乙炔和乙烯分子在Ge(001)表面吸附的第一性原理研究

采用基于密度泛函理论的第一性原理方法和平板模型研究了乙炔和乙烯分子在Ge(001)表面的吸附构型和电子结构. 通过系统考察一系列可能存在的吸附方式, 结果表明, 在0.5 monolayer(ML)覆盖度时, 两种分子的di-σ吸附构型最为稳定; 在覆盖度为1.0 ML时的最稳定吸附方式是paired end-bridge构型. 能带结构分析结果可知, 吸附构型以及吸附分子的覆盖度均对Ge(001)表面带隙有较大影响, 其原因在于费米能级附近的能带主要来自表面二聚体的Ge原子, 它们与表面Ge原子的配位环境密切相关, 而后者又取决于分子的吸附方式和覆盖度. 对于相同的吸附方式, 乙烯和乙炔分子具有类似的吸附行为和电子结构. 此外, 还进一步与Si(001)表面的研究结果进行对比.     

Molecular beam epitaxy growth of GaAs on an offcut Ge substrate

Molecular beam epitaxy growth of GaAs on an offcut Ge (100) substrate has been systemically investigated. A high quality GaAs/Ge interface and GaAs film on Ge have been achieved. High temperature annealing before GaAs deposition is found to be indispensable to avoid anti-phase domains. The quality of the GaAs film is found to strongly depend on the GaAs/Ge interface and the beginning of GaAs deposition. The reason why both high temperature annealing and GaAs growth temperature can affect epitaxial GaAs film quality is discussed. High quality In_0.17Ga_0.83As/GaAs strained quantum wells have also been achieved on a Ge substrate. Samples show flat surface morphology and narrow photoluminescence line width compared with the same structure sample grown on a GaAs substrate. These results indicate a large application potential for III--V compound semiconductor optoelectronic devices on Ge substrates.     

纳米尺度下Si/Ge界面应力释放机制的分子动力学研究

采用分子动力学方法研究了纳米尺度下硅(Si)基锗(Ge)结构的Si/Ge界面应力分布特征,以及点缺陷层在应力释放过程中的作用机制.结果表明:在纳米尺度下, Si/Ge界面应力分布曲线与Ge尺寸密切相关,界面应力下降速度与Ge尺寸存在近似的线性递减关系;同时,在Si/Ge界面处增加一个富含空位缺陷的缓冲层,可显著改变Si/Ge界面应力分布,在此基础上对比分析了点缺陷在纯Ge结构内部引起应力变化与缺陷密度的关系,缺陷层的引入和缺陷密度的增加可加速界面应力的释放.参考对Si/Ge界面结构的研究结果,可在Si基纯Ge薄膜生长过程中引入缺陷层,并对其结构进行设计,降低界面应力水平,进而降低界面处产生位错缺陷的概率,提高Si基Ge薄膜质量,这一思想在研究报道的Si基Ge膜低温缓冲层生长方法中初步得到了证实.     

C掺杂Mn3Ge的电子结构和磁性

采用第一性原理计算方法研究C掺杂对Mn₃Ge的影响.对Mn_3-xGeC_x的晶体结构进行几何优化,发现C原子最稳定的掺杂位置在正八面体的中心位置.研究其电子结构和总磁矩随C掺杂量的变化,发现总磁矩随着C浓度的增加先减小后增大,其中Mn₃GeC_0.4总磁矩接近零,可以实现完全的磁性补偿.研究Mn₃GeC_0.4多层膜的磁性,给出总磁矩接近零的Mn₃GeC_0.4多层膜结构,为Mn₃Ge的实际应用提供参考.     

