光束发散度对紫外写入光纤光栅的影响

用傅里叶衍射光学分析了准分子激光束发散度对于光纤光栅制备的影响，发现光束发散角使光纤光栅的布拉格波长发生改变，相位版后干涉场沿光纤轴向和径向不均匀，对制备30dB高反射率光纤光栅造成困难。实验结果与理论分析基本一致，相对于理想平行光束情况，会聚光束使得光纤光栅布拉格波长出现在短波一边，发射光束使得光纤光栅布拉格波长出现在长波一边。     

大焦深成像系统仿真实验研究

如何增大非相干光学成像系统的焦深是应用光学研究领域的热点问题.本文对采用高次非球面光学掩模板与图像处理相结合增大成像光学系统焦深的新方法进行了深入分析,建立了大焦深成像系统仿真实验模型,并进行了大焦深成像系统仿真实验.实验结果证明了该方法在维持原相对孔径的同时使光学系统在较大的离焦范围内有好的成像质量.实际应用中还要综合考虑模板参量、信噪比等关键因素.     

管式炉中半导体激光器巴条Au80Sn20焊料封装研究

为了提高半导体激光器的封装质量和效率,引入管式炉利用夹具进行批量封装。由于封装质量的好坏直接影响半导体激光器的输出特性和使用寿命,利用MOCVD生长808 nm芯片,重点分析了管式炉温度和封装时间对半导体激光器巴条双面金锡封装质量的影响。利用X射线检测、结电压、光电特性参数和smile效应测试手段,确定了管式炉封装半导体激光器巴条的最优封装条件,为以后的产业化提供了指导意义。     

Stencil lithography of gold-black IR absorption coatings

Gold black coatings are deposited through a stencil shadow mask to produce infrared-absorbing patterns with sub-mm lateral dimensions. Such dimensions match the characteristic pitch of Long Wave Infrared (LWIR) array bolometers. Infrared spectral imaging with sub-micron spatial resolution reveals the spatial distribution of absorption across the pattern.     

An investigation on surface tensions of Pb-free solder materials

Surface tensions of some Pb-free solder systems such as Ag–Bi–Sn with cross-sections Ag/Bi = 1/1, Ag/Bi = 1/2, Ag/Bi = 2/1, In–Sn–Zn with cross-sections Sn/In = 1/1, Sn/In = 1/3 and (Ag₇Cu₃)_100?x Sn_x with cross-section Ag/Cu = 7/3 are calculated from the sub-binary surface tension data using the models, such as the Muggianu, Kohler, Toop models, Butler’s equation and Chou’s General Solution Model (GSM) at 873, 923 and 1073 K, respectively. The surface tension of In–Sn–Zn increases wavily with increasing amount of Zn and it is found that the best models are the GSM for both cross-sections in question while GSM becomes the best model for (Ag₇Cu₃)_100?x Sn_x alloy in the whole experimental range. Moreover, the surface tension of (Ag₇Cu₃)_100?x Sn_x decreases slightly with increasing amount of Sn. The Muggianu, Butler and Butler models are determined as the best models for the cross-sections in the order given above for entire measurement range, respectively, and the surface tension of Ag–Bi–Sn decreases slightly with an increasing amount of Bi and Ag but increases with increasing Sn in liquid alloys.     

一种基于OTF稳定性的波前编码相位板优化方法

提出了一种简单的可用于光学系统中子午弧矢方向白光OTF稳定性评价的波前编码相位板参量优化方法.该方法仅以标准偏差来评价OTF在目标景深范围内的稳定性,并且结合自适应模拟退火算法在参量空间内优化得到相位板的最佳参量.使用该方法优化得到的相位板参量,可以大幅度提高光学系统的景深,并且可以获得更为清晰、稳定的成像.对应用波前编码技术前后光学系统的成像性能作了比较,并且考察了优化参量的容差性.     

Surface analysis of ripple pattern on PS and PEN induced with ring‐shaped mask due to KrF laser treatment

The approach for ripple nanopattern construction on surface of two polymer substrates [polyethylene naphthalate (PEN) and polystyrene (PS)] exposed by a KrF pulse excimer UV laser through a contact lithographic mask with circular slit was proposed in this paper. Thin layer of gold was deposited on samples after the laser treatment. Changes in the morphology of the surface of both the shielded and exposed areas of the substrates, as well as the dimensions of the laser‐induced periodic surface structures, were determined (by atomic force microscopy, laser confocal microscopy and scanning electron microscopy), compared with observations and measurements made on samples treated directly (without a contact mask) under the same conditions. The morphology of the interface between the treated and untreated regions was also closely studied. Surface chemistry of treated samples was studied in detail by X‐ray Photoelectron Spectroscopy. The detailed study of surface chemistry of modified PEN and PS revealed a significant increase of oxygen concentration for laser treated PS and increase of carboxyl groups in case of PEN. The potential application of this research can be found in biotechnology, micro technology and several other fields. Copyright © 2016 John Wiley & Sons, Ltd.     

Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy

The Sn‐Zn alloys have been considered as lead‐free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and micro‐creep of the Sn‐9Zn lead‐free solders were investigated. It is shown that the alloying additions of Indium to the Sn‐Zn binary system result in a suppression of the melting point to 187.9 °C. From x‐ray diffraction analysis, a new intermetallic compound phase, designated β‐In₃Sn is detected. The formation of an intermetallic compound phase causes a pronounced increase in the electrical resistivity and mechanical strength. Also, an interesting connection between dynamic Young's modulus and the axial ratio (c/a) of the unit cell of the β‐Sn was found in which Young's modulus increases with increasing the axial ratio (c/a). The ternary Sn‐9Zn‐xIn exhibits creep resistance superior to Sn‐9Zn binary alloy. The better creep resistance of the ternary alloy is attributed to solid solution effect and precipitation of In₃Sn in the Sn matrix. The addition of small amounts of In is found to refine the effective grain size and consequently, improves hardness. The 89%Sn‐9%Zn‐2%In alloy is a lead‐free solder designed for possible drop‐in replacement of Pb‐Sn solders. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Optical fabrication of three-dimensional photonic lattices in LiNbO3:Fe crystals with a single amplitude mask

We fabricate three-dimensional nonlinear photonic lattices in iron-doped lithium niobate photorefractive crystal for the first time by a single amplitude mask. The experimental setup of this method is very simple and flexible. The period of the lattices can be dominated easily. We analyze the three-dimensional photonic lattices by plane wave guiding and far field diffraction pattern imaging. The induced photonic lattices can exist stably for a long time in the photorefractive crystal.