MOVPE生长GaN薄膜的表面吸附和扩散研究

利用量子化学计算方法,对MOVPE生长GaN薄膜的表面反应进行研究.特别针对反应前体GaCH3(简称MMG)在理想、H覆盖和NH2覆盖GaN(0001)面的吸附和扩散进行计算分析.通过建立3×3 超晶胞模型,优化计算了MMG在三种不同覆盖表面的稳定吸附位、吸附能和电子布居,搜寻了MMG在稳定吸附位之间的扩散能垒.计算结果表明:对于三种表面,MMG的稳定吸附位均为T4位和H3位,H3位比T4位略微稳定.MMG在NH2覆盖表面吸附能最大,在H覆盖表面吸附能最小,在理想表面吸附能居中.MMG中的Ga与不同的表面原子形成的化学键的键强的大小顺序为:Ga-N>Ga-Ga>Ga-H.相比于理想表面和H覆盖表面,MMG在NH2覆盖表面的扩散能垒最大,因此表面过量的NH2会抑制MMG的扩散.     

TMIn流量对GaN基蓝光LED外延薄膜的影响

以蓝宝石(Al2O3)为衬底,采用有机金属化学气相沉积(MOCVD)技术生长InGaN/GaN多量子阱结构.本文通过调整外延生长过程中三甲基铟(TMIn)流量,研究了TMIn流量对InGaN/GaN多量子阱结构的合金组分、晶体质量和光学性质的影响.本文采用高分辨X射线衍射(HRXRD)、原子力显微镜(AFM)和光致发光(PL)测试表征其结构和光学性质.HRXRD测试结果表明,随TMIn流量增加,"0"级峰与GaN峰之间角偏离增大,更多的In并入薄膜中.HRXRD与AFM表征结果表明:增大TMIn流量会导致外延薄膜中的位错密度增大,V形坑数量增加,晶体质量严重恶化;PL测试结果表明,随着TMIn流量增加,发光强度逐渐降低,半高宽增大,这是由于晶体质量恶化所导致.因此严格控制铟源流量对于改善量子阱薄膜的晶体质量与光学性质有着至关重要的作用.     

GaN/In_xGa_(1-x)N型最后一个量子势垒对发光二极管内量子效率的影响

GaN/In_xGa_(1-x)N型最后一个量子势垒结构能有效提高发光二极管(LED)器件内量子效率,缓解LED效率随输入电流增大而衰减的问题.本文综述了该结构及其结构变化——In组分梯度递增以及渐变、GaN/In_xGa_(1-x)N界面极化率改变等对改善LED器件性能的影响及优势,归纳总结了不同结构的GaN/In_xGa_(1-x)N型最后一个量子垒的工作机理,阐明极化反转是该结构提高LED性能的根本原因.在综述该结构发展的基础之上,通过APSYS仿真计算,进一步探索和深入分析了该结构中In_xGa_(1-x)N层的In组分及其厚度变化对LED内量子效率的影响.结果表明:In组分的增加有助于在GaN/In_xGa_(1-x)N界面产生更多的极化负电荷,增加GaN以及电子阻挡层处导带势垒高度,减少电子泄漏,从而提高LED的内量子效率;但GaN/In_xGa_(1-x)N型最后一个量子势垒中In_xGa_(1-x)N及GaN层厚度的变化由于会同时引起势垒高度和隧穿效应的改变,因而In_xGa_(1-x)N和GaN层的厚度存在一个最佳比值以实现最大化的减小漏电子,提高内量子效率.     

砷化镓光电阴极光谱响应与吸收率关系分析

为了研究砷化镓(GaAs)光电阴极光谱响应与吸收率曲线间的关系,采用分子束外延法(MBE)和金属有机化合物化学气相沉积法(MOCVD)制备了两类GaAs光电阴极,并测试得到了样品吸收率和光谱响应实验曲线.对每个样品的这两条曲线在同一坐标系中做最大值归一化处理,将归一的光谱响应曲线与归一的吸收率曲线做除法,得到了类似光电阴极表面势垒的形状.结果表明,两种方法制备的光电阴极光谱响应曲线相比吸收率曲线都发生了红移,MBE样品偏移量稍大于MOCVD样品.短波吸收率不截止,光谱响应截止于500 nm左右;可见光波段上,光谱响应曲线的峰值位置相比吸收率曲线红移了几百meV;近红外区域,光谱响应曲线的截止位置相比吸收率曲线红移了几个meV.MOCVD样品中杂质对带隙的影响更小,光谱响应相比吸收率发生的能量偏移更小.这些结论对提高GaAs光电阴极光电发射性能有指导意义.     

