaN grown on bare Si and a FWHM as low as 378 arcsec for GaN grown on Si using the ALD-grown Al₂O₃ interlayer. Raman spectroscopy was used to study the strain in these films in more detail, with the shift of the E₂(high) mode showing a clear dependence of strain on Al₂O₃ interlayer thickness. This dependence of strain on Al₂O₃ thickness was also observed via the redshift of the near bandedge emission in room temperature photoluminescence (RT-PL) spectroscopy. The reduction in strain results in a significant reduction in both crack density and screw dislocation density compared to similar films grown on bare Si. Screw dislocation density of the films grown on Al₂O₃/Si substrates approaches that of typical GaN layers on sapphire. This work shows great promise for the use of oxide interlayers for growth of GaN-based LEDs on Si.     

Growth of epitaxial thin films of scandium nitride on 100-oriented silicon

A series of 100-oriented ScN films was grown under N-rich conditions on 100-oriented Si using different Sc fluxes. The ScN films grew in an epitaxial cube-on-cube orientation, with [0 0 1]_ScN//[0 0 1]_Si and [1 0 0]_ScN//[1 0 0]_Si, despite the high (11%) lattice mismatch between ScN and Si. The film grain size increases and the film ω-FWHM decreases with increasing Sc flux, but the film roughness increases. Films grown under similar conditions on 111-oriented Si resulted in mixed 111 and 100 orientations, indicating that the 100 orientation is favoured both due to texture inheritance from the substrate and due to the growth conditions used.