Kinetic Regularities Governing the Reaction of Electrodeposition of Iron from Solutions of Citrate Complexes of Iron(III)

The kinetics of a multistep reaction of electrodeposition of iron out of aqueous citrate-containing solutions of trivalent iron is investigated. It is shown that concentrations of major solution components affect the partial current density of discharge of ions of divalent iron. It is established that the deposition of metallic iron occurs as a result of discharge of intermediates, which are hydroxy complexes of divalent iron. Kinetic parameters and mechanism of the reaction of discharge of complexes [FeOH]⁺ to a metallic state are determined. It is mentioned that the formation of poorly soluble hydroxy compounds of trivalent iron in a near-electrode layer leads to a decrease in the iron deposition current.     

Accounting for the Adsorption of Anions When Interpreting the Mechanism of Electrodeposition of Metals from Complex Electrolytes: The Reaction Order by the Electrochemically Active Ion

The relationship between the current and the bulk concentration of complex ions during concurrent specific adsorption of an electrochemically active complex ion and a complexing ligand is considered. The effect of parameters that characterize adsorption of such ions and the structure of the electrical double layer on this relationship is analyzed.__________Translated from Elektrokhimiya, Vol. 41, No. 7, 2005, pp. 817–822.Original Russian Text Copyright © 2005 by Rogozhnikov.     

The peculiarities of the effect of mercury ions on the kinetics of gold electrodeposition from cyanide solutions

The peculiarity of the catalytic effect of complex mercury ions (in the concentration of 10^?5 to 10^?4 M) on the gold electrodeposition from cyanide solutions are studied. It is shown that, all other conditions being the same, the catalytic activity of mercury ions is much lower than that of earlier studied thallium and lead ions. Another peculiarity of catalytic effect of mercury ions is the necessity of prolonged (for tens minutes) contact of gold with the mercury-containing solution. Possible explanation for the obtained regularities is proposed.     

Microstructure and surface mechanical properties of pulse electrodeposited nickel

The surface of carbon steel was modified by electrochemical deposition of Ni in a standard Watt's bath using dc and pulse plating electrodeposition. The aim was to compare the microstructure and surface mechanical properties of the deposit obtained by both techniques. Materials characterization was conducted using field emission scanning electron microscope fitted with scanning transmission electron detector, atomic force microscope and X-ray diffractometer. Nanoindentation hardness, elastic modulus, adhesion, coefficients of friction and wear rates were determined for both dc and pulse electrodeposits. Experimental results indicate that pulse electrodeposition produced finer Ni grains compared to dc plating. Size of Ni grains increased with deposition. Both dc and pulse deposition resulted in grain growth in preferred (2 0 0) orientation. However, presence of Ni (1 1 1) grains increased in deposits produced by pulse deposition. Pulse plated Ni exhibited higher hardness, creep and coefficient of friction and lower modulus of elasticity compared to dc plated Ni.     

Cu(In,Ga)Se2薄膜电沉积制备及性能研究

采用Mo/钠钙玻璃衬底作为阴极,饱和甘汞电极(SCE)为参比电极,大面积的铂网电极作为阳极的三电极体系,以氯化铜,三氯化铟,三氯化镓和亚硒酸的水溶液为电解液,利用电沉积技术制备出黄铜矿结构Cu(In,Ga)Se2多晶薄膜.研究了不同热处理温度对CIGS多晶薄膜材料的组成、结构和表面形貌的影响以及薄膜的光电学性能.实验结果表明当热处理温度为450℃时,所制备的Cu(In,Ga)Se2薄膜的化学组成接近理想的化学计量比,薄膜具有黄铜矿结构,颗粒均匀,致密性较好,在室温下禁带宽度为1.43 eV,具有高的吸收系数.     

