镍-磷/纳米碳管化学复合镀层的研究

采用化学复合镀方法,在基体铜片上进行Ni-P／纳米碳管复合镀．用金相显微镜、扫描电子显微镜、X射线衍射仪和显微硬度计等实验手段研究复合镀层的组织、结构和性能．结果表明:随着镀液中纳米碳管含量的增加,复合镀层表面的颗粒变小且密度增加;复合镀层的硬度随纳米碳管含量的增加而提高;此外,纳米碳管的加入,使镀层由非晶变成了纳米晶,促进了复合镀层的晶化．     

Incorporation of nano zinc oxide for improvement of electroless nickel plating

The advantages of electroless nickel plating (EN) include excellent corrosion resistance, wear resistance, solderability, low porosity and uniform thickness even on complex parts and ability to plate on nonconductors. In the present study nano ZnO particles were synthesized by using an electrochemical technique and incorporated the particles into Ni-P plates. An alkaline bath was selected and used for nano zinc oxide incorporation. The electrochemical and metallurgical properties of the Ni-nano ZnO-P plates were evaluated and compared with that of the un-reinforced Ni-P plates. The incorporation of the nano ZnO particles resulted in improvement of metallurgical and corrosion resistance characteristics of the plates.     

Influence of deposition parameters on hard Cr-Al-N coatings deposited by multi-arc ion plating

The Cr-Al-N coatings were synthesized at various substrate bias voltages and nitrogen partial pressures by multi-arc ion plating (M-AIP). The relationships between deposition parameters and coating properties were investigated. Morphologies, phase structures, hardness and adhesion strength of the coatings were analyzed by SEM, XRD, XPS, nano-indenter and scratch tester. The results indicated that with the increase of substrate bias voltages, the surface macroparticles and deposition rate reduced mainly for the resputtering phenomenon. The (Cr, Al)N solid-solution phase kept unchanged, but the Cr₂N and AlN phases disappeared gradually. Due to the change of phase structures and residual compressive stress, the hardness values decreased and the adhesion strength decreased initially and then increased. Similarly, with the increase of nitrogen partial pressures, the phase structures of CrAlN coatings varied from Cr + Cr₂N + (Cr,Al)N to Cr₂N + (Cr,Al)N. The surface macroparticles increased due to the decreasing resputtering efficiency, and the deposition rate increased initially and then decreased due to the resputtering phenomenon. With increasing nitrogen partial pressures, adhesion strength decreased initially and then increased. The microhardness increased mainly due to the increase of Cr₂N contents and decrease of metal macroparticles.     

化学镀金在GaN基发光二极管电极制备上的应用

采用真空蒸镀与化学镀两种方法制备GaN基发光二极管（LED）金电极,分析比较了两种工艺所得芯片成本、外观色差、打线拉力。结果表明,化学镀金可选择性还原欲沉积的金属于电极上,较之蒸镀整面金属,可大幅度节省金属成本,且操作简单易行。化学镀金法所制得金属层,较蒸镀法所制得金属层表面粗糙,可有效减少电极间的色差,且能提高打线或焊线的附着力。     

Microstructural investigation of nickel deposits obtained by pulsed current

Electrodeposited nickel coatings are applied in functional applications to modify or improve corrosion resistance, hardness, wear, magnetic, and other properties. In this work, Nickel deposits were produced by simple pulse electrodeposition using a free-additive Watts bath. It has been shown that pulse current deposition is able to produce coatings with excellent properties in morphology, particle distribution, structure, grain size, hardness and wear resistance. Pulsed techniques present a larger number of variables, so we propose to optimize the parameters which define the pulsed current to obtain deposits with improved properties. The optimization of the conditions of deposition was established and the influence of pulse parameters, namely, pulse on-time, off-time and average current density, on the grain size, surface morphology and crystal orientation was determined. The morphology of the coatings was characterized by observations in scanning electronic microscopy (SEM). X-ray diffraction in symmetric mode was also used to evaluate the structure and principal crystallographic orientations of the deposits. The study showed that pulse current results in better properties of deposits and significantly refined the crystal grain.     

