Polyimide thin films as compensators for liquid crystal displays

The disadvantages of NW-TN-LCD (normally white twisted nematic liquid crystal display) are discussed. The reason that the negative birefringent polyimide thin films are used to compensate NW-TN-LCD to decrease off-axis leakage, improve contrast ratios and enlarge viewing angles is explained. A certain polyimide thin film is taken as an example to show the compensation effect on NW-TN-LCD. © 1997 John Wiley & Sons, Ltd.     

Preparation and absorption spectrum studies of aromatic and alicyclic poly(amide acid) ammonium salts in water and DMF and in films

A series of ammonium salts of poly(amide acid)s (PAS) were prepared from various poly(amide acid)s (PAA) with tertiary amines. The solubility of poly(amide acid) ammonium salts prepared from PAA(PMDA/ODA) in water is related to the ion concentration of tertiary amines. In order to elucidate the influence of the chemical structures of poly(amide acid)s and poly(amide acid) ammonium salts on their absorption spectra, pyromellitic dianhydride (PMDA), 3,3′,4,4 ′-biphenyltetracarboxylic dianhydride (BPDA), and 3,3′,4,4 ′-benzophenonetetracarboxylic dianhydride (BTDA) were chosen to react with p-phenylenediamine (PDA) and (4,4′-diaminodicyclohexyl)methane (DCHM) to give three kinds of aromatic PAAs and three kinds of alicyclic PAAs. The corresponding PASs were prepared by the reaction of PAAs with triethanolamine (TEA). Their ultraviolet–visible (UV–vis) absorption spectra were investigated compared to those of model compounds. A transparent film without absorption above 320 nm was obtained for PAS(PMDA/DCHM). The difference in absorption spectra of PAS(PMDA/PDA) from that of PAS(PMDA/DCHM) can be related to the existence of intra- and intermolecular charge transfer (CT) for PAS(PMDA/PDA). The absorption spectra of PASs with PDA in films are red shifted compared to those of corresponding PAAs in films, while the absorption spectra of PASs in water are blue shifted compared to those of corresponding PAAs in DMF. No differences in the absorption spectra of PAAs and PASs were found in DMF/H₂O (9/1) mixed solvent. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1329–1340, 1998     

Unique fluorescence behavior of perylenetetracarboxydiimides in polyimide systems

Perylenetetracarboxydiimide (PEDI) molecularly dispersed in polyamic acid (PAA) and polyimide (PI) films has unique fluorescence properties. An originally strong fluorescence of PEDI is efficiently quenched in the PAA films. The systematic variation of the chain structure of the PAA matrices revealed that the aromatic amide groups in the PAA chains function as a quencher. When a PAA derived from 3,4,3′4′-biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA), BPDA/PDA, was used as a matrix polymer, the fluorescence of the dye dispersed in the film increased abruptly as imidization of the matrix proceeds. But annealing at temperatures higher than 320°C in the step-heating process caused a gradual decrease in the fluorescence intensity. The decreased intensity results from the dye–PDA units interactions intensified by the denser molecular packing of the matrix polymer chains. PEDI shows significant dependence of the fluorescence intensity on the chain structure of the PI matrices. In the various PI films containing a fixed diamine component, the dye fluorescence intensity reduces linearly with an increase in the intramolecular charge transfer ability of the PI matrices. From the result, we propose a fluorescence quenching mechanism through multistep electron transfer processes. The BPDA/PDA polyimide matrix leads to a strong PEDI fluorescence whereas the pyromellitic dianhydride (PMDA)-based PI matrices do not. For the blends composed of these PIs, the fluorescence of PEDI bound into the main chains provides a valuable indicator of the miscibility on the molecular level. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 827–840, 1998     

Synthesis and characterization of arylene ether imide reactive oligomers and polymers containing diaryl alkyl phosphine oxide groups

The diamine monomer bis(m-aminophenyl) methyl phosphine oxide (DAMPO) was synthesized via nitration and reduction of diphenyl methyl phosphine oxide. Rigorous purification of this monomer enabled its utilization in the synthesis of high molecular weight poly(ether imide)s. Both thermoplastic materials and thermosetting systems, endcapped with either phthalic or phenylethynylphthalic anhydride, respectively, have been produced. Major emphasis has been placed on polyimides derived from 2,2′-bis(4-(3,4-dicarboxyphenoxy) phenyl) propane dian- hydride, also known as bisphenol-A dianhydride, or BPADA. High molecular weight homo- and copolyimides based on BPADA/DAMPO had glass transition temperature values in the range of 215–223°C, and were totally amorphous. They displayed higher modulus and tensile strength values than the polyetherimide control based on meta-phenylene diamine and also generated high TGA char yields in air. Phenylethynyl crosslinkable materials were effectively cured at 380°C to produce networks that are ductile, very solvent resistant and also generate high char yields, which suggest their possible utilization in fire resistant matrix systems. © 1998 John Wiley & Sons, Ltd.     

Heat-resistant polyimides with low CTE and water absorption through hydrogen bonding interactions

A novel diamine, 1H,1′H-(2,2′-bibenzimidazole)-5,5′-diamine (DPABZ), containing bisbenzimidazole unit was successfully synthesized, and used to prepare a series of copolyimides BPDA:(ODAm/DPABZn) by polycondensation with 4,4-diaminodiphenyl ether (ODA) and 4,4-biphthalic anhydride (BPDA). For comparison, a series of copolyimides BPDA:(ODAm/PABZn) based on another benzimidazole diamine 5-amino-2-(4-aminobenzene)-benzimidazole (PABZ) was also prepared. As a result, with the increase of PABZ or DPABZ content, the heat resistance (T_g and T_d) and mechanical properties (σ and E) of the resulting polyimide (PI) films increased, while the coefficient of thermal expansion (CTE) decreased. Overall, the DPABZ-based PIs showed higher T_g values and much lower CTE values than PABZ. As the content of PABZ increased, the water absorption of PABZ-based PIs increased obviously, but no significant change in DPABZ-based PIs. The intramolecular hydrogen bonding in DPABZ-based PIs caused by the diamine DPABZ was believed to be the reason for the aforementioned differences. The BPDA: DPABZ film with low-water adsorption of 2.1%, high-T_g value of 436°C and low-CTE value of 5.4 ppm/°C could be a promising new generation of flexible display substrates.     