A Fast Electrochemical Quartz Crystal Microbalance,which Acquires Frequency and Bandwidth on Multiple Overtones

An electrochemical quartz crystal microbalance (EQCM) is described, which measures the shifts of frequency and bandwidth on multiple harmonics with a time‐resolution of 10 milliseconds. The technique requires the process under study to be repetitive. Examples are square wave amperometry and cyclovoltammetry. Data acquisition is fast because the raw data consist of traces of the electrical admittance at fixed frequencies . A few (∼10) such time traces are acquired sequentially at a set of frequencies evenly spaced around the crystal's resonance. Since all time‐traces are triggered by the same repetitive process, plots of the conductance G (ω_i , t ) and the susceptance B (ω_i , t ) from constant time delays, t , versus frequency can be produced a posteriori. The shifts, ΔG (ω_i ) and ΔB (ω_i ) quantify a difference between two resonance curves, pertaining to the sample's reference state and the state at time t . Fitting a difference of two resonance curves to these data, one obtains shifts of frequency, Δf (t ) and shifts of bandwidth, ΔΓ(t ), versus time. This procedure is repeated for the different overtones. Given the repetitive nature of the process, one may accumulate and average, which lowers the noise down to a few tens of mHz. The capabilities of this instrument are demonstrated with two examples, which are copper deposition/dissolution and electro‐responsivity of a polymer film containing weakly acidic side groups.     

薄膜/涂层的摩擦学设计及其研究进展

介绍了近年来有机分子自组装薄膜(SAMs)、物理气相沉积(PVD)和化学气相沉积(CVD)类金刚石薄膜(DLC)、液相法制备类金刚石薄膜、功能梯度薄膜以及绿色环保电化学沉积镀层的制备及其摩擦学研究进展,讨论了薄膜/涂层的制备方法和影响薄膜/涂层结构及其摩擦学性能的各种因素,评述了几种具代表性的薄膜/涂层摩擦磨损机理,分析并指出了SAMs、DLC、梯度薄膜和电镀镀层的摩擦学研究方向.     

电沉积纳米晶Ni-Co-Fe-P合金镀层的组织结构与摩擦磨损性能

用脉冲电沉积方法制备了纳米晶N i-Co-Fe-P合金镀层.采用X射线衍射（XRD）,透射电镜（TEM）,扫描电镜（SEM）,能谱分析（EDS）等方法研究了合金镀层的微观组织结构和成份.采用显微硬度计和摩擦磨损试验机测试合金镀层的显微硬度和摩擦磨损性能.结果表明：纳米晶N i-40.41%Co-6.16%Fe-1.63%P合金镀层的晶粒尺寸为8.3 nm,显微硬度和耐磨性明显高于不含P的N i-Co-Fe镀层;适当温度退火可以提高镀层的硬度及耐磨性;镀层的耐磨性与其硬度成正相关,且随着硬度的提高,镀层的磨损机理由磨粒磨损和黏着磨损共同作用转变为磨粒磨损主导.     

平面应力条件下闭合断续节理岩体力学特性试验研究

通过平面应力条件下闭合断续节理岩体的破坏试验,采用自行研制的高压柔性加载装置施加垂向和侧向荷载,用千分表和激光散斑照相技术量测试体位移场,用应变花量测试体平面应力场． 结果表明,激光散斑法用于测定闭合断续节理岩体的位移场效果良好,其测值比对应点千分表测值偏小１４％ 左右．据所测得的位移场和应力场,研究了裂纹尖端应力场的演变及裂纹扩展的路径,分析了试体的变形和破坏特征,测定了翼裂纹初裂角,探讨了试体的破坏机理．     

纳米金刚石对电沉积镍基复合镀层微观结构及抗磨性能的影响

利用直流电沉积技术制备了纳米和微米镍镀层,以及纳米金刚石增强镍基复合镀层,考察了纳米金刚石颗粒对纳米及微米镍基质的表面形貌、微结构、硬度及磨损性能的影响．结果表明：引入纳米金刚石使得微米镍镀层的硬度和抗磨性能显著提高;但引入纳米金刚石对纳米镍镀层硬度的影响不大,对镀层的抗磨性能则反而产生不利影响．