软X射线投影光刻技术及其发展(续)

为了提高反射率,软X射线投影光刻中使用的掩膜是制备在多层膜上的反射式掩膜,由于有微缩光学系统,它有相对较大的特征尺寸;同时由于它是制备在镀有多层膜的较结实基片上,使用中有能力避免软X射线照射引起的掩膜热变形,便于实现高精度的光刻复制。在反射式掩膜技术中,需要着重考虑的是掩膜缺陷修复和降低多层膜的损伤。     

Preliminary results for the design,fabrication,and performance of a backside-illuminated avalanche drift detector

The detection of low-level light is a key technology in various experimental scientific studies. As a photon detector, the silicon photomultiplier （SiPM） has gradually become an alternative to the photomultiplier tube （PMT） in many applications in high-energy physics, astroparticle physics, and medical imaging because of its high photon detection efficiency （PDE）, good resolution for single-photon detection, insensitivity to magnetic field, low operating voltage, compactness, and low cost. However, primarily because of the geometric fill factor, the PDE of most SiPMs is not very high; in particular, for those SiPMs with a high density of micro cells, the effective area is small, and the bandwidth of the light response is narrow. As a building block of the SiPM, the concept of the backside-illuminated avalanche drift detector （ADD） was first proposed by the Max Planck Institute of Germany eight years ago; the ADD is promising to have high PDE over the full energy range of optical photons, even ultraviolet light and X-ray light, and because the avalanche multiplication region is very small, the ADD is beneficial for the fabrication of large-area SiPMs. However, because of difficulties in design and fabrication, no significant progress had been made, and the concept had not yet been verified. In this paper, preliminary results in the design, fabrication, and performance of a backside-illuminated ADD are reported; the difficulties in and limitations to the backside-illuminated ADD are analyzed.     

Open critical area model and extraction algorithm based on the net flow-axis

In the integrated circuit manufacturing process, the critical area extraction is a bottleneck to the layout optimization and the integrated circuit yield estimation. In this paper, we study the problem that the missing material defects may result in the open circuit fault. Combining the mathematical morphology theory, we present a new computation model and a novel extraction algorithm for the open critical area based on the net flow-axis. Firstly, we find the net flow-axis for different nets. Then, the net flow-edges based on the net flow-axis are obtained. Finally, we can extract the open critical area by the mathematical morphology. Compared with the existing methods, the nets need not to divide into the horizontal nets and the vertical nets, and the experimental results show that our model and algorithm can accurately extract the size of the open critical area and obtain the location information of the open circuit critical area.     

脆性光学材料超精密加工技术

如何在光学晶体、光学玻璃等脆性材料上高效地制取纳米级光学表现是现代超精密加工技术领域的重点研究课题。近年来，此项技术取得了突破性进展，出现了浮法抛光、离子束加工、韧性加工等新一代脆性光学材料超精密加工技术。从加工机理、加工精度、表面质量、生产率等方面对其进行分析比较，并讨论了令人瞩目的韧性加工技术。     

光栅制备工艺的新进展

从全息光栅法出发 ,详细阐述了应用偶氮苯聚合物光致表面调制效应制备光栅的新工艺 ,说明使用偶氮苯聚合物薄膜制备光栅方法的特点 ,介绍了采用新工艺制备的光栅的独特性质———光栅可热擦除或光学擦除 ,同时提出应用新材料光栅制造方法所面临的问题。采用新工艺实验制备了薄膜光栅     

低温光学系统的研制

低温光学系统对于在空间探测微弱红外目标有重要的意义。无热效应的光学系统设计保证光学系统的像质不受温度变化的影响。有限元分析方法的结构优化设计,在确保光学性能的前提下使系统的重量达到最轻。特殊的制造工艺充分消除零件内部应力。低温检测的结果表明,光学系统的温度从室温降到100K的低温,在温度变化185K的条件下,系统波面误差几乎没有变化,光学系统都能达到衍射极限的成像质量。     

基于选择性激光烧结成型的无模具快速精铸工艺

选择性激光烧结技术(Selective Laser Sintering，SLS)是采用红外激光烧结粉末状材料成形的一种快速成型技术。其基于分层制造的崭新思想，在复杂零件的整体成型和结构组织的连续性方面具有独到的优点，从而可以最为有效地与传统地树脂砂造型工艺相结合，实现了无模型精密铸型的快速制造，其工艺流程图见图1。该工艺实现了CAD模型直接驱动下的铸型一体化制造，型芯同时成形，可方便地制造含自由曲面的铸型和混合零件等。突破了传统工艺的许多约束，具有较高的柔性，尤其适合于制造单件小批量的大中型铸件。     

基于分层光学扫描的三维数字化测量技术

采用切削分层光扫描测量与计算机数据信息合成相结合的方法，有效地解决了具有复杂内外腔结构零件的三维数字化测量。该方法比传统三维测量速度快、自动化程度高，能同时准确测量零件内外腔表面，零件边缘测量误差可控制在CCD两个像素内。利用获取的铝合金精密小箱体三维数据，在计算机上重构了零件的三维模型，并用RP技术制造出了零件物理原形。     

相变型半导体存储器研究进展

文章系统地介绍了相变型半导体存储器的原理、相变材料、特点、器件结构设计、研究现状及面临的几个关键器件工艺问题．C—RAM由于具有非易失性、循环寿命长、元件尺寸小、功耗低、可多级存储、高速读取、抗辐照、耐高低温、抗振动、抗电子干扰和制造工艺简单等优点，被认为最有可能取代目前的FLASH、DRAM和SRAM而成为未来半导体存储器主流产品．     

服务于智能制造的智能检测技术探索与应用

为了促进工业4.0与“中国制造2025”战略在制造行业的实施,在智能制造体系中构建有效的控制层级与设备层级,促进车间状态数据与智能制造工艺流程的结合,本文提出了通过智能仪器与智能检测技术实现车间状态智能感知与工艺流程控制的方法,并探讨了智能仪器与智能检测技术在智能制造系统中新的应用模式,同时结合实际项目进行了数字化生产线改造与建设的创新实践,提出了满足智能制造要求的智能仪器与检测技术的发展方向。经项目实践验证,通过智能检测设备与智能仪器的应用,可有效促进智能制造系统中数据采集、智能感知的实现,并为整体工艺流程的智能决策提供有效的数据资源,是智能制造系统建立与完善的关键基础。