Dynamic bending of a symmetric piezoelectric laminated plate with a through crack

The dynamic theory of linear piezoelectricity is applied to analyze the scattering of time harmonic flexural waves by a through crack in a symmetric piezoelectric laminated plate subjected to electric field loading. An incident wave giving rise to moments symmetric about the crack plane is considered. Piezoelectric layers are added to the upper and lower surfaces. Classical lamination theory is extended to include dynamic piezoelectric effects. Fourier transforms are used to reduce the problem to the solution of a pair of dual integral equations, the solution of which is then expressed in terms of a Fredholm integral equation of the second kind. The dynamic moment intensity factor vs. frequency is computed and the influence of the electric field on the normalized values is displayed graphically.     

半无限极大极小问题的全局收敛方法

利用广义伪方向导数，在较弱的条件下，给出了半无限极大极小问题（P）的全局收敛性理论算法模型；利用离散策略给出了问题（P）全局收敛的可实现算法．数值结果表明本文给出的可实现算法是有效的．     

Generalized Semi-Infinite Programming: Optimality Conditions Involving Reverse Convex Problems

This article deals with a generalized semi-infinite programming problem (S). Under appropriate assumptions, for such a problem we give necessary and sufficient optimality conditions via reverse convex problems. In particular, a necessary and sufficient optimality condition reduces the problem (S) to a min-max problem constrained with compact convex linked constraints.     

切槽孔爆破动态力学特征的动焦散线实验

应用爆炸加载的透射式动焦散线测试系统,分析了有机玻璃切槽孔爆破模型的裂纹动态特征变化规律。比较了不同切槽角度、切槽深度的定向断裂裂纹尖端的扩展长度、扩展速度和动态应力强度因子。初步探讨了切槽爆破的动态效应,研究表明切槽孔爆破早期裂纹破坏模式为爆炸拉应力波作用下的I型快速扩展裂纹,裂纹尖端拉应力集中积聚的较大应变能维持了爆炸裂纹进一步扩展,裂纹尖端扩展后期表现为P波、S波共同作用下的复合型扩展特征。切槽角为60时获得的定向断裂效果最好,合理切槽深度为炮孔半径的1/4～1/2。     

三维含裂纹有限大体剪切型应力强度因子能量释放率方法的封闭解

本文利用能量释放率法,导出三维含裂纹有限大体剪切型应力强度因子的封闭解。这种方法非常节省机时,可获得大量K_Ⅱ和K_Ⅲ的有用结果,所得结果与现有少量结果基本吻合。     

一种裂纹扩展的有限元仿真分析方法及其实现

为分析含多裂纹体在任意载荷下的断裂过程问题,给出了一种基于有限元的仿真方法及程序.基于商业有限元软件的应力分析结果和合适的断裂力学准则,判断裂纹的扩展以及扩展角;通过对每一个裂纹尖端扩展影响区域进行单元重划分,实现了多裂纹任意扩展的几何描述有限元模型更新.由于只对裂纹扩展区局部进行有限单元更新,网格划分和前期网格结果到新网格的映射的工作量相对较小,典型的裂纹扩展分析实例表明本文方法和程序的有效性.     

Analytical solution of multiple moving cracks in functionally graded piezoelectric strip

The dynamic behaviors of several moving cracks in a functionally graded piezoelectric (FGP) strip subjected to anti-plane mechanical loading and in-plane electrical loading are investigated. For the first time, the distributed dislocation technique is used to construct the integral equations for FGP materials, in which the unknown variables are the dislocation densities. With the dislocation densities, the field intensity factors are determined. Moreover, the effects of the speed of the crack propagation on the field intensity factors are studied. Several examples are solved, and the numerical results for the stress intensity factor and the electric displacement intensity factor are presented graphically finally.     

微小缺口/孔洞的激光衍射无损检测

基于裂纹和孔洞的小尺寸特征,提出了微小缺口/孔洞的激光衍射无损探测技术,给出了解析表达式.通过这一技术,对单向拉伸试件中所含单边缺口和中心孔洞在外载作用下的演化过程进行了实时原位检测,获得了缺口/孔洞孔径随载荷的变化曲线及模拟裂纹时裂纹的张开位移、裂纹开裂长度及应力强度因子等一系列断裂参数.     

基于裂纹附加模态Timoshenko梁的裂纹损伤识别

将梁中横向裂纹等效为无质量扭转弹簧，并忽略其对梁剪切变形的影响，得到的具有任意裂纹数目Timoshenko 梁自振模态的统一显示解析表达式．将裂纹梁的自振模态分为基本模态和裂纹附加模态，利用最小二乘拟合，建立了利用裂纹附加模态函数的梁裂纹损伤识别方法．通过数值模拟开展了简支单裂纹梁以及悬臂和固支双裂纹梁等的裂纹损伤识别，考察了测量误差对损伤识别的影响，数值结果表明本文所提出的裂纹损伤识别方法对裂纹位置的识别精度高于对裂纹损伤程度的识别精度；随着测量误差的增加，裂纹位置及裂纹损伤程度的识别误差增加，但仍在可接受的范围内，故该裂纹损伤识别方法在实际工程中具有一定的应用价值．     

Anisotropic plastic stress field at a mixed-mode crack tip under plane and anti-plane strain

On condition that any perfectly plastic stress component at a crack tip is nothingbut the function ofθ.by making use of equilibrium equations,anisotropic plastic stress-strain-rate relations,compatibility equations and Hill anisotropic plastic yieldcondition,in the present paper,we derive the generally analytical expressions of theanisotropic plastic stress field at a mixed-mode crack tip under plane and anti-planestrain.Applying these generally analytical expressions to the mixed-mode cracks,wecan obtain the analytical expressions of anisotropic plastic stress fields at the tips ofmixed-modeⅠ-Ⅲ,Ⅱ-ⅢandⅠ-Ⅱ-Ⅲcracks.