Long wavelength InAs self-assembled quantum dots embedded in GaNAs strain-compensating layers

We investigated the effect of GaNAs strain-compensating layers (SCLs) on the properties of InAs self-assembled quantum dots (QDs) grown on GaAs (0 0 1) substrates. The GaNAs material can be used as SCL thereby minimizing the net strain, and thus is advantageous for multi-stacking of InAs QDs structures and achieving long wavelength emission. The emission wavelength of InAs QDs can be tuned by changing the nitrogen (N) composition in GaNAs SCLs due to both effects of strain compensation and lowering of potential barrier height. A photoluminescence emission at 77 K was clearly observed for sample with GaN_0.024As_0.976 SCL. Further, we observed an improvement of optical properties of InAs QDs by replacing the more popular GaAs embedding layers with GaNAs SCLs, which is a result of decreasing non-radiative defects owing to minimizing the total net strain.     

Stacking of multilayer InAs quantum dots with combination capping of InAlGaAs and high temperature grown GaAs

We are reporting the growth of multilayer stacks of quantum dots (10 periods) with a combination capping of In_0.21Al_0.21Ga_0.58As (30 Å) and GaAs (70–180 Å) grown by solid source molecular beam epitaxy (MBE). Reflection high energy electron diffraction (RHEED) has been used for the insitu monitoring of quantum dot (QD) formation in heterostructure samples. The samples were also characterized by other exsitu techniques like cross sectional transmission electron microscopy (XTEM) and photoluminescence measurements (PL). For a heterostructure sample with thin barrier thickness (<100 Å), an XTEM image showed the stacking of QDs only up to the 5th layer and in the upper layers there was hardly any formation of dots. We presume the stoppage of dot formation is due to the uneven surface of the InAlGaAs alloy overgrown on the InAs QDs, as a result of the local compositional deviations of the Group-III atoms. Samples grown with thicker barriers (>100 Å of GaAs) showed good stacking of islands until the tenth layer. The thick GaAs layer overgrown on the InAlGaAs at 590 ^°C is believed to remove the surface modifications of the quaternary layer thereby creating a smoother surface front for the growth of subsequent QD layers.     

Fabrication of BDD quantum node switches on embedded GaAs quantum wires grown by selective MBE

In view of applications to hexagonal binary decision diagram (BDD) LSIs, a first attempt is made to form quantum BDD node switches on selectively grown (SG) embedded quantum wires (QWRs) by molecular beam epitaxy (MBE). SG branch switches controlled by a Schottky wrap gate (WPG) were successfully fabricated by MBE growth and subsequent device processing. Gate control characteristics were studied by gate-dependent Shubnikov–de-Haas measurements, and the behavior was found to be similar to that of devices fabricated on wires by etching. The switch exhibited clear conductance quantization at low temperature, and temperature dependence of the voltage slope of conductance jump was clarified. A Y-branch BDD node device using two SG branch switches was successfully fabricated, and realized clear path switching characteristics.     

Effects of phosphorous beam equivalent pressure on GaInAsP/GaAs grown by solid source molecular beam epitaxy with a valve phosphorous cracker cell

We report the growth and characterization of GaInAsP films on GaAs substrates by solid source molecular beam epitaxy (SSMBE) using a valve phosphorous cracker cell at varied white phosphorous beam equivalent pressure (BEP). It is found that the GaInAsP/GaAs can be easily grown with the solid sources, and the incorporated phosphorous composition as a function of the beam equivalent pressure ratio, R=f_P/(f_P+f_As), can be well described by a parabolic relationship. With the increase of the incorporated phosphorous composition, the GaP-, InP-, InAs- and GaAs-like phonon modes shift towards opposite directions and their emission intensities also change. The first three modes shift to larger wave numbers while the last one shifts to smaller wave number. The lattice mismatch, Δa/a, of the materials grown with varied phosphorous BEP follows a linear relationship. Photoluminescence (PL) measurements reveal that as the phosphorous BEP ratio increases, the peak position or energy band gap of the material shifts towards higher energy; the full-width at half-maximum (FWHM) becomes narrower, and the luminescence intensity becomes higher. In addition, the materials also show smooth surfaces that do not change significantly with phosphorous beam equivalent pressure.     

Formation and dissolution of InAs quantum dots on GaAs

In situ reflection high energy electron diffraction (RHEED) has been used to study the time evolution during self-assembled molecular beam epitaxy (MBE) growth of InAs quantum dots on GaAs. Using a special data acquisition technique, two characteristic time constants are determined very precisely: the time t_c up to the first appearance of InAs dots and the time t_f it takes to complete the 2D–3D transition of all islands. Surprisingly, we find that t_c increases with temperature which disagrees with a thermally activated process. In contrast to this, t_f behaves Arrhenius-like and an activation energy of E_f0.39 eV is determined. Furthermore, the sum t_c+t_f does not depend significantly on temperature and corresponds to an InAs coverage of 2.0 monolayers. A second focus of this paper is the study of dissolution of InAs dots after interruption of the As flux. From the experiments, an activation energy of 3.2 eV for desorption of In located on top of the wetting layer is determined, whereas direct desorption from the wetting layer corresponds to an activation energy of 3.4 eV.     

