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161.
Haisheng Fang Zhi Zhang Yaoyu Pan Ronghui Ma Sheng Liu Mengying Wang 《Crystal Research and Technology》2014,49(11):907-918
Gallium nitride (GaN) is a direct bandgap semiconductor widely used in bright light‐emitting diodes (LEDs). Thin‐film GaN is grown by metal‐organic chemical vapour deposition (MOCVD) technique. Reliability, efficiency and durability of LEDs are influenced critically by the quality of GaN films. In this report, a systematic study has been performed to investigate and optimize the growth process. Fluid flow, heat transfer and chemical reactions are calculated for a specific close‐coupled showerhead (CCS) MOCVD reactor. Influences of reactor dimensions and growth parameters have been examined after introducing the new conceptions of growth uniformity and growth efficiency. It is found that GaN growth rate is mainly affected by the concentration of (CH3)3Ga:NH3 on the susceptor, while growth uniformity is mainly influenced by the recirculating flows above the susceptor caused by natural convection. Effect of gas inlet temperature and the susceptor temperature over the growth rate can be explained by two competing mechanisms. High growth efficiency can be achieved by optimizing the reactor design. 相似文献
162.
163.
Self-screening of the polarized electric field in wurtzite gallium nitride along [0001] direction 下载免费PDF全文
Qiu-Ling Qiu 《中国物理 B》2022,31(4):47103-047103
The strong polarization effect of GaN-based materials is widely used in high-performance devices such as white-light-emitting diodes (white LEDs), high electron mobility transistors (HEMTs), and GaN polarization superjunctions. However, the current researches on the polarization mechanism of GaN-based materials are not sufficient. In this paper, we studied the influence of polarization on electric field and energy band characteristics of Ga-face GaN bulk materials by using a combination of theoretical analysis and semiconductor technology computer-aided design (TCAD) simulation. The self-screening effect in Ga-face bulk GaN under ideal and non-ideal conditions is studied respectively. We believe that the formation of high-density two-dimensional electron gas (2DEG) in GaN is the accumulation of screening charges. We also clarify the source and accumulation of the screening charges caused by the GaN self-screening effect in this paper and aim to guide the design and optimization of high-performance GaN-based devices. 相似文献
164.
165.
在磁性体磁化过程中, 决定其能够达到的最高温度, 对磁热材料的优化选取是重要的. 本文以钆镓石榴石(Gd3Ga5O12) 为例, 根据高磁场下趋近饱和定律的思想, 给出了低温、超强磁场下, Gd3Ga5O12晶体等效磁化率的定量形式. 在外磁场从0---40 T范围内, 计算了该晶体的磁熵变、声子熵变以及磁性体温度随外磁场的变化, 结果均与实验值符合较好. 利用声子熵变与饱和磁熵变曲线交点的唯一性, 给出了在磁性体磁化过程中, 确定其温度达到最大值的方法, 预言了Gd3Ga5O12晶体在绝热磁化过程中达到的最高温度为64.7K. 该方法还可以对所加外磁场大小进行预言或估计. 相似文献
166.
Accumulation-type GaN metal-oxide-semiconductor field-effect transistors (MOSFETs) with atomic-layer-deposited Al2O3 gate dielectrics are fabricated. The device, with atomic-layer-deposited Al2O3 as the gate dielectric, presents a drain current of 260 mA/mm and a broad maximum transconductance of 34 mS/mm, which are better than those reported previously with Al2O3 as the gate dielectric. Furthermore, the device shows negligible current collapse in a wide range of bias voltages, owing to the effective passivation of the GaN surface by the Al2O3 film. The gate drain breakdown voltage is found to be about 59.5 V, and in addition the channel mobility of the n-GaN layer is about 380 cm2/Vs, which is consistent with the Hall result, and it is not degraded by atomic-layer-deposition Al2O3 growth and device fabrication. 相似文献
167.
S. Sankar Naik V. Rajagopal Reddy Chel‐Jong Choi Jong‐Seong Bae 《Surface and interface analysis : SIA》2012,44(1):98-104
Palladium/Vanadium (Pd/V) Schottky structures are fabricated on n‐type InP (100) and the electrical, structural and surface morphological characteristics have been studied at different annealing temperatures. The extracted barrier height of as‐deposited Pd/V/n‐InP Schottky diode is 0.59 eV (I–V) and 0.79 eV (C–V), respectively. However, the Schottky barrier height of the Pd/V Schottky contact slightly increases to 0.61 eV (I–V) and 0.84 eV (C–V) when the contact is annealed at 200 °C for 1 min. It is observed that the Schottky barrier height of the contact slightly decreases after annealing at 300, 400 and 500 °C for 1 min in N2 atmosphere. From the above observations, it is clear that the electrical characteristics of Pd/V Schottky contacts improve after annealing at 200 °C. This indicates that the optimum annealing temperature for the Pd/V Schottky contact is 200 °C. Basing on the auger electron spectroscopy and X‐ray diffraction results, the formation of Pd‐In intermetallic compound at the interface may be the reason for the increase of barrier height upon annealing at 200 °C. The formation of phosphide phases at the Pd/V/n‐InP interface could be the reason for the degradation in the barrier heights after annealing at 300, 400 and 500 °C. From the AFM results, it is evident that the overall surface morphology of the Pd/V Schottky contacts is fairly smooth. Copyright © 2011 John Wiley & Sons, Ltd. 相似文献
168.
Dajiang Mei Wenlong Yin Kai Feng Lei Bai Zheshuai Lin Jiyong Yao Yicheng Wu 《ChemInform》2012,43(16):no-no
The new title compound is prepared from a mixture of AgGaSe2 (obtained from the elements at 900 °C, 2 d) and CsI in the molar ratio 1:2 (silica tube, Ar, 800 °C, 48 h). 相似文献
169.
《Analytical letters》2012,45(10):1907-1920
Abstract A method for the determination of trace amounts of gallium has been developed, based on the formation of a fluorescent complex between Ga (III) and 5-Bromosalicylidene-o-aminophenol (5-BrSOAPh). With excitation at 425 nm the chelate has an emission maximum at 520 nm. The reaction is carried out at apparent pH (pH?) 5.40 in an aqueous-ethanol medium (60% V/V ethanol). The influence of the reaction variables is discussed. 相似文献
170.