Evaporation induced diameter control in fiber crystal growth by micro‐pulling‐down technique: Bi4Ge3O12

Diameter self‐control was established in Bi₄Ge₃O₁₂ fiber crystal growth by micro‐pulling‐down technique. In accordance with Bi₂O₃‐GeO₂ phase diagram, the diameter was controlled due to compensation of solidification with evaporation of volatile Bi₂O₃ self‐flux charged into the crucible with excess. The crucibles had capillary channels of 310 or 650 μm in outer diameter. The crystals up to 400 mm long and 50‐300 μm in diameter were grown at pulling‐down rates of 0.04‐1.00 mm/min. The melt composition and the pulling rate were generally only two parameters determining solidification rate. As a result, crystals with uniform (± 10%) diameter and aspect ratio up to 10⁴ were produced without automation of the process. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

离子束溅射制备Si/Ge多层膜及红外吸收性能研究

采用离子束溅射方法在Si衬底上制备Si/Ge多层膜.通过改变生长温度、溅射速率等因素得到一系列Si/Ge多层膜样品.通过X射线衍射、拉曼散射、原子力显微分析(AFM)等表征方法研究薄膜结构与生长条件的关系.在小束流(10mA)、室温条件下制备出界面清晰、周期完整的Si/Ge多层膜.通过红外吸收谱的测量发现薄膜样品具有较好的红外吸收性能.     

Perturbation of Ge(1 1 1) and Si(1 1 1)√3α-Sn surfaces by adsorption of dopants

We test the response of the √3 × √3α reconstructions formed by 1/3 monolayer of tin adatoms on silicon and germanium (1 1 1) surfaces upon doping with electrons or holes, using potassium or iodine as probes/perturbers of the initial electronic structures. From detailed synchrotron radiation photoelectron spectroscopy studies we show that doping with either electrons or holes plays a complimentary role on the Si and Ge surfaces and, especially, leads to complete conversion of the Sn 4d two-component spectra into single line shapes. We find that the low binding energy component of the Sn core level for both Si and Ge surfaces corresponds to Sn adatoms with higher electronic charge, than the Sn adatoms that contribute to the core level high binding energy signal. This could be analyzed as Sn adatoms with different valence state.     

Ge quantum dots growth on nanopatterned Si(0 0 1) surface: Morphology and stress relaxation study

The self-organized growth of germanium quantum dots on square nanopatterned Si(0 0 1) substrates is investigated by scanning tunnelling microscopy (STM) and grazing incidence X-ray diffraction (GIXRD) techniques. A regular surface patterning in the 10-100 nm period range is obtained by etching an interface dislocation network obtained by the controlled molecular bonding of Si substrates. The depth of the silicon surface profile is increased by a double etching process. Growth experiments are performed by solid source molecular beam epitaxy (MBE), and for deep trenches, germanium growth conditions are optimized to obtain one Ge dot per Si mesa. It is shown that the trench depth and the mesa profile strongly affect the dot size and its coincidence with the initial regular surface network. Anomalous GIXRD measurements are performed to highlight the Ge elastic relaxation and intermixing during heteroepitaxial growth. We report a significant modification in the stress state of Ge dots as a function of thermal annealing after growth.     

氮掺杂Ge2Sb2Te5相变存储器的多态存储功能

通过反应溅射的方法,制备了N掺杂的Ge2Sb2Te5(N-GST)薄膜,用作相变存储器的存储介质.研究表明,掺杂的N以GeN的形式存在,不仅束缚了Ge2Sb2Te5 (GST)晶粒的长大也提高了GST的晶化温度和相变温度.利用N-GST薄膜的非晶态、晶态面心立方相和晶态六方相的电阻率差异,能够在同一存储单元中存储三个状态,实现相变存储器的多态存储功能.     

电子碰撞激发机制中自电离与双电子俘获

 以Ge为例，研究了双电子复合代替自电离与双电子俘获对离子布居的影响；通过解包括双激发态和自电离与双电子俘获过程的速率方程组，研究了类F离子与类Ne离子基态对19.6nm与23.6nm激光线上、下能级的布居贡献因子及类Na离子与类Ne离子的电离速率，并讨论了这两条激光线的反转与增益。