Temperature quenching mechanisms for photoluminescence of MBE-grown chlorine-doped ZnSe epilayers

We report on a detailed investigation on the temperature-dependent behavior of photoluminescence from molecular beam epitaxy (MBE)-grown chlorine-doped ZnSe epilayers. The overwhelming neutral donor bound exciton (Cl⁰X) emission at 2.797 eV near the band edge with a full-width at half-maximum (FWHM) of 13 meV reveals the high crystalline quality of the samples used. In our experiments, the quick quenching of the Cl⁰X line above 200 K is mainly due to the presence of a nonradiative center with a thermal activation energy of 90 meV. The same activation energy and similar quenching tendency of the Cl⁰X line and the I₃ line at 2.713 eV indicate that they originate from the same physical mechanism. We demonstrate for the first time that the dominant decrease of the integrated intensity of the I₃ line is due to the thermal excitation of the “I₃ center”-bound excitons to its free exciton states, leaving the “I₃ centers” as efficient nonradiative centers. The optical performance of ZnSe materials is expected to be greatly improved if the density of the “I₃ center” can be controlled. The decrease in the luminescence intensity at moderately low temperature (30–200 K) of the Cl⁰X line is due to the thermal activation of neutral-donor-bound excitons (Cl⁰X) to free excitons.     

InAs Quantum Dots On (001) GaAs Substrate with two Groups of Different Sizes Under Arsenic Shutter Closed Condition

The effect of temperature on the self-assembled InAs quantum dots (QDs) grown on GaAs substrate under arsenic shutter closed condition has been studied. From atomic force microscopy (AFM), it was found that the size of InAs dots exhibited a transition from single-sized uniformly distributed quantum dot (QD) at a growth temperature of 490°C to two groups of different sizes QDs at 510°C. Since the desorption rate of In atoms from the substrate surface is very high at 510°C, a growth model is proposed that attributes the larger sized QDs to the enhanced capture of desorbed In atoms by a local random protrusion which initiates a regenerative capture and growth process and leads to explosive growth.     

Fabrication and characterization of n-ZnO on p-SiC heterojunction diodes on 4H-SiC substrates

We report on the growth and characterization of n-ZnO/p-4H-SiC heterojunction diodes. Our n-ZnO layers were grown with radical-source molecular beam epitaxy (RS-MBE) on p-4H-SiC epilayers, which was previously prepared in a horizontal hot-wall reactor by chemical vapour deposition (CVD) on the n-type 4H-SiC wafers. Details on the n-ZnO growth on 8-off 4H-SiC wafers, the quality of the layers and the nature of realized p–n structures are discussed. Mesa diode structures were fabricated. Al was sputtered through a circle mask with diameter 1 mm and annealed to form Ohmic contacts to p-SiC. Ohmic contacts to the n-ZnO were formed by 30 nm/300 nm Ti/Au sputtered by electron beam evaporation. Electrical properties of the structures obtained have been studied with Hall measurements, and current–voltage measurements (I–V). I–V measurements of the device showed good rectifying behavior, from which a turn-on voltage of about 2 V was obtained.     

Ni/Ag Schottky contacts on Al0.11Ga0.89N grown on Si (1 1 1) substrate by plasma-assisted MBE

Al_0.11Ga_0.89N/GaN samples are grown by plasma-assisted molecular beam epitaxy method on (1 1 1) silicon substrates. High purity gallium (7N) and aluminum (6N5) were used to grow Al_0.11Ga_0.89N, GaN, and AlN, respectively. The surface morphology, structural and optical properties of the sample has been investigated by scanning electron microscope (SEM), and high-resolution X-ray diffraction (HR-XRD), respectively. HR-XRD measurement showed that the sample has a typical diffraction pattern of hexagonal Al_0.11Ga_0.89N/GaN heterostructures. Ni/Ag bilayers are deposited on Al_0.11Ga_0.89N as the Schottky contacts. The effect of annealing in oxygen ambient on the electrical properties of Ni/Ag/Al_0.11Ga_0.89N is studied by current–voltage measurement. The annealing at a temperature of 700 °C for 10?min results in an increase in the ideality factor from 1.033 to 1.042 and an increase in the Schottky barrier height from 0.708 to 0.811 eV. Furthermore, the annealing in oxygen ambient also leads to an increase in the surface roughness of the contacts from 0.0098 to 0.1360 μm which is in agreement with the SEM results.     

Effects of composition grading at heterointefaces and layer thickness variations on Bragg mirror quality

GaAs/AlAs Bragg mirrors on GaAs with varied number of layer pairs were grown, by molecular beam epitaxy (MBE), to be applied for semiconductor saturable absorber mirrors (SESAMs) and intensity modulators. Due to the random variation of the growth rate, substrate surface roughness, and interdiffusion at the interfaces, precise control of the growth conditions of deposited layers poses a serious problem. Usually, thickness variations and composition grading at the heterointefaces result in variations of the mirror reflectivity. In this paper, the high resolution X-ray diffraction (HRXRD), optical reflectance, Rutherford backscattering/channelling (RBS), supported by numerical evaluation methods were employed to determine both the exact thickness of each layer and the composition grading at the interface between succeeding layers of GaAs/AlAs-based mirrors. To reduce ambiguity and to speed up the analysis, the rocking curves and RBS spectra were simulated concurrently, using results of one simulation to verify the others. This process was carried out until the best fit between experimental and calculated curves was achieved. The complementary use of both methods results in improved sensitivity and makes the whole process of evaluation of the thickness variation of each layer and the size of the composition grading at the interfaces less time consuming.