High-resolution X-ray diffraction analysis of the Bragg peak integrated intensity in highly mismatched III-N epilayers

A new method of measuring the thickness of GaN epilayers on sapphire (0 0 0 1) substrates by using double crystal X-ray diffraction was proposed. The ratio of the integrated intensity between the GaN epilayer and the sapphire substrate showed a linear relationship with the GaN epilayer thickness up to 2.12 μm. It is practical and convenient to measure the GaN epilayer thickness using this ratio, and can mostly eliminate the effect of the reabsorption, the extinction and other scattering factors of the GaN epilayers.     

Influence of Be on N composition in Be-doped InGaAsN grown by RF plasma-assisted molecular beam epitaxy

Undoped and Be-doped InGaAsN layers were grown on GaAs substrates under the same growth conditions by radio frequency plasma-assisted molecular beam epitaxy. Increased tensile strain (Δa/a=3×10⁻³) was observed for Be-doped InGaAsN layers, compared to undoped InGaAsN layers. The strain is shown to originate from the increase in N composition related to Be incorporation, rather than solely from Be atoms substituting Ga atom sites (Be_Ga). A possible reason is the high Be–N bond strength, which inhibits the loss of N from the growth surface during epitaxial growth, thereby increasing the N composition in the Be-doped InGaAsN layer.     

Wet KOH etching of freestanding AlN single crystals

We investigated defect-selective wet chemical etching of freestanding aluminum nitride (AlN) single crystals and polished cuts in a molten NaOH–KOH eutectic at temperatures ranging from 240 to 400 °C. Due to the strong anisotropy of the AlN wurtzite structure, different AlN faces get etched at very different etching rates. On as-grown rhombohedral and prismatic facets, defect-related etching features could not be traced, as etching these facets was found to mainly emphasize features present already on the un-etched surface. On nitrogen polar basal planes, hexagonal pyramids/hillocks exceeding 100 μm in diameter may form within seconds of etching at 240 °C. They sometimes are arranged in lines and clusters, thus we attribute them to defects on the surface, presumably originating in the bulk material. On aluminum polar basal planes, the etch pit density which saturates after approx. 2–3 min of total etching time at 350 °C equals the density of a certain type of dislocations (presumably screw dislocations) threading the surface. Smaller etch pits form around annealed indentations, in the vicinity of some bigger etch pits after repeated etching, and sometimes also isolated on the surface area. Although alternate explanations exist, we attribute these etch pits to threading mixed and edge dislocations. This paper features etching parameters optimized for different planes and models on the formation of etching features especially on the polar faces. Finally, the issue of reliability and reproducibility of defect detection and evaluation by wet chemical etching is addressed.     

Untersuchungen im System Ta—Mo—N

An isothermal section at 1,100°C and at nitrogen pressures in the range of 1 to 300 bar of the system Ta-Mo-N has been examined by X-ray techniques. The composition range of the ternary Z-phase TaMoN has been investigated with respect to nitrogen content and metal composition. A new ternary phase was found at a composition of Ta₃MoN_3+x.Within the -Mo₂N-phase up to 25% of the Mo-atoms can be replaced by Ta-atoms at nitrogen pressures of 300 bar, while only a small amount of the Taatoms can be replaced by Mo-atoms within the Ta-nitrides up to nitrogen pressures of 300 bar. Up to about 50% of the Mo-atoms can be substituted by W-atoms within the Z-phase.

     

Profiling band structure in GaN devices by electron holography

Electron holography in a field emission gun transmission electron microscope has been used to profile the inner potential V₀ across GaN/x nm In_0.1Ga_0.9N/GaN/(0 0 0 1) sapphire samples (x=10, 40 nm) grown by molecular beam epitaxy and viewed in cross-section. Results are presented which suggest a decrease in V₀ of 3–4 V across the InGaN layer in the [0 0 0 1] direction. It is proposed that the results can be explained by charge accumulation across the InGaN layer and that the opposing contributions due to piezoelectric and polarisation fields are effectively masked by Fermi level pinning.     

MBE growth of cubic AlyGa1−yN/GaN heterostructures—structural, vibrational and optical properties

Cubic Al_yGa_1−yN/GaN heterostructures on GaAs(0 0 1) substrates were grown by radio-frequency plasma-assisted molecular beam epitaxy. High resolution X-ray diffraction, micro-Raman, spectroscopic ellipsometry, and cathodoluminescence measurements were used to characterize the structural, optical and vibrational properties of the Al_yGa_1−yN epilayers. The AlN mole fraction y of the alloy was varied between 0.07<y<0.20. X-ray diffraction reciprocal space maps demonstrate the good crystal quality of the cubic Al_yGa_1−yN films. The measured Raman shift of the phonon modes of the Al_yGa_1−yN alloy was in excellent agreement with theoretical calculations. Both SE and CL of the Al_yGa_1−yN epilayer showed a linear increase of the band gap with increasing Al-content.     

Spectrally resolved electroluminescence microscopy and μ-electroluminescence investigation of GaN-based LEDs

We have studied the luminescence properties of GaN LEDs by electroluminescence microscopy (ELM) and micro-electroluminescence (μ-EL) spectroscopy. Spatial inhomogeneity in the deep level region of the spectra is observed in spectrally resolved ELM images. Room temperature μ-EL spectra measured from 5×5 μm² regions show anti-correlation of the defect-related recombination (E=1.95–2.45 eV) with the band-edge emission (E=3.18 eV).     

Polarization induced 2D hole gas in GaN/AlGaN heterostructures

The generation of high density 2D hole gases is crucial for further progress in the electronic and optoelectronic nitride devices. In this paper, we present systematic theoretical studies of Mg-doped GaN/AlGaN gated heterostructures and superlattices. Our calculations are based on a self-consistent solution of the multiband k.p Schrödinger and Poisson equation and reveal that the hole 2D sheet density is mainly determined by the polarization induced interface charges. For an aluminium concentration of 30%, the induced hole density in the heterostructure can reach values up to 1.5×10¹³ cm⁻². In the GaN/AlGaN superlattices, the hole sheet density increases with the superlattice period and saturates for a period of 40 nm at a value of 1.5×10¹³ cm⁻².     

Photoluminescence and its time evolution of AlN thin films

We report the room temperature photoluminescence measurements of AlN thin films stimulated by above-band-gap pulsed light excitation. Two AlN thin films with different composition and structure were studied. One AlN film, prepared by pulsed laser deposition from sintered aluminum nitride ceramic target, contains oxide impurities. The other one, prepared by plasma assisted reactive pulsed laser deposition from pure aluminum metal target, is composed of pure AlN compound. Upon the irradiation of the samples by 193 nm excimer laser pulses, both the as-grown AlN thin films luminesce in the ultraviolet and the green regions, peaked at 440 and 400 nm, respectively. We also examined the time evolution of the luminescence and found that the entire broad luminescence band decays non-exponentially at approximately the same rate.     

Advanced optical spectroscopy in nitrides and oxides: Some of the progress made during the past ten years

I review the recent progress made concerning the optical properties of (In,Al,Ga)N-based and (Zn,Mg)O-based epilayers and low dimensional systems like quantum wells, superlattices and microcavities.