接触爆炸荷载对钢筋混凝土梁的局部毁伤效应

为得到接触爆炸下钢筋混凝土（reinforced concrete,RC）梁的局部破坏模式和毁伤效应,对同一尺寸的RC梁进行了不同装药量的接触爆炸试验研究。试验中采用框架结构中典型工程尺度RC原型梁为研究对象,通过4次爆炸试验,观测了RC梁在不同装药量下的局部破坏模式和破坏特征,分析了装药量对局部毁伤效应的影响。研究结果表明：接触爆炸荷载作用下,RC梁将发生正面成坑、侧面崩落、背面震塌和截面冲切等局部破坏模式,爆坑深度、震塌厚度、表面毁伤面积以及受压区纵筋变形均与装药量立方根近似呈线性增加关系。在试验数据基础上,将RC梁局部毁伤程度划分为轻度毁伤、中度毁伤、重度毁伤和严重毁伤4个等级,采用比例装药量判据进行评估。研究成果可为抗爆结构设计和结构毁伤评估提供理论依据。

     

大型舰船在水下接触爆炸下的毁伤与防护研究综述

大型舰船受到水中兵器的巨大威胁,尤其是在水下接触爆炸情况下,船体结构将产生严重的局部毁伤,给舰船的战斗力乃至生命力带来严峻挑战。本文以大型舰船水下防护结构为研究对象,简要概述了各国海军大型舰船水下防护结构形式的发展历程,分析了水下接触爆炸下的毁伤载荷以及对舷侧多舱防护结构的毁伤机理,总结了基于具体结构和不同毁伤元的防护措施;并针对目前的研究现状,提出了有待进一步研究的问题。以期为舰船的水下防护设计提供参考,从而提高我国大型舰船的结构抗毁伤能力

     

双"单电桥"法测量低电阻中的实用技巧例举

主要介绍了双"单电桥"法测量低电阻的基本原理与双"单电桥"法测量低电阻的几种实用技巧.     

陶瓷材料疏水性能的研究进展

本文简述了疏水性表面的基本原理,分别从低表面能物质修饰和表面微细粗糙结构的构建两个方面,对疏水性陶瓷材料的制备技术和最新的成果进行了总结,介绍了其潜在的应用并对未来的研究方向作了展望.     

光子晶体光纤在熔接夹具中的受力分析

运用接触力学和圆环压溃强度理论对由V型槽固定的光子晶体光纤进行了受力分析。分别考虑了两种极限情况,以推导光纤中的应力分布。第一种情况假设光纤是完全由纯石英材料制成的内部均匀的实芯圆柱体;第二种情况是把光纤假设成一个空芯圆柱体。根据这两种极限情况推导出了光子晶体光纤受力后光纤内部的最大应力点位于平行于接触面的外层空气孔的附近。采用有限元方法验证了此结论,计算出了光子晶体光纤可能承受的最大压力,并给出了光子晶体光纤在V型槽中的应力分布和变形情况。     

电磁轨道发射器连续发射的滑动电接触

从滑动电接触电阻大小的角度,详细分析了在时序放电条件下,两颗重约为5 g的电枢,以速度为1 000 m/s,166 Hz连续发射试验。通过近似计算电流所流经轨道电阻及电枢体电阻所产生的温升,对滑动电接触电阻的影响。结果表明:连续发射运行模式下,受轨道表面温度上升的影响,第二发电枢的滑动接触电阻略高于第一发电枢的滑动接触电阻,表面滑动电接触性能受到温升的影响,在两连发的发射情况下,其影响虽不是很大,但多发高频连续发射就必须考虑热管理问题。      

高速电枢的尾翼结构设计及实验研究

设计了T2LXD1系列电枢,分析了6061-T6铝合金材料的弹塑性特点,利用线性强化理论和接触理论并结合ANSYS软件,建立了T2LXD1系列电枢弹塑性接触模型,研究了电枢尾翼结构对电枢/导轨滑动界面接触状态的影响规律,得到了界面接触力、接触面积和接触压力分布等状态参数的数值模拟结果。利用短导轨电磁驱动系统,进行了T2LXD1系列电枢滑行实验,分析了电枢/导轨界面滑磨状态,比较了滑行性能曲线。实验结果表明:长尾翼电枢并不能带来实际接触面积的增     

Significant change in water contact angle of electrospray‐synthesized SiO2 films depending on their surface morphology

Amorphous SiO₂ films were deposited by means of an electrospray technique. The relation between the water contact angle (WCA) of the deposited SiO₂ films and the surface morphology is investigated. The feeding rate of the electrospray process greatly affects the morphology of the synthesized SiO₂ films. There is also a significant change in the WCA on the surface of the films: the rougher the surface, the greater the WCA. A model based on the Cassie–Baxter formulation is used to explain the change observed in the WCA on the SiO₂ films. Copyright © 2012 John Wiley & Sons, Ltd.     

Insight into industrial PLA aging process by complementary use of rheology,HPLC, and MALDI

Nowadays, there is a growing availability of biodegradable industrial materials intended to food contact applications whose service life behavior needs to be further investigated. This article is focused on the degradation of two materials based on polylactic acid. The correlation between the rate of degradation and the amount of trapped degradation products was investigated applying three characterization techniques in parallel, namely rheology, high‐performance liquid chromatography (HPLC), and matrix‐assisted laser desorption/ionization (MALDI). The rate of degradation was studied through the evaluation of their rheological properties and calculation of the number of average molecular weights, and weight‐average molecular weights. Water‐soluble oligomers and lactic acid were quantified by HPLC‐ultraviolet. Changes in cyclic and linear oligomers were monitored by MALDI‐time‐of‐flight mass spectrometry. Specimens of 4‐mm thickness of each biopolymer were subjected to hydrolysis in deionized water up to 6 months at two temperatures, simulating service conditions of food packaging. The diminution in viscosity and consequently in molecular weight distribution (20–60%) showed the degradation of the molecular structure of both polylactic acids. The chain scission was followed through the increasing values of lactic acid and hydrolyzed oligomers (twofold to eightfold), and the predominant signal of the linear oligomers over the cyclic ones with aging. Rheology, HPLC, and MALDI showed to be complementary tools to better understand the changes in the molecular structure. The obtained results showed the necessity of adding suitable stabilizers for each particular food packaging application. Copyright © 2013 John Wiley & Sons, Ltd.