Bipolar tri-state resistive switching characteristics in Ti/CeO_x/Pt memory device

Highly repeatable multilevel bipolar resistive switching in Ti/Ce Ox/Pt nonvolatile memory device has been demonstrated. X-ray diffraction studies of Ce O2 films reveal the formation of weak polycrystalline structure. The observed good memory performance, including stable cycling endurance and long data retention times（〉10^4s） with an acceptable resistance ratio（～10^2）, enables the device for its applications in future non-volatile resistive random access memories（RRAMs）. Based on the unique distribution characteristics of oxygen vacancies in Ce Ox films, the possible mechanism of multilevel resistive switching in Ce Ox RRAM devices has been discussed. The conduction mechanism in low resistance state is found to be Ohmic due to conductive filamentary paths, while that in the high resistance state was identified as Ohmic for low applied voltages and a space-charge-limited conduction dominated by Schottky emission at high applied voltages.     

Nanoscale Tapered Pt Bottom Electrode Fabricated by FIB for Low Power and Highly Stable Operations of Phase Change Memory

Phase change random access memory （PC-RAM） based on Si2Sb2Te5 with a Pt tapered heating electrode （Pt-THE）, which is fabricated using a focus ion beam （FIB）, is investigated. Compared with the tungsten electrode, the Pt-THE facilitates the temperature rise in phase change material, which causes the decrease of reset voltage from 3.6 to 2.7 V. The programming region of the cell with the Pt-THE is smaller than that of the cell with a cylindrical tungsten heating electrode. The improved performance of the PC-RAM with a Pt-THE is attributed to the higher resistivity and lower thermal conductivity of the Pt electrode, and the reduction of the programming region, which is also verified by thermal simulation.     

Si3.5Sb2Te3 Phase Change Material for Low-Power Phase Change Memory Application

Novel Si3.5Sb2Te3 phase change material for phase change memory is prepared by sputtering of Si and Sb2Te3 alloy targets. Crystalline Si3.5Sb2Te3 is a stable composite material consisting of amorphous Si and crystalline Sb2Te3, without separated Te phase. The thermally stable Si3.5Sb2Te3 material has data retention ability （10 years at 412K） better than that of the Ge2Sb2Te5 material （10 years at 383 K）. Phase change memory device based on Si3.5Sb2Te3 is successfully fabricated, showing low power consumption. Up to 2.2 × 107 cycles of endurance have been achieved with a resistance ratio lager than 300.     

Thermal Stability of Reliable Polycrystalline Zirconium Oxide for Nonvolatile Memory Application

Thermal stability of resistive switching of stoichiometric zirconium oxide thin films is investigated for high yielding nonvolatile memory application. The A1/ZrO2/AI cell fabricated in the conventional device process shows highly reliable switching behaviour between two distinct stable resistance states. The retention capabilities are also tested under various conditions and temperatures. The excellent performance of Ai/ZrO2/AI ceil can be explained by assuming that anode/ZrO2 interface exists and by conducting filament forming/rupture mechanism. The device failure is illustrated in terms of permanent conducting filaments formation.     

A 0.18-μm 3.3 V 16 k Bits 1RIT Phase Change Random Access Memory （PCRAM） Chip

Using standard 0.18-μm CMOS process and the special platform for S-inch phase change random access memory （PCRAM）, the first Chinese 16k bits PCRAM chip has been successfully achieved. A 1RIT structure has been designed for low voltage drop and low cost compared to the 1RlD structure and the BJT-switch structure. Full integration of the 16k bits PCRAM chip, including memory cell, array structure, critical circuit module, and physical layout, has been designed and verified. The critical integration technology of the phase change material （PCM） fabrication and the standard CMOS process has been solved. Test results about PCM in a large-scale array have been generated for the next research of PCRAM chip.     

