A phosphate-based epoxy resin for flame retardance: synthesis, characterization, and cure properties

A phosphorus-containing oligomer, bis(3-hydroxyphenyl) phenyl phosphate (BHPP), was synthesized through the reaction of phenyl dichlorophosphate and 1,3-dihydroxybenzene, and characterized by elemental analysis, Fourier transform IR spectroscopy, and ¹H NMR and ³¹P NMR spectroscopy. Consequently, the phosphate-based epoxy resins with a phosphorus content of 1 and 2 wt % were prepared via the reaction of diglycidyl ether of bisphenol-A with BHPP and bisphenol-A, and were confirmed with Fourier transform IR spectroscopy and gel permeation chromatography. Phenolic melamine, Novolak, and dicyanodiamide were used as curing agents to prepare the thermoset resins with the control and the phosphate-based epoxy resins. Thermal properties and thermal degradation behavior of these thermoset resins were investigated by using differential scanning calorimetry and thermogravimetric analysis. The thermoset resins cured with phenolic melamine exhibited higher glass-transition temperatures than the other cured resins owing to the high rigidity of their molecular chain. Thermogravimetric analysis studies demonstrated that the decomposition temperatures of the thermoset resins cured with Novolak were higher than those of the others. A synergistic effect from the combination of the phosphate-based epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermoset resins.     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002     

用三乙胺盐酸盐对酚醛环氧树脂开环合成水溶性感光高分子的研究

用三乙胺盐酸盐与酚醛环氧树脂开环反应合成了一种水溶性聚合物，研究了相转移催化剂、反应时间、反应温度、开环顺序等条件对反应程度的影响。研究了开环反应中丙烯酸及三乙胺盐酸盐与酚醛环氧树脂的比例对产物的水溶性及感兴性能的影响。     

SYNTHESIS AND CHARACTERIZATION OF A NOVEL BLUE LIGHT EMITTING ROD-COIL DIBLOCK OLIGOMER

Four new rod-coil diblock molecules, which had well-defined para-phenylene oligomers (PPP, from biphenyl toquinquephenyl) as rigid segments and poly(ethylene oxide) (PEO, M_w ca. 750) as flexible segments, were synhesized. Thechemical structure and the number of repeating unit in PEO coil and PPP rod were characterized by ~1H-NMR and MALDI-TOF mass spectromeny. The diblock oligomers showed good solubility in common organic solvents and aggregated in wateras characterized by a blue shift in UV-vis absorption spectra, a red shift in emission spectra, quenching of the fluorescenceand formation of the microfibrilla and fractal-like structures. The formation of different supramolecular structures meant thatthis effort might lead to commercial important highly organized functional materials.     

Synthesis and characterization of UV-curable polydimethylsiloxane epoxy acrylate

UV-curable polydimethylsiloxane epoxy acrylate (PSEA) was synthesized by hydrosilylation of allyl glycidyl ether with hydrogen-containing polydimethylsiloxane to give polydimethylsiloxane-type epoxy resin which modified with acrylic acid. The curing speed and the double bond conversion in the UV cured film were influenced by the purity of PSEA with Fourier transform infrared spectroscopy (FT-IR) measurements. The influences of the synthetic process, such as, the reaction temperature, the concentration of reactants and the catalyst which determined the purity and activity of resins were discussed in detail. The structures of this resin were characterized by ¹H-NMR and FT-IR spectra. The molecular weight was checked by gel permeation chromatography, and M_n is 45,000. The properties of the cured film were also investigated by thermogravimetric analyzer, dynamical thermal mechanical analysis, and etc. For example, tensile strength (6.9 Mpa), elongation (20%), hardness (A; 18), water absorption (24 h; 2%), weight loss (40 min, 300 °C; 5%) and etc.     

