谈对参加数控技能竞赛学生的选拔和培训

随着中央关于“职业院校制造业和现代服务业技能型紧缺性人才培养培训工程”的政策出台，以及“2004年全国首届数控技能大赛”的成功举办，使得职业学校的数控专业建设逐步发展并完善起来，各种形式的数控技能竞赛也如火如荼地开展起来。本文从参加数控技能比赛学生的选拔和培训两个方面做了简单的介绍．     

数控加工刀具运动的优化控制

数控加工的精准性与高速性主要体现在加工路径的插补与加工过程中刀具的速度控制.首先针对数控加工过程中常见的折线轨迹进行分析,提出了折线加工转角处的速度平滑过渡方案,保证加工精度的同时提高加工效率.进一步,得出了转角处的最大加工速度与加工误差关系.针对圆弧类曲线插补问题,在折线模型的基础上拓展了内接和外切两种插补方案.计算结果表明,采用折线平滑过渡时,外切插补方案可以保证更高的精度.     

Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining

ABSTRACT

In the paper, molecular dynamics simulation is applied to study the evolution and distribution of subsurface defects during nanoscale machining process of single-crystal copper. The chip-removal mechanism and the machined-surface-generative mechanism are examined through analysis of the dislocation evolution and atomic migration of the workpieces. The findings show that under different stresses and temperatures, the difference of the binding energy leads to a zoned phenomenon in the chip. Owing to elastic deformation, some of the dislocations could be recovered and form surface steps; moreover, the work hardening of the workpiece can be achieved on account of generation of twin boundaries, Lomer-Cottrell dislocations, and stacking fault tetrahedra (SFT) by plastic deformation. A process of evolution of an immobile dislocation group containing stair-rod dislocations into SFT is discovered, which is different from the traditional Silcox-Hirsch mechanism. Furthermore, a growth oscillation phenomenon, which corresponding stacking fault planes growth and retraction during the formation of the stable SFT, is discussed.     

纳米α-Al2O3磨料抛光单晶硅片光滑表面的形成机理

"将纳米α-Al2O3粉体配制成抛光液并冷冻成冰结抛光垫对单晶硅片进行了抛光,用原子力显微镜观察了抛光表面的微观形貌并测量了其表面粗糙度,采用透射电镜观察了单晶硅片抛光后的断面形貌．为进一步分析抛光过程中的化学作用机理,采用X射线光电子能谱分析了单晶硅片抛光后表面的化学成分．利用纳米压痕仪的划痕附件对单晶硅片进行了划痕测试,研究了抛光过程中的机械作用机理．结果表明纳米α-Al2O3磨料冰冻抛光单晶硅片时,在1 mm￡1 mm的范围内得到了微观表面粗糙度为0.367 nm的超光滑表面,亚表面没有任何损伤,材     

面向并行设计的局部特征识别技术研究

为支持在并行设计过程中设计特征模型到加工特征模型的逐步转换，提出了局部特征识别的方法．在并行设计中，设计特征模型和加工特征模型通过面名历史图共享零件的实体模型，设计特征的变动通过局部特征识别自动地转换为相应的加工特征．局部特征识别是由基于最小条件子图特征识别方法改进来的，它以零件的局部区域为识别对象，通过搜索匹配局部区域构成的边界模式，识别出该局部区域中所包含的加工特征．局部特征识别方法的特点是只对设计中发生变动的区域进行识别．     

高精度干涉仪针孔空间滤波器研制

应用于高重复频率、高功率193 nm准分子激光器会聚光路中的针孔空间滤波器,除了需要考虑它的材料加工难易、厚度、针孔尺寸等因素外,还需考虑材料抗激光损伤特性。本文利用激光损伤理论中一维热流模型对无限厚和有限厚不同金属样品在高峰值功率193 nm 准分子激光器照射下的损伤阈值进行了分析。结果表明：铝材料在厚度为1.2μm处比其它金属的损伤阈值高,可达1.16×1010 W/cm2,且材料易于加工。利用聚焦离子束技术加工了航空铝材料样品,得到了厚度为1.2和1.5μm的针孔空间滤波器样品。扫描电镜观察其具有较好圆度和内壁粗糙度,基本满足剪切干涉仪对针孔空间滤波器的需求。     

Production of monoclonal antibodies against hop-derived (Humulus lupulus L.) prenylflavonoids and the development of immunoassays

Monoclonal antibodies against the hop-derived prenylated chalcone xanthohumol (X) and the prenylated flavonoids isoxanthohumol (IX) and 8-prenylnaringenin (8-PN) were developed. Carboxylic acid haptens of X, IX and 8-PN were synthesized by linking a spacer to their C4′-OH group followed by subsequent coupling to bovine serum albumin (BSA) to form conjugates that were employed as immunogens in BALB/c mice to raise antibodies. The monoclonal antibodies that were secreted from the established hybridoma cell lines proved, in cross-reactivity studies, to possess highly specific binding capacities in an optimized competitive indirect ELISA. The immunoassays make use of immunogen-coated microtiterplates and a peroxidase-labeled anti-mouse IgG₁ secondary antibody with ABTS as a chromogenic substrate. For X the IC₅₀ value derived from the standard curve was 62.91 ng mL⁻¹, and for both IX and 8-PN 37.15 ng mL⁻¹. The assay was validated for the quantitative analysis of X, IX and 8-PN in urine and serum. A simple sample pretreatment procedure using a diethyl ether extraction was optimized and the recoveries and matrix effects were assessed. The validity of the established assay was tested and mean inter- and intra-assay variations in urine were 2.32% and 1.91%, respectively for X, 6.24% and 2.39%, respectively for IX and 7.18% and 0.74%, respectively for 8-PN. In serum, the mean inter- and intra-assay variations were 8.90% and 1.37%, respectively for X, 6.13% and 1.57%, respectively for IX and 6.13% and 2.43%, respectively for 8-PN. Furthermore, the method demonstrated excellent accuracy and significant correlation with measurements by an established and validated HPLC-MS method.     

超声辅助射流电解加工的仿真及实验*

为了提高射流电解加工小孔的效率及质量,提出了一种压电超声波换能器配合锥形电解液腔室的装置,将超声波引入电解液中,对射流电解加工存在的缺陷进行弥补。搭建了超声辅助射流电解加工装置,分析了其加工原理。对模型进行了声场仿真和射流电解加工仿真,初步验证了超声辅助效果。实验验证了超声波对射流电解加工的加工速率、小孔形状的辅助效果,结果表明：在多组NaNO₃电解液浓度、液压泵转速条件下,1.5 min内超声波对射流电解加工的加工速率可提高9%～15%;同时超声波对射流电解加工的过切现象有所改善。     

脉冲激光与电化学复合的应力刻蚀加工质量研究

脉冲激光电化学复合加工可以有效去除激光辐照区域内的电解产物, 提高加工效率, 改善加工质量. 针对高性能金属材料的微细加工要求, 采用脉冲激光电化学复合的应力刻蚀加工方法对铝合金的刻蚀特性进行理论和试验研究. 通过比较激光直接刻蚀加工和激光电化学复合加工的特点, 应用扫描电子显微镜、光学轮廓仪等检测技术分析了刻蚀区域的形貌特征. 根据力学电化学原理, 探讨了金属材料微结构加工的应力去除机理. 通过加工试验, 研究了工艺参数和加工方式对加工质量的影响, 采用优化的工艺参数, 加工出了质量较好的微结构. 试验结果表明, 激光电化学复合的连续扫描加工稳定性好, 可以有效地降低表面粗糙度, 提高加工质量. 关键词： 激光电化学 应力刻蚀 加工质量 工艺参数