X‐ray‐induced Cu deposition and patterning on insulators at room temperature

X‐ray irradiation is shown to trigger the deposition of Cu from solution, at room temperature, on a wide variety of insulating substrates: glass, passivated Si, TiN/Ti/SiO₂/Si and photoresists like PMMA and SU‐8. The process is suitable for patterning and the products can be used as seeds for electroplating of thicker overlayers.     

脉冲偏压电弧离子镀Cr-O薄膜结构及光学性能研究

采用脉冲偏压电弧离子镀技术在单晶硅基片及石英玻璃上制备了一系列均匀透明的Cr-O薄膜. 用场发射扫描电子显微镜、X射线衍射仪、X射线光电子谱、纳米压痕仪、紫外可见光分光光度计等方法对薄膜的表面形貌、膜厚、相结构、成分、元素的化学价态、硬度和光学性能等进行表征, 主要研究了偏压幅值对薄膜结构和性能的影响. 结果表明, 施加偏压可使薄膜的沉积质量明显提高, 其相结构由非晶态转变为晶体态, 并随着偏压幅值的增加, 由Cr₂O₃相向CrO相转变; 薄膜的硬度先增大后减小, 当偏压为-300 V时, 硬度达到最大值24.4 GPa; 薄膜具有良好的透光率, 最高可达72%; 当偏压为-200 V时, 薄膜的最大光学帯隙为1.88 eV.     

Conductive thin film formation onto radiation grafted polymeric surfaces using electroless plating technique

Surface modification of polypropylene films (PP) was carried out via radiation induced graft copolymerization of 4‐vinyl pyridine (4VP) and acrylamide (AAm) to enhance the adhesion ability of the PP surface for electroless deposition of copper. Factors affecting the grafting process such as suitable solvent, comonomer composition and concentration and irradiation dose were optimized. The grafted films produced were characterized by studying their Fourier‐transform infrared (FTIR) spectra and thermal stability. The grafted films were copper‐plated by electroless deposition using Pd as the catalyst to initiate the redox reaction. The influence of catalytic activation method parameters on the plating rate were studied. Scanning electron microscopy revealed a dense and void‐free copper deposited film. The adhesion of the deposited copper film to the modified PP films was determined by measuring the tensile strength of the copper plated films. The electrical characteristics of the copper plated films in comparison with grafted films were studied. The results showed the high adhesion of the deposited copper film to the grafted PP film as well as the high electrical conductivity. Copyright © 2008 John Wiley & Sons, Ltd.     

Mechanism study of femtosecond laser induced selective metallization (FLISM) on glass surfaces

We investigate the mechanism of selective metallization on glass surfaces with the assistance of femtosecond laser irradiation followed by electroless plating. Irradiation of femtosecond laser makes it possible to selectively deposit copper microstructures in the irradiated area on glass surfaces coated with silver nitrate films. The energy-dispersive X-ray (EDX) analyses reveal that silver atoms are produced on the surface of grooves formed by laser ablation, which serve as catalysis seeds for subsequent electroless copper plating.     

复合镀层中ZrO2微粒对基质Ni晶体结构的影响

采用复合电沉积方法制备了Ｎｉ－ＺｒＯ２复合镀层，探讨了ＺｒＯ２微粒引起的基质金属Ｎｉ的晶体择优取向及点阵常数的变化，及其对析氢电催化活性的影响。结果表明，ＺｒＯ２微粒的存在改变了Ｎｉ的电沉积层结构，使基质金属Ｎｉ产生新的沿（２２０）晶面的择优取向。这一新的择优取向不利于析氢反应。择优取向的改变说明复合电沉积过程中，Ｎｉ与ＺｒＯ２微粒是以一定的界面匹配进入复合镀层的，基质金属Ｎｉ点阵参数的改变也证明