硬脆材料钻孔加工技术的研究

本文对硬脆材料钻孔加工的几种方法进行了比较,着重探讨了用磨钻头加工孔的技术。用磨钻头加工孔,具有设备简单,效率高,精度高的特点。     

利用位相共轭激光器加工微孔

报道了利用带ＳＦ６气体池受激布里渊散射位相共轭Ｎｄ：ＹＡＧ激光器对０．１ｍｍ厚的刀片进行了微孔加工试验，初步实验结果表明，利用该激光器小的光束发散角这一优点，可加工出出口孔径为２０μｍ微孔。     

0.12mm不锈钢薄板光纤激光回转法打孔工艺优化分析

利用光纤激光加工系统对厚度为0.12mm的SUS304材料进行回转法打孔。通过正交实验方法分析了激光功率比、占空比、切割速度、重复频率、辅助气压等参数对打孔质量的影响。实验结果表明,激光打孔工艺最优参数组合是:切割速度为12mm/s,占空比为8%,重复频率为1.5kHz,功率比为85%,辅助气压为0.8MPa。在此优化参数下得到的最小打孔锥度为0.05°,且微小孔边缘热影响区较小,孔真圆度较好,可以保证较高的打孔质量。     

Picosecond laser cutting and drilling of thin flex glass

We investigate the feasibility of cutting and drilling thin flex glass (TFG) substrates using a picosecond laser operating at wavelengths of 1030 nm, 515 nm and 343 nm. 50 μm and 100 μm thick AF32^®Eco Thin Glass (Schott AG) sheets are used. The laser processing parameters such as the wavelength, pulse energy, pulse repetition frequency, scan speed and the number of laser passes which are necessary to perform through a cut or to drill a borehole in the TFG substrate are studied in detail. Our results show that the highest effective cutting speeds (220 mm/s for a 50 μm thick TFG substrate and 74 mm/s for a 100 μm thick TFG substrate) are obtained with the 1030 nm wavelength, whereas the 343 nm wavelength provides the best quality cuts. The 515 nm wavelength, meanwhile, can be used to provide relatively good laser cut quality with heat affected zones (HAZ) of <25 μm for 50 μm TFG and <40 μm for 100 μm TFG with cutting speeds of 100 mm/s and 28.5 mm/s, respectively. The 343 nm and 515 nm wavelengths can also be used for drilling micro-holes (with inlet diameters of ⩽75 µm) in the 100 μm TFG substrate with speeds of up to 2 holes per second (using 343 nm) and 8 holes per second (using 515 nm). Optical microscope and SEM images of the cuts and micro-holes are presented.     

非均质各向异性地层中方位随钻电磁测井响应三维有限体积法数值模拟算法

方位随钻电磁测井是一种能够实时探测地层边界、实现地质导向与井眼成像的新型测井技术. 本文根据方位随钻电磁测井仪器的典型线圈系结构, 首先引入柱坐标系下非均质完全各向异性地层中电流源并矢Green函数, 并利用电磁场叠加原理给出倾斜发射线圈激发的电场以及倾斜接收线圈上感应电动势的计算公式; 然后应用电流源电场并矢Green函数的混合势克服非均质地层中电磁数值模拟的低感应数问题, 通过ρ 和z方向上Lebedev网格设法降低网格节点个数, 并且利用标准化算法确定柱坐标系下非均质单元上的等效电导率. 在此基础上, 用三维有限体积法建立柱坐标系电场混合势的离散方法, 得到一个交错网格上电场矢势和标势大型代数方程, 并用不完全LU分解以及稳定双共轭梯度法确定数值解. 最后, 通过数据模拟结果对算法的有效性进行检验, 并考察钻铤、线圈倾斜角度以及地层各向异性等参数对仪器响应的影响. 数值结果表明: 在柱坐标系下用三维有限体积法的数值模拟算法处理非均质各向异性层中方位随钻电磁测井响应可以得到很好的结果. 钻铤、电导率各向异性、层边界均对方位随钻电磁波测井响应产生较大的影响; 在电阻率较大的地层, 幅度比和相位差响应越小; 发射线圈和接收线圈同时倾斜时, 幅度比和相位差响应受地层的影响更灵敏.     