静态随机访问存储器型现场可编程门阵列辐照效应测试系统研制

 在调研静态随机访问存储器型现场可编程门阵列(FPGA)器件空间辐照效应失效机理的基础上,详细论述FPGA辐照效应测试系统内部存储器测试、功能测试及功耗测试的实现原理,给出了系统的软硬件实现方法。所建立的系统可以测试FPGA器件的配置存储器翻转截面、块存储器翻转截面、功能失效截面、闭锁截面等多个参数,其长线传输距离达到50 m以上,最大可测门数达到了100万门,为FPGA辐照效应研究提供了测试平台。     

生物光盘系统参数对输出信号的影响研究

以Hopkins光盘标量衍射理论为基础,建立了生物光盘系统理论分析模型,根据生物光盘的工作特点,研究了光学系统参数、传感单元尺寸参数对系统输出信号的影响。计算结果表明,为实现较高的传感灵敏度,理想情况下聚焦光斑直径与方形传感单元最佳长、宽的匹配关系需满足1：0．5665。选取数值孔径NA=0．07,高斯参数σ最佳取值为0．7,此时矩形传感单元最佳尺寸为4．3μm×4．3μm,并给出了理想情况下输出光功率最小值只与传感单元高度的线性关系。     

重离子辐照带有ECC的65 nm SRAM器件“伪多位翻转”特性研究

为了提高纠错编码（ECC）的有效性,先进的静态随机存储器（SRAM）多采用位交错结构。但是,在没有物理版图信息的情况下,位交错设计使得从辐照测试数据中提取出多单元翻转（MCU）变得更加困难。运用Bi离子辐照带有ECC的65 nm SRAM器件,研究了该款器件在重离子辐照下的敏感性。为"伪多位翻转（FMBU）"以及MCU的数据分析提供了理论指导和帮助,完善了判别MCU的基本法则。除此之外,研究结果表明,ECC的汉明编码对于纳米器件的效果不够理想。在未来的空间应用中,需考虑更高层次的编码算法来抵抗单粒子翻转。In order to improve the robustness of error-correcting codes (ECC), modern static random access memory (SRAM) always use bit-interleaving structure. However, in the absence of physical layout information, the bit-interleaving design makes it more difficult to extract the multiple-cell upset (MCU) from the test data. In this paper, the sensitivity of Bi ion irradiation was investigated in a 65 nm technology SRAM with ECC. The experimental results provide a theoretical guidance and help for the fake multiple-bit upset (FMBU) and MCU data analyzing, which improve and perfect the basic rules extracting MCU from the test data. In addition, the results show that the performance of hamming encoding is not ideal in Nano scale SRAM. In the future of space applications, it is necessary to consider more advanced algorithms to against SEU.     

一种高效的星载高速固态存储器坏块管理算法

随着卫星技术的发展和功能的多样化,星载固态存储器需要存储的数据量越来越大,存储速率越来越高,在轨寿命越来越长。基于NAND Flash的星载固态存储器的并行存储方案得到广泛应用。但是由于NAND Flash存在初始坏块,且Flash芯片中坏块分布离散性较大。当固态存储器存储速率较高,并行存储的Flash芯片数增多,坏块经叠加映射后,使固态存储器有效容量损失较大。针对高速固态存储器的坏块问题,提出了一种高效的坏块管理算法,通过对坏块进行地址映射和替换,使固态存储器初始有效容量与装机容量的比值在高速并行存储的情况下仍能保持在97%左右,提高了Flash芯片存储容量的利用率,延长了大容量星载高速固态存储器的使用寿命。     

电离总剂量对纳米SRAM器件单粒子翻转敏感性的影响

电离总剂量（TID）与单粒子效应（SEE）是纳米SRAM器件在航天应用中的主要威胁。随着CMOS工艺的进步,两种辐射效应在纳米SRAM器件中的协同效应出现了一些新现象,有必要进一步开展深入研究。利用γ射线以及不同种类重离子对两款纳米SRAM器件开展了辐照实验,研究了不同辐照参数、测试模式以及数据图形条件下,电离总剂量对单粒子翻转（SEU）敏感性的影响。研究结果表明,γ射线辐照过后,存储单元中反相器开关阈值减小,漏电流增大,导致SRAM存储单元抗翻转能力降低,SEU截面有明显增大;未观察到"印记效应",数据图形对测试结果没有明显影响;多位翻转（MBU）比例无明显变化。