光学元件抛光的PSD分析及控制策略北大核心CSCD

在光学加工领域,采用功率谱密度(power spectral density,PSD)对误差频谱方面信息进行表征,但是功率谱密度是表面误差统计信息,不如峰谷值(peak-valley,PV)和均方根值(root mean square,RMS)直观。为了分析功率谱密度与工艺参数之间的关系,该文从PSD定义出发,分析了随机面形轮廓不同参数对光学PSD的影响规律,总结了PSD控制的要点,在平面玻璃上对数控抛光典型路径下加工的PSD曲线进行分析。分析结果表明:PSD与随机轮廓幅值、频率分布有关,相位对它几乎无影响;在RMS接近情况下,PSD线性拟合斜率和RMS Slope随随机轮廓的自相关长度增加而下降;短程加工路径相较于长程有序路径能够有效抑制PSD曲线峰值,使得光学元件符合频谱抑制要求。     

Molecular dynamics simulations of diffusion of carbon into iron

Molecular dynamics (MD) simulations of diffusion couple tests were conducted between carbon (diamond/graphite) and iron at three different temperatures (300, 800 and 1600 K) and contact times (0, 40 and 80 ps) to investigate the chemical interaction between carbon and iron. Two different carbon structures, namely, diamond (cubic) and graphite (hexagonal), were considered. Diffusion of carbon into iron was observed only when a graphite interlayer was added to the diamond surface. When diamond alone was used, no diffusion was observed. This result provides corroborating evidence that diamond tool wear in the machining of iron occurs via a mechanism that involves an initial graphitization of diamond followed by diffusion of the newly formed graphite into the iron workpiece.     

Microstructured polymer‐based substrates with broadband absorption for surface‐enhanced Raman scattering

Large area (3 × 3 cm²) substrates for surface‐enhanced Raman scattering were fabricated by combining femtosecond laser microstructuring and soft lithography techniques. The fabrication procedure is as follows: (i) femtosecond laser machining is used to create a silicon master copy, (ii) replicates from polydimethylsiloxane are made, and (iii) a 50‐nm‐thick gold film is deposited on the surface of the replicates. The resulting substrates exhibit strongly enhanced absorption in the spectral region of 350 ∼ 1000 nm and generate enhanced Raman signal with enhancement factor of the order of 10⁷ for 10^{‐ 6} M rhodamine 6G. The main advantages of our substrates are low cost, large active area, and possibility for mass replication. Copyright © 2013 John Wiley & Sons, Ltd.     

实际加工表面红外激光散射特性的实验研究

为了研究激光在实际加工表面的散射特性,利用分辨率为10 nW的激光功率计PM100D,波长为1550 nm的激光器和精密转台,自行设计并搭建了半球空间中目标表面散射特性的测量系统. 以典型的刨床加工的若干标准粗糙度比较样块为被测目标,在1550 nm红外激光以不同方位照射下,测量了微观具有V形槽结构的不同粗糙度的样块表面的散射功率分布. 实验结果转换成双向反射分布函数后,对比分析了入射光方位、入射角和表面粗糙度对此类典型表面散射特性的影响,并分析了特殊散射场形成的原因. 结果表明,表面纹理、入射角以及粗糙度均对目标表面的散射特性有规律性影响,这一结果对于具有规律性加工纹理表面的散射特性的研究和建模有一定的参考价值,对激光技术在实际加工表面的应用研究提供了一定的基础. 关键词： 散射特性 双向反射分布函数 红外激光 实际加工表面     

塑性加工条件下射流颗粒冲击去除效应

针对在微观上存在尖锐突起、凹坑和划痕等缺陷的光学元件,提出用低质量分数磨料水射流冲击的方式对其进行处理。从弹性接触出发,对射流中粒子与元件发生塑性接触的临界速度进行了推导,并引入了塑性转入脆性加要的临界速度,从而对射流的塑性去除阶段作了明确的界定。针对常用的两种光学材料K9和石英玻璃,结合具体参数对使其处于塑性去除阶段的射流速度进行了模拟计算,利用单颗粒冲击去除模型,在塑性去除范围内对两种材料的冲击去除进行了模拟计算。结果表明:石英玻璃进入塑性去除的临界速度高于K9玻璃,而进入脆性去除的临界速度低于K9玻璃,因而使石英玻璃处于塑性去除阶段的射流速度范围为K9玻璃相应速度范围的子区间;在塑性去除阶段,各材料的去除量皆随着冲击速度的增大而增大,但较硬的石英玻璃更不耐冲击,较K9玻璃更容易被去除。     

高准确度多功能激光直写装置

采用高数值孔径物镜和高准确度纳米平台搭建了一台激光直写装置,可以在光敏感薄膜材料上进行打点、刻画矢量和标量图形等多种操作,其最小特征尺寸小于300 nm,重复性5 nm.在刻写前准确标定刻写激光功率,刻写过程中采用象散法精确自动聚焦,刻写完成后采用两种不同波长的激光束探测样品的透过率和反射率的细微变化,最终实现了高准确度亚微米图形的刻写和检测.     

Laser and electrochemical complex machining of micro-stent with on-machine three-dimensional measurement

In the micro-fabrication, small installation misalignment and deformation of the workpiece cause fatal damage. On-machine measurement is one of the efficient methods to prevent this damage. Our system performs the laser machining and the three-dimensional measurement of the workpiece position using only one laser. Based on the measurement result, the position error of the workpiece is automatically corrected and laser-machined. Electrochemical machining (ECM) is also done on the same machining system. In this paper, the configuration of the system is explained. Measurement and error correcting techniques are described in detail. And the experimental results that made stent shape using the micro-tube of diameter 120 μm and 210 μm are shown.     

圆环刀多点加工自由曲面的刀位算法研究

针对圆环刀具切触加工自由曲面,提出了一种新的基于动力学过程的多点切触刀位算法,该算法主要来自于柔顺自适应刀具吻合曲面的动力学和运动学过程。从分析圆环曲面的几何性质入手,结合动力学观点,分析自适应圆环刀具运动规律。采用 MATLAB 编写算法程序对自由开阔模具曲面多点切触刀位数据进行计算,并对刀位误差及加工带宽作了简要分析,最后利用ADAMS进行仿真验证,结果与计算方法吻合。     

KDP晶体超声辅助磨削的亚表面损伤研究

通过采用角度抛光和逐层抛光法以及择优化学腐蚀,对基于超声辅助磨削的KDP晶体试件进行亚表面损伤形式观察以及损伤深度检测,以便为后续加工提供指导.损伤检测实验表明:在超声辅助磨削工艺条件下,亚表面损伤以与磨粒运动方向平行的中位裂纹为主,且裂纹间距具有一定的规律性;亚表面损伤深度为19～48 μm,磨头形状(有无倒角)较之磨头磨粒粒度对亚表面损伤深度具有更大的影响,使用有倒角的磨头可得最小亚表面损伤.     

电火花放电通道蚀除绝缘工程陶瓷的热力学特性研究

 研究开发出一种绝缘工程陶瓷电火花加工新技术,它是利用电火花放电通道流经绝缘工程陶瓷表面时产生的瞬时高温作用进行蚀除加工的。建立了电火花放电通道热蚀除加工绝缘工程陶瓷的温度场和热应力场数学模型,对绝缘工程陶瓷表面上的温度梯度和热应力场进行了数值模拟,给出了火花放电通道在绝缘工程陶瓷表面上形成的温度梯度和热应力分布规律。模拟结果为揭示绝缘工程陶瓷的电火花微观去除机理、预测绝缘工程陶瓷表面的微观形貌和电加工参数的选择等奠定了理论基础。