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Conventionally, surface roughness is predominantly determined through the use of stylus instruments. However, there are certain limitations involved in the method, particularly when a test specimen, such as a silicon wafer, has a smooth mirror-like surface. Hence, it is necessary to explore alternative non-contact techniques. Light scattering has recently been gaining popularity as an optical technique to provide prompt and precise inspection of surface roughness. In this paper, the total integrated scattering (TIS) model is modified to retrieve parameters on surface micro-topography through light scattering. The applicability of the proposed modified TIS model is studied and compared with an atomic force microscope. Experimental results obtained show that the proposed technique is highly accurate for measuring surface roughness in the nanometer range. 相似文献
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Soraya A. Khodier 《Optics & Laser Technology》2004,36(1):355-67
A combined interference and diffraction pattern, in the form of equidistant interference fringes, resulting from illuminating a vertical metallic wire by a laser beam is analyzed to measure the diameter of four standard wires. The diameters range from 170 to 450 μm. It is found that the error in the diameter measurements increases for small metallic wires and for small distances between the wire and the screen due to scattering effects. The intensity of the incident laser beam was controlled by a pair of sheet polaroids to minimize the scattered radiation. The used technique is highly sensitive, but requires controlled environmental conditions and absence of vibration effects. The expanded uncertainty for k=2 is calculated and found to decrease from U(D)=±1.45 μm for the wire of nominal diameter 170 μm to ±0.57 μm for the diameter 450 μm. 相似文献
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G. Carelli A. Di Siena N. Ioli A. Moretti G. Moruzzi F. Strumia 《International Journal of Infrared and Millimeter Waves》1994,15(4):619-633
We have measured the frequencies of four CH3OH far-infrared laser lines that were previously known only by wavelength measurement. Two of these lines turned out to be doublets, bringing the total number of measured lines to six. We can now confirm the assignments of five of them and definitely disprove the assignments proposed for the sixth.In particular we confirm the assignments for the four strong laser lines at 205 and 208 µm pumped by the 9-P(34) CO2 laser line. These lines share a common upper level in the first excited CO-stretch state, and terminate in the upper and lower levels of a hybrid state with J=5. Heterodyne frequency measurements and conventional microwave spectroscopy show that both lines are split into two components approximately 3.5 MHz apart. The origin of this further splitting is interpreted as a perturbed K-splitting.Work supported by Consiglio Nazionale delle Ricerche -Italia 相似文献
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提出级联佛克脱型原子滤光器(Linked VADOF)的新构想。从理论上分析并计算了级联佛克脱型原子滤光器的透射谱。结果表明,级联佛克脱型原子滤光器将佛克脱型原子滤光器的多峰改造为单峰结构,具有比佛克脱型原子滤光器更窄的线宽和更高的噪声抑制比。将这种新型结构应用于激光信标锁频。该锁频方案提高了信标光频率的稳定性。在此基础上,给出了发射端采用级联佛克脱型原子滤光器锁频,接收端采用法拉第型原子滤光器(FADOF)滤光的新型卫星激光链路系统。外场初步联调实验表明了该系统的可行性。 相似文献
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Conducting drop tests to investigate impact behavior and identify failure mechanisms of small-size electronic products is
generally expensive and time-consuming. Nevertheless, strict drop/impact performance criteria for hand-held electronic products
such as cellular phones play a decisive role in the design because they must withstand unexpected shocks. The design of product
durability on impact has heavily relied on the designer's intuition and experience. In this study, a reliable drop/impact
simulation for a cellular phone is carried out using the explicit code LS-DYNA. Subsequently globallocal experimental verification
is accomplished by means of high-speed photography and impact response measurement. Using this methodology, we predict potential
damage locations in a cellular phone and compare them with real statistical data. It is envisaged that development of a reliable
methodology of drop/impact simulation will provide us with a powerful and efficient vehicle for improvement of the design
quality and reduction of the product development cycle. 相似文献