High-pressure synthesis of cyclic phenylacetylene oligomer

New conjugated oligomers were prepared by reacting phenylacetylene under high pressure of 0.11 to 0.92 GPa at 100–200°C for 0–5 h. The number-average molecular weight M?_n, the weight-average molecular weight M?_w, and the oligomer yield increased with pressure, tem-perature, and time. The average molecular weight of the oligomer showed the maximum value (M?_n: 830, M?_w: 2400) under 0.92 GPa, the maximum pressure, where phenylacetylene was oligomerized at a constant temperature. The structure of the oligomer was investigated from ESR, infrared, UV–VIS, field desorption mass (FDMS) spectra, and ¹³C NMR spec-trum. Analysis of the FDMS spectrum revealed that the molecular weight of the oligomer was multiple of the monomer. ¹³C NMR spectrum of the oligomer showed the absence of sp-carbon (? C?). We found that the oligomer had a cyclic structure. The cyclic oligomers of pentamer or more were new compounds. © 1995 John Wiley & Sons, Inc.     

Determination of the Thermal Degradation Kinetic Parameters of Carbon Fibre Reinforced Epoxy Using TG

In this work, a kinetic study on the thermal degradation of carbon fibre reinforced epoxy is presented. The degradation is investigated by means of dynamic thermogravimetric analysis (TG) in air and inert atmosphere at heating rates from 0.5 to 20°C min⁻¹ . Curves obtained by TG in air are quite different from those obtained in nitrogen. A three-step loss is observed during dynamic TG in air while mass loss proceeded as a two step process in nitrogen at fast heating rate. To elucidate this difference, a kinetic analysis is carried on. A kinetic model described by the Kissinger method or by the Ozawa method gives the kinetic parameters of the composite decomposition. Apparent activation energy calculated by Kissinger method in oxidative atmosphere for each step is between 40–50 kJ mol⁻¹ upper than E _a calculated in inert atmosphere. The thermo-oxidative degradation illustrated by Ozawa method shows a stable apparent activation energy (E _a ≈130 kJ mol⁻¹ ) even though the thermal degradation in nitrogen flow presents a maximum E _a for 15% mass loss (E _a ≈60 kJ mol⁻¹ ). This revised version was published online in July 2006 with corrections to the Cover Date.     

Synthesis and characterization of novel epoxy monomers and liquid crystal thermosets

Four new epoxy monomers have been synthesized and characterized as part of a program to prepare novel liquid crystal thermoset (LCT) materials. Three of the new epoxy monomers contained a biphenyl mesogen and were not liquid crystalline (LC). The remaining epoxy monomer, which contained a 1,4-dibenzoyloxybenzene mesogen, was synthesized in an overall yield of 30% and displayed a broad (83°C) nematic liquid crystalline phase. The new liquid crystalline epoxy monomer was cured at 120°C and postcured at 175°C with a stoichiometric amount of 1,4-phenylenediamine. The thermal transitions of the resulting LCT were studied by differential scanning calorimetry (DSC), polarized light optical microscopy (POM), thermomechanical analysis (TMA), and wide angle x-ray diffraction (WAXD) as a function of cure time and temperature. A process characterization diagram was constructed which shows that LCTs based on this new LC monomer can be processed in the liquid crystalline phase over a broad range of times and temperatures. Qualitative agreement with previous epoxy LCT results was found, as LCT's with smectic phases and without clearing temperatures were observed at long cure times (high crosslink densities), whereas nematic phases with clearing temperatures predominated in networks at short cure times (low crosslink densities). © 1993 John Wiley & Sons, Inc.     

Curing behavior and toughening performance of epoxy resins containing hyperbranched polyester

The effects of the hyperbranched polyester with hydroxyl end groups (HBPE‐OH) on the curing behavior and toughening performance of a commercial epoxy resin (diglycidyl ether of bisphenol A, DGEBA) were presented. The addition of HBPE‐OH into DGEBA strongly increased its curing rate and conversion of epoxide group due to the catalytic effect of hydroxyl groups in HBPE‐OH and the low viscosity of the blend at curing temperature. The improvements on impact strength and critical stress intensity factor (or fracture toughness, K_1c) were observed with adding HBPE‐OH. The impact strength was 8.04 kJ m^?1 when HBPE‐OH reached 15 wt% and the K_1c value was approximately two times the value of pure epoxy resin when HBPE‐OH content was 20 wt%. The morphology of the blends was also investigated, which indicated that HBPE‐OH particles, as a second phase in the epoxy matrix, combined with each other as the concentration of HBPE‐OH increased. Copyright © 2004 John Wiley & Sons, Ltd.