制造商检验的最优质量水平及影响因素研究

为提高我国食品质量安全水平,对小型、分散的单个供应商和一个制造商构成的食品供应链中,制造商对原材料和最终食品进行质量检测的情况,建立了以供应商和制造商各自的质量水平为决策变量的优化模型,分析了最优质量水平的影响因素和影响效应.并依据结论提出相应建议,如提高消费者对优劣食品的识别能力,发挥制造商在供应链中的监督检验作用等.     

细管道内表面光电检测方法研究

管道是气体和液体传输的重要手段,管道内表面的检测对于工业和国防中管道泄漏事故的预防,减少环境污染和经济损失非常重要。随着电子和半导体技术的发展,光电器件逐步趋于小型化。介绍了基于激光阵列、PSD光电检测、光环截面以及结构光检测等光电检测方法的测量原理和系统构成,并在此基础上对不同光电检测方法的优缺点进行了分析和比较。分析结果表明：光电检测技术适用于管道内表面检测;并朝着快速识别缺陷、管道内表面瑕疵的精确三维测量以及三维图像直观显示管壁缺陷的方向发展。     

State-of-the-art molecular imprinted colorimetric sensors and their on-site inspecting applications

Molecular imprinted colorimetric sensors can realize visual semi-quantitative analysis without the use of any equipment. With the advantages of low cost, fast response, ease of handling, and excellent recognition ability, the molecular imprinted colorimetric sensor shows great application potential in the field of sample rapid assay. Molecular imprinted colorimetric sensors can be prepared in various forms to meet the needs of different sample determination, such as film, hydrogel, strip, and adsorption coating. In this review, the preparation methods for various types of molecularly imprinted colorimetric sensors are systematically introduced. Their applications in the field of on-site biological sample detection, drug detection, disease treatment, chiral substance detection and separation, environmental analysis, and food safety detection are introduced. The limitations encountered in the practical application are presented, and the future development directions prospect.     

High-speed and crack-free direct-writing of microchannels on glass by an IR femtosecond laser

Fabrication of high-resolution 3D structures with laser radiation on the surface of brittle materials has always been a challenging task. Even with femtosecond laser machining, micro-cracks and edge chipping occur. In order to evaluate processing modes optimal both in quality and productivity, we investigated high-speed (50 kHz) femtosecond laser processing of BK7 glass with the use of design of experiments and regression analysis. An automated inspection technique was developed to extract quality characteristics of test-objects. A regression model was obtained appropriate to fabricate microchannels with a predefined depth in the range of 1–30 µm with average accuracy of 5%. It was found that high quality machining modes are in the range of 0.91–2.27 µJ energy pulses, overlap of 53–62%, three and more number of passes. A material removal rate higher than 0.3 mm³/min was reached and microfluidic structures were formed based on data obtained.     

基于视觉的车辆与轨道相对振动状态测量方法研究

车辆与轨道相对振动状态对轨道线形测量有重要影响;分析了传统检测车辆与轨道相对振动状态测量方法的缺陷,提出一种基于视觉的车轨相对振动状态测量方法,以轨道建立世界坐标系,以车体建立车体坐标系。考虑相机镜头畸变,建立相机非线性模型,基于机器人手眼方法标定相机与车体,求解相机内外参数。依据车体运动姿态特征,推导基于双目机器视觉的车辆运动姿态偏移补偿计算方法;运用实验平台设计验证实验,通过计算所得的车体振动位移与真实值高度吻合,随着车速增加振动位移误差也随之增大,验证了该方法的正确性和可行性;提供一种车辆与轨道相对振动状态测量方法。     

小角度纵波水浸超声检测技术在消除锻件结构盲区中的应用

航空发动机中的后轴颈锻件一般采用水浸超声纵波直入射方法检测内部缺陷。由于型面结构的问题,在锻件的直筒和锥形段连接区域存在检测盲区。该文针对某型号发动机中的后轴颈锻件,开展了水浸超声检测工艺研究,提出利用小角度纵波覆盖盲区的思路。通过对含有人工缺陷的模拟样件的检测实验,比较了水浸纵波直入射和小角度纵波斜入射两种检测方法对后轴颈连接区域的覆盖能力。结果表明,该文提出的小角度纵波方法,可以有效检测出水浸纵波直入射检测方法无法发现的人工缺陷,消除由结构引起的检测盲区,保障零件的服役安全。     

Detection of micro solder balls using active thermography and probabilistic neural network

Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.     

Optimal production run time for a deteriorating production system under an extended inspection policy

A deteriorating production system is subjected to random deterioration from an in-control state to an out-of-control state with a general shift distribution. In order to reduce the defective items, part inspection policy, under which production inspections are performed only at the end of the production run, and full inspection policy are both considered in the literature. Moreover, the former dominates the latter. Since the product produced towards the end of a production cycle are more likely to be defective, it can further economize the inspection costs that they are directly reworked without inspection. In this paper, we propose an extended product inspection policy for a deteriorating production system. Product inspections are performed in the middle of a production cycle, and after the inspection, all products produced until the end of the production run are fully reworked. Based on the model, we show that there exists a production run time and a corresponding unique inspection policy such that the expected total cost per item per cycle is minimized. Finally, numerical examples are provided to illustrate our extended inspection policy, and indicate that such product inspection model will reduce the quality-related cost than part inspection does.