Investigation of displacement fields in an abrasive waterjet drilling process: Part 2. Numerical analysis

In this paper, the displacement fields associated with the abrasive waterjet (AWJ) drilling process were simulated using the finite element method. A threedimensional finite element model was established, and justifiable pressure loads were used in the numerical model to simulate the AWJ drilling process. It was assumed that the pressure load in the AWJ could be resolved into three components, such as impact jet pressure, shear and normal pressure. The effect of these three pressure loads and their magnitudes on the surface displacement were investigated as a function of the jet penetration depth through numerical modeling. Using the hybrid experimental-numerical stress analysis approach, the transient state of stress and strain associated with the notch crest of the jet-induced hole at the impingement zone of the target material during AWJ piercing can be modeled numerically. It was found that the shear contributed the most in shaping the displacement contour patterns and that the jet pressure did not play a dominant role in determining theu field displacement. The jet pressure and shear had the most effect on thev field displacement contour pattern. It was demonstrated that the principal stresses at the bottom of the cavity increase as the depth of the hole increases.     

Residual stress determination using blind-hole drilling and digital speckle pattern interferometry with automated data processing

A combined system of blind-hole drilling and digital speckle pattern interferometry that performs automated data analysis is used to determine the magnitude of the residual stress induced in an aluminum plate subjected to uniaxial tension. The authors perform a finite element analysis of the blind-hole drilling process to adjust the analytical model commonly used for residual stress determination. The relieved displacement field due to the introduction of the blind hole is determined by the evaluation of the optical phase distribution. Using more than 300 values of this displacement field, the magnitude of the residual stress is determined and compared with the applied stress value.     

Investigation of laser via formation technology for the manufacturing of high density substrates

Fabrication of micro-vias is one of the critical processes in manufacturing high-density printed circuit boards. The conventional mechanical drilling technique becomes expensive for vias smaller than 200 μm in diameter due to the frequent breakage of the drill bits and machine downtime. The inability to produce blind vias renders the mechanical drilling method of limited use in providing vertical interconnections needed for multi-layer boards. Laser micro-drilling has emerged as one of the most feasible technologies for forming micro-vias. It offers greater resolution over the mechanical technique and is capable of producing vias well below 70 μm, consistently. The feasibility of being able to laser drill depends on the laser characteristics such as wavelength, energy density and pulse shape of the laser beam on the one hand, and on the type, structure configuration and thickness of the PCB substrate on the other hand. As most of the PCB materials have finite absorption characteristics with respect to the laser wavelength, only certain laser types are compatible with the common substrate materials. Laser via-drilling can either be a serial process with one via drilled at a time, or a mask imaging process with many vias drilled simultaneously. In this paper, the issues involved in the laser micro-drilling of PCB vias, including beam characteristics and processing mechanisms, for different substrates are investigated. A brief comparison with the other two emerging technologies, i.e. photo-vias and plasma etching is also discussed.     

低场核磁共振法对油基钻井液乳状液乳滴稳定性的研究

采用低场核磁共振技术,针对油基钻井液油包水型乳状液乳滴的稳定性进行研究。引入弛豫试剂Mn Cl2·4H2O对W/Q型乳状液的T2分布曲线进行定性分析,位于10~1 000 ms之间的弛豫峰对应于中度可自由移动水和白油弛豫峰的叠合峰,定义为乳状液弛豫峰;1 000~10 000 ms之间的峰为高度可自由移动水的弛豫峰。基于此,以弛豫峰峰形为定性指标,弛豫峰面积比率和弛豫峰间距为定量指标,针对弛豫试剂、油水比和老化温度等因素对乳状液横向弛豫时间T2分布曲线的影响进行了分析,进而深入研究了其对油基钻井液乳状液乳滴稳定性的影响。还将低场核磁共振分析技术运用于油基钻井液乳状液体系相对含油率的测量。结果表明,低场核磁共振是一种高效、快捷、准确反映油基钻井液乳状液稳定性的分析测试技术,同时,还可用于油基钻井液乳状液或原油相对含油率的测量。     

不同脉冲激光波形在打孔实验上的比较与分析

为了获得高质量小孔,克服单脉冲激光打孔的不足,设计了一种能够产生多脉冲激光波形的激光器电源.并在1mm厚的薄钢片上得到直径小于1mm的小孔.多脉冲打孔理论分析表明,多脉冲激光打孔不但减少了熔融物和等离子体的产生,而且降低了激光打孔对高能量的要求,获得的小孔质量优于单脉冲激光打孔.另外脉冲宽度和脉冲间距的选择对激光小孔加工质量起决定性作用,在加工高质量孔的时候,应该选用较短的激光脉冲宽度.实验表明,利用三脉冲激光输出波形打孔所获得的小孔质量要优于单脉冲激光打孔效果,有效脉冲平均能量为350mJ,宽度为100μs,脉冲间距为100μs.