New model of propagation rates of long crack due to structure fatigue

By comparison of the characteristics of existing models for long fatigue crack propagation rates, a new model, called the generalized passivation-lancet model for long fatigue crack propagation rates （GPLFCPR）, and a general formula for characterizing the process of crack growth rates are proposed based on the passivation-lancet theory. The GPLFCPR model overcomes disadvantages of the existing models and can describe the rules of the entire fatigue crack growth process from the cracking threshold to the critical fracturing point effectively with explicit physical meaning. It also reflects the influence of material characteristics, such as strength parameters, fracture parameters and heat treatment. Experimental results obtained by testing LZ50 steel, AlZnMgCu0.5, 0.5Cr0.5Mo0.25V steel, etc., show good consistency with the new model. The GPLFCPR model is valuable in theoretical research and practical applications.     

GEOMETRICALLY NONLINEAR FINITE ELEMENT MODEL OF SPATIAL THIN-WALLED BEAMS WITH GENERAL OPEN CROSS SECTION

Based on the theory of Timoshenko and thin-walled beams, a new finite element model of spatial thin-walled beams with general open cross sections is presented in the paper, in which several factors are included such as lateral shear deformation, warp generated by nonuni- form torsion and second-order shear stress, coupling of flexure and torsion, and large displacement with small strain. With an additional internal node in the element, the element stiffness matrix is deduced by incremental virtual work in updated Lagrangian （UL） formulation. Numerical examples demonstrate that the presented model well describes the geometrically nonlinear property of spatial thin-walled beams.     

可压缩粘弹性材料Ⅱ型动态扩展裂纹尖端场

为了研究粘性效应作用下的动态扩展裂纹尖端渐近场,建立了可压缩粘弹性材料II型动态扩展裂纹的力学模型,推导了可压缩材料Ⅱ型动态扩展裂纹的本构方程.在稳态蠕变阶段,弹性变形和粘性变形同时在裂纹尖端场中占主导地位,应力和应变具有相同的奇异量级r-1/(n-1).通过渐近分析求得了裂纹尖端应力、应变和位移分离变量形式的渐近解,并采用打靶法求得了裂纹尖端应力、应变和位移的数值结果,给出了应力、应变和位移随各种参数的变化曲线.数值计算表明,弹性变形部分的可压缩性对Ⅱ型裂尖应力场影响甚微,而对应变场和位移场影响较大.裂尖场主要受材料的蠕变指数n和马赫数M的控制.当泊松比ν =0.5时,可以退化为不可压缩粘弹性材料Ⅱ型动态扩展裂纹.     

带功能梯度材料的压电底层中周期裂纹对SH波的散射

本文研究了压电材料底层中周期裂纹对SH波的散射,通过渗透边界条件和界面上连续边界条件,将问题转化为一组带Hilbter核的奇异积分方程。利用利用切比雪夫多项式逼近方法求解Hilbter核的奇异积分方程,给出了标准动应力强度因子和电位移强度因子的表达式。最后通过数值算例说明了几何参数、物性参数,入射波频率和振幅等对强度因子的影响.     

2.5维自愈合C/SiC复合材料的压缩力学行为

试验研究了2.5维自愈合C/SiC复合材料的压缩力学行为,根据材料的细观结构特点,建立了压缩载荷下的损伤力学模型,得到了经纬向压缩的非线性应力应变关系,预测结果与试验值吻合较好。结果表明,经向和纬向的力学行为不同,纬向的压应力逐渐增大时,切线模量逐渐增大,压缩强度为270.05MPa,而经向压应力逐渐增大时,层间损伤逐渐发生,经纱承受的弯矩越来越大,切线模量逐渐降低,破坏强度为128.66MPa。     

周期裂纹和刚性线尖端场干涉效应研究

研究双周期裂纹和刚性线夹杂非均匀材料的反平面剪切问题。基于保角变换技术和椭圆函数理论,获得了问题应力场的全场精确解,给出了裂纹和刚性线尖端应力强度因子的封闭形式解答,讨论了裂纹和刚性线尖端场的干涉效应。数值结果表明：改变水平和垂直分布周期对裂纹和刚性线尖端场影响明显不同;裂纹长度2a逐渐增大时(0≤a/ω1≤0.5),裂纹尖端应力强度因子从1逐渐增大到无限大,而刚性线的尖端场变化不大;刚性线长度2d逐渐增大时(0≤d/ω2≤1),刚性线尖端应力强度因子逐渐减小,而裂纹的尖端场仅略微增大。     

复合材料厚梁精化锯齿理论及有限元分析

由于具有预先满足层间应力连续的优点,锯齿理论被广泛研究和应用.然而,至今锯齿理论仍然存在如下难题:基于锯齿理论构造单元时,需使用满足单元间C1连续的插值函数,难于构造多节点高阶单元,而且精度较低.如果这些问题不被重视和解决,应用此类理论分析复合材料力学问题可能得出不恰当的结论.通过发展高精度的考虑横法向应变的C0型锯齿理论,论文将克服已有锯齿理论遇到的上述难题.基于发展的锯齿理论,构造三节点梁单元验证发展理论模型的性能.     

舰船波浪中航行时的变形分析及其IMU实时测量方法

大型舰船在水面上航行过程由于波浪的作用会产生一定的变形,该变形会降低舰船上姿态信息的精度,影响舰载武器系统的作战效能,针对这一问题,首先对舰船的变形进行理论分析,计算舰船所承受的波浪载荷,将波浪载荷加载到舰船的有限元模型,经计算得到的甲板各节点的角位移及线位移信息,以此来分析舰船的变形。在舰船的关键战位点安装由陀螺仪和加速度计组成的惯性测量单元(IMU),将IMU的输出信息与舰船主惯导的输出信息进行匹配,设计舰船变形估计的卡尔曼滤波器,实时估计IMU安装处的甲板变形角,为舰载武器装备提供准确的局部姿态信息,实验结果证明了所提方法的有效性。     

EFFECT OF LOADING TYPE ON FATIGUE CRACK GROWTH BEHAVIOR OF SOLDER JOINT IN ELECTRONIC PACKAGING

Fatigue cracking tests of a solder joint were carried out using in-situ scanning electron microscopy （SEM） technology under tensile and bending cyclic loadings. The method for predicting the fatigue life is provided based on the fatigue crack growth rate of the solder joint. The results show that the effect of the loading type on the fatigue crack growth behavior of a solder joint cannot be ignored. In addition, the finite element analysis results help quantitatively estimate the response relationship between solder joint structures. The fatigue crack initiation life of a solder joint is in good agreement with the fatigue life （N50%） of a totally electronic board with 36 solder joints.