INTERFACIAL CRACK ANALYSIS IN THREE-DIMENSIONAL TRANSVERSELY ISOTROPIC BI-MATERIALS BY BOUNDARY INTEGRAL EQUATION METHOD

The integral-differential equations for three-dimensional planar interfacial cracks of arbitrary shape in transversely isotropic bimaterials were derived by virtue of the Somigliana identity and the fundamental solutions, in which the displacement discontinuities across the crack faces are the unknowns to be determined. The interface is parallel to both the planes of isotropy. The singular behaviors of displacement and stress near the crack border were analyzed and the stress singularity indexes were obtained by integral equation method. The stress intensity factors were expressed in terms of the displacement discontinuities. In the non-oscillatory case, the hyper-singular boundary integral-differential equations were reduced to hyper-singular boundary integral equations similar to those of homogeneously isotropic materials.     

三维裂纹体应力强度因子的计算

本文采用塌缩三棱柱形奇异单元的位移计算应力强度因子，给出了一个新的全三维外推公式，它是Ｃｈｅｎ和Ｋｕａｎｇ公式〔１３〕的全三维推广，特例证明，它的精度比Ｉｎ－ｇｒａｆｆｅａ和Ｍａｎｕ的公式〔８〕高一阶。数值计算表明，结果稳定和对单元尺寸改变不敏感     

表面裂纹准静态扩展的有限元模拟计算

由于现有断裂准则未能考虑表面裂纹前沿各点实际断裂阻力的变化，所作的表面裂纹准静态扩展模拟计算不能很好地预测几何形貌的真实变化规律。本文提出了一个考虑应力状态不同对实际断裂阻力影响的变阻力断裂准则；并以该准则作为表面裂纹前沿局部断裂扩展的判据，通过三维有限元法进行了表面裂纹准静态扩展的模拟计算；还将模拟预测值与用多试件法测得的实验值进行比较，验证了变阻力断裂准则作为裂纹稳态扩展判据的有效性     

三维有限体中平片裂纹的超奇异积分方程方法——Ⅰ、理论分析

本文利用单个平片裂纹的基本解,将三维有限体中的平片裂纹问题,归为解一组超奇异积分方程,然后使用主部分析方法,对这组方程的求解作了理论分析,其结果在本文的第Ⅰ部分给出,关于这组方程的数值法求解,则给出于本文的第Ⅱ部分。     

含界面裂纹的不可压缩双金属胶接件的解析变分－守恒积分解法

本文根据平面问题的复变函数理论推导了含界面裂纹双金属胶接件满足微分方程、开裂界面边界条件与未开裂界面连续条件的应力与位移本征函数展开式，并建立了不可压缩双金属界面裂纹的复合型守恒积分及其与应力强度因子之关系，进而利用分区广义变分原理满足其余边界条件确定包含应力强度因子在内的展开式系数，得到守恒积分并求出应力强度因子．数值计算表明，沿不同回路的在恒积分具有很好的守恒性而且由这两种方法所得应力强度因子具有很好的一致性．     

Defect assessment procedure based on ductile tearing process

Strain hardening, crack growth resistance and nonuniform load distribution have significant effects on the ductile tearing process. A defect assessment procedure incorporating with the above features is proposed in the present paper, with the final appearance of “design curves” to facilitate engineering applications.     

Fatigue damage evolution in silicon films for micromechanical applications

In this paper we examine the conditions for surface topography evolution and crack growth/fracture during the cyclic actuation of polysilicon microelectromechanical systems (MEMS) structures. The surface topography evolution that occurs during cyclic fatigue is shown to be stressassisted and may be predicted by linear perturbation analyses. The conditions for crack growth (due to pre-existing or nucleated cracks) are also examined within the framework of linear elastic fracture mechanics. Within this framework, we consider pre-existing cracks in the topical SiO₂ layer that forms on the Si substrate in the absence of passivation. The thickening of the SiO₂ that is normally observed during cyclic actuation of Si MEMS structures is shown to increase the possibility of stable crack growth by stress corrosion cracking prior to the onset of unstable crack growth in the SiO₂ and Si layers. Finally, the implications of the results are discussed for the prediction of fatigue damage in silicon MEMS structures.     

变分法在含边裂纹正交各向异性板中的应用

文中给出了含边裂纹正交各向异性板问题的特征函数展开式，然后利用变分法及边值条件确定展开式中的未知系数，从而可求得裂端应力强度因子。该方法即可应用于应力边界值和位移边界值问题，又适应混合边界值问题。数值计算结果证实了该方法的有效性。     

弹塑性平面Ⅰ型裂纹应力场的一个摄动解析解

本文利用摄动方法,得到了幂硬化材料平面Ⅰ型裂纹端应力奇异场的一个解析表达式,并与HRR数值结果进行了比较。分析表明:当硬化指数在[1,∞)变化时,应力场的结构形式不发生变化,为三角函数的线性组合。在一定的幂硬化指数变化范围内,解析解是数值解的很好近似,对应力分量σ_(θθ)和σ_(vθ),这一特点尤为突出。该解析解形式简洁,明了,可为弹塑性断裂的工程应用提供方便。     

LY12铝疲劳裂纹在冲击载荷下的演化研究

对LY12铝合金在低周疲劳条件下的裂纹情况和随后进行的动态拉伸条件下裂纹的发展给予了观察和统计分析，发现裂纹的累积数密度分布在损伤演化过程中保持指数形式，用NAG模型对实验结果进行分析，得出该材料裂纹演化发展方程的各种参数。