Study on the enhancement of the interface performance between CF and polyimide by triethylamine grafting nano-TiO2 particles

The TiO₂ is grafted by triethylamine and is introduced on the surface of the carbon fiber, which improves the wettability and activity of the carbon fiber surface and at the same time strengthens the carbon fiber/polyimide composite. Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS) confirmed the triethylamine grafting successfully on TiO₂. Scanning electron microscope (SEM) results show that when the trimethylamine concentration is 1.0%, a uniform coating is formed on the surface of the carbon fiber. The interlaminar shear strength (ILSS) and interfacial shear strength (IFSS) were increased by 32% and 69%, respectively.     

Alkaline-developable positive-type photosensitive polyimide with high mechanical strength and high resolution based on chain extendable poly(amic acid), thermally degradable cross-linker and photoacid generator

A positive-type photosensitive polyimide ( PSPI ) based on a chain extendable poly(amic acid) ( PAA ), a thermally degradable cross-linker 1,3,5-tris[(2-vinyloxy)ethoxy]benzene ( TVEB ), and a photoacid generator (PAG) (5-propylsulfonyloxyimino-5H-thiophene-2-ylidene)-(2-methylphenyl)acetonitrile ( PTMA ) has been developed. The chain extendable PAA was prepared from 3,3′,4,4′-biphenyltetracarboxylic dianhydride ( BPDA ) and 4,4′-oxydianiline ( ODA ) and end-capped with di-tert-butyl dicarbonate ( DIBOC ) in N-methyl-2-pyrrolidone (NMP), which has a controlled molecular weight for developing in a 2.38 wt% tetramethyl ammonium hydroxide aqueous solution ( TMAH _aq ) and undergoes a chain extending reaction during curing stage. The photosensitive resist solution was formulated with the polymerization solution (30 wt% in NMP), TVEB (15 wt% for the polymer), and PAG (4.5 wt% for the polymer). The PSPI showed a sensitivity of 47 mJ cm⁻² and a contrast of 5.8 when exposed to 365-nm light, followed by postexposure baking at 90 °C for 10 min and development with the 2.38 wt% TMAH _aq at room temperature. A fine-positive image with 3-μm line-and-space patterns was obtained on a 3-μm thick film exposed to UV light at 365 nm in the contact-printed mode. After thermal curing at 350 °C for 1 hr, the resulting PSPI features excellent mechanical strength and elongation.     

Synthesis and properties of novel colorless and thermostable polyimides containing cross-linkable bulky tetrafluorostyrol pendant group and organosoluble triphenylmethane backbone structure

A colorless and high temperature resistant fluorinated polyimide (PI) film based on a novel cross-linkable diamine monomer 4,4′-diamino-4″-(2,3,5,6-tetrafluoro-4-ethylenephenoxy) triphenylmethane (DFPTM) was successfully prepared. The special triphenylmethane backbone and the bulky tetrafluorostyrol pendant group in DFPTM gave the PI material eximious solubility in organic solvents, high tensile properties, good thermal stability, and excellent optical transparency (cutoff wavelength for 331 nm and light transmittance above 94% at 450 nm). Furthermore, the styryl could initiate self-crosslinking reaction to form a dense three-dimensional network structure by thermal curing. Hence, the cross-linked PI film showed superior combination property (including excellent resistance to solvents). It's T_g increased by 57.1–306.0°C, the 5% thermal weight-loss temperature improved by 10.2% to 500.0°C, and the tensile strength enhanced by 17.5% to 39.7 MPa. Moreover, after thermal curing, the cross-linked PI attained a lower elongation at break from 8.1 to 3.9%, and the thermal expansion coefficient reduced from 82.2 to 68.8 ppm/°C without obvious loss of optical transparency (cutoff wavelength for 347 nm and light transmittance remained 93.0% at 450 nm).     

Preparation of Meldrum's acid-functionalized polyimides exhibiting organo-soluble,reactive, self-crosslinkable,and colorless features

Functional polyimides (PIs) having some desired properties, for example, organo-solubility, chemical reactivity, crosslinkable feature, and high transparency in visible region, are attractive for specific applications. This work reports an effort to integrate the above-mentioned properties in one polyimide through introduction of Meldrum's acid (MA) moieties to polyimide chains with using a MA-containing diamine (MADA) as a monomer. The polyimide prepared with MADA and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) (PI[MADA-6FDA]) has a number-averaged molecular weight of 56,800 g mol⁻¹, shows good solubility in tetrahydrofuran and aprotic high polar solvents, and exhibits post-reactivity/crosslinkability through MA-mediated ketene chemistry. Crosslinked PI(MADA-6FDA) film shows a glass transition temperature of 289°C, a dielectric constant of about 2.78, and high flexibility bearing a near-180° bending. The MA-mediated ketene chemistry contributes to in situ building up covalent linkages between PI chains and silica nanoparticles (SNPs) in preparation of PI/SNPs nanocomposite films (NCF). Formation of the PI/SNPs NCFs enhances the thermal and mechanical properties, reduces the dielectric constants, and increases the transparency. The properties of the MA-functionalized PI are attractive for further studies on their applications.