GaN基HEMT器件的缺陷研究综述

GaN基高电子迁移率晶体管(HEMT)因具有高输出功率密度、高工作频率、高工作温度等优良特性,在高频大功率等领域具有广泛应用前景。目前,HEMT器件在材料生长和工艺制备方面都取得了巨大的进步。但是,由缺陷产生的陷阱效应一直是限制其发展的重要原因。本文首先论述了HEMT器件中的表面态、界面缺陷和体缺陷所在位置及其产生的原因。然后,阐述了由陷阱效应引起的器件电流崩塌、栅延迟、漏延迟、Kink效应等现象,从器件结构设计和工艺设计角度,总结提出了改善缺陷相关问题的主要措施,其中着重总结了器件盖帽层、表面处理、钝化层和场板结构4个方面的最新研究进展。最后,探索了GaN基HEMT器件在缺陷相关问题上的未来优化方向。     

GaN衬底掺杂模式对ZnO纳米棒光学性质的影响

本文通过水热法在u-GaN(undoped GaN)/Al2 O3和p-GaN/Al2O3衬底上制备了ZnO纳米棒阵列.利用X射线衍射仪(XRD)、高分辨X射线衍射仪(HRXRD)、场发射扫描电子显微镜(FESEM)、原子力显微镜(AFM)和光致发光谱(PL)对样品进行表征,研究在无种子层和金属催化剂情况下u-GaN/Al2 O3和p-GaN/Al2O3衬底对ZnO纳米棒生长的影响.结果表明,在u-GaN和p-GaN上生长的ZnO纳米棒均为六方纤锌矿结构.在p-GaN上生长的ZnO纳米棒直径较细且密度更大,这可能是由于p-GaN界面比较粗糙,界面能量较大,为ZnO的生长提供了更多的形核区域;与生长在u-GaN上的ZnO纳米棒阵列相比,p-GaN上所沉积的ZnO纳米棒在378.3 nm处有一个较强的近带边发射峰,且峰强比较大,说明在p-GaN上所制备的ZnO纳米棒的晶体质量和光学性能更好.     

Groove-type channel enhancement-mode Al GaN/GaN MIS HEMT with combined polar and nonpolar AlGaN/GaN heterostructures

A novel groove-type channel enhancement-mode AlGaN/GaN MIS high electron mobility transistor(GTCE-HEMT)with a combined polar and nonpolar AlGaN/GaN heterostucture is presented. The device simulation shows a threshold voltage of 1.24 V, peak transconductance of 182 m S/mm, and subthreshold slope of 85 m V/dec, which are obtained by adjusting the device parameters. Interestingly, it is possible to control the threshold voltage accurately without precisely controlling the etching depth in fabrication by adopting this structure. Besides, the breakdown voltage(VB) is significantly increased by 78% in comparison with the value of the conventional MIS-HEMT. Moreover, the fabrication process of the novel device is entirely compatible with that of the conventional depletion-mode(D-mode) polar AlGaN/GaN HEMT. It presents a promising way to realize the switch application and the E/D-mode logic circuits.     

Effects of multiple interruptions with trimethylindium-treatment in the InGaN/GaN quantum well on green light emitting diodes

In this study, the influence of multiple interruptions with trimethylindium(TMIn)-treatment in InGaN/GaN multiple quantum wells(MQWs) on green light-emitting diode(LED) is investigated. A comparison of conventional LEDs with the one fabricated with our method shows that the latter has better optical properties. Photoluminescence(PL) full-width at half maximum(FWHM) is reduced, light output power is much higher and the blue shift of electroluminescence(EL) dominant wavelength becomes smaller with current increasing. These improvements should be attributed to the reduced interface roughness of MQW and more uniformity of indium distribution in MQWs by the interruptions with TMIn-treatment.     

Small-signal modeling of GaN HEMT switch with a new intrinsic elements extraction method

A novel and accurate method is proposed to extract the intrinsic elements of the GaN high-electron-mobility transistor(HEMT) switch.The new extraction method is verified by comparing the simulated S-parameters with the measured data over the 5-40 GHz frequency range.The percentage errors E_(ij) within 3.83% show the great agreement between the simulated S-parameters and the measured data.     

Sulphide passivation of GaN based Schottky diodes

Wet chemical passivation of n-GaN surface was carried out by dipping GaN samples in ammonium sulphide diluted in aqueous and alcoholic solvent base solutions. Photoluminescence (PL) investigations indicated that sulphide solution effectively led to the reduction of GaN surface states. Increased band edge PL peak showed that S²⁻ ions are more active in alcohol based solvents. X-ray photoelectron spectroscopy revealed reduction in surface oxides by introduction of sulphide species. Ni/n-GaN Schottky barrier diodes were fabricated on passivated surfaces. Remarkable improvement in the Schottky barrier height (0.98 eV for passivated diodes as compared to 0.75 eV for untreated diodes) has been observed.