服务于智能制造的智能检测技术探索与应用

为了促进工业4.0与“中国制造2025”战略在制造行业的实施,在智能制造体系中构建有效的控制层级与设备层级,促进车间状态数据与智能制造工艺流程的结合,本文提出了通过智能仪器与智能检测技术实现车间状态智能感知与工艺流程控制的方法,并探讨了智能仪器与智能检测技术在智能制造系统中新的应用模式,同时结合实际项目进行了数字化生产线改造与建设的创新实践,提出了满足智能制造要求的智能仪器与检测技术的发展方向。经项目实践验证,通过智能检测设备与智能仪器的应用,可有效促进智能制造系统中数据采集、智能感知的实现,并为整体工艺流程的智能决策提供有效的数据资源,是智能制造系统建立与完善的关键基础。     

基于遗传算法的变电站巡检机器人任务路径规划方法研究

近年来,随着变电站巡检机器人在变电站中的广泛使用,巡检机器人路径规划问题越来越成为亟待解决的问题。巡检机器人在已知的拓扑地图中标记了待执行巡检任务的停靠点,不同任务需要从初始点出发经过不同的一系列停靠点再返回初始点,如何规划路径是机器人面临的问题。首先分析了路径规划面临的问题,然后通过分析拓扑地图的特征,对地图进行等价简化,再对问题进行建模使用遗传算法求解巡检任务路径规划的近似最优解。通过仿真实验证明,提出的基于遗传算法的路径规划方法是可行有效的,为变电站巡检机器人任务路径规划提供了一种有效方法。     

Application of robust color composite fringe in flip-chip solder bump 3-D measurement

This study developed a 3-D measurement system based on flip-chip solder bump, used fringes with different modulation intensities in color channels, in order to produce color composite fringe with robustness, and proposed a multi-channel composite phase unwrapping algorithm, which uses fringe modulation weights of different channels to recombine the phase information for better measurement accuracy and stability. The experimental results showed that the average measurement accuracy is 0.43μm and the standard deviation is 1.38 µm. The results thus proved that the proposed 3-D measurement system is effective in measuring a plane with a height of 50 μm. In the flip-chip solder bump measuring experiment, different fringe modulation configurations were tested to overcome the problem of reflective coefficient between the flip-chip base board and the solder bump. The proposed system has a good measurement results and robust stability in the solder bump measurement, and can be used for the measurement of 3-D information for micron flip-chip solder bump application.     

构建职业活动导向型课程——以“精细化学品检验技术”为例

以职业活动为导向的"精细化学品检验技术"课程改革,基于真实产品检验过程,按照"资讯、决策、计划、实施、检查、评价"步骤实施,充分利用教、学、做一体化教室和仿真实训室,在有限的时间、空间内使学生在不同的教学环境中"学中做、做中学",最终使学生学会学习,学以致用。     

应用教与学一体化教学设计开展“精心预设”的研究——以初中化学“利用化学方程式的简单计算”教学设计为例

鉴于当前利用学案教学中存在的教学设计问题,探讨基于教学系统优化整合的视角,把学习方案教学设计融入教学方案设计中,开展教与学一体化教学设计,以达到"精心预设"的教学设计要求。     

有向循环的平衡样本设计

鉴于平衡样本设计在抽样调查中有广泛的应用背景, 因此利用组合设计理论, 讨论了带循环自同构的不含邻点的平衡样本设计, 建立了有向CBSEC 存在的充要条件.     

Defects inspection of the solder bumps using self reference technology in active thermography

With the decrease of solder bumps in dimension and pitch, defects inspection of the solder bumps become more difficult. A nondestructive detection system based on the active thermography has been developed for solder bumps inspection. However, heating non-uniformities and emissivity differences may impede the defects recognition. In this paper, we propose a method using a self reference technology based on a source distribution image (SDI) to eliminate the influence of unevenness in emissivity values and heating power distribution. Three thermograms captured right after the heat pulse are averaged to create the SDI. Then the SDI is subtracted from the original thermograms, and we get the thermal contrast images, in which eight points on the edge of each hot spot are selected as the feature points for the corresponding bump. Thermal difference between the feature points and the central point are adopted to quantify the thermal behaviors of the solder bumps, by which the missing bump is distinguished from the reference bumps. The results show that it is effective using the method to eliminate the impacts of emissivity unevenness and heating non-uniformities on defects identification in the active infrared test.     

Gate-controlled low-bias rectifying behaviors in BDC60 molecule

Using first-principles density functional theory and non-equilibrium Greenʼs function formalism for quantum transport calculation, we have investigated the effect of gate voltage on the electronic transport properties of BDC60-based molecular junction. The results show that the transport properties are strongly modulated by the applied gate voltage, and the current–voltage curve displays an obvious rectifying behavior at much low bias region. The mechanism for the rectifying behavior is analyzed by the bias-dependent transmission spectrum, projected density of states, spatial distribution of molecular projected self-consistent Hamiltonian orbitals and voltage drop over the junction.     

拼接干涉仪在控制装校面形中的应用

通过对比大口径光学元件夹持不当时全口径与局部口径之间的图像关系,研究局部面形控制的新方式。并与高精度的大口径干涉仪进行比对测试,验证拼接干涉仪的测试精度。实验表明,拼接干涉仪局部测试精度可达50 nm(PV值).空间分辨力高达5 mm~(-1),可以实现中频段的装校临控。使用拼接干涉仪扫描测试全口径面形,测试不确定度小于100nm.与φ600 mm的大口径干涉仪测试结果差别小于0.04λ(波长λ=632.8 nm)。     

几种塑料的太赫兹光谱检测

利用太赫兹时域光谱技术测量了聚乙烯、聚丙烯、聚氯乙烯、聚四氟乙烯和丙烯腈-丁二烯-苯乙烯的太赫兹透射谱,研究其在0.2~2.6 THz频段的光谱特性,得到了在室温氮气环境下这些材料的太赫兹吸收谱和折射率色散特性.发现这五种塑料在太赫兹波段的折射率和吸收系数差异显著,折射率分别在1.35~1.85之间,聚乙烯、聚丙烯、聚四氟乙烯吸收很小,相比之下聚氯乙烯、丙烯腈-丁二烯-苯乙烯吸收很大,这为塑料种类的鉴别及高太赫兹透过率塑料衬底选择提供了依据.