It is shown that there are anisotropic elastic materials that are capable of a non-uniform three-dimensional deformation with only one displacement component. For wave propagation, the equation of motion can be cast in the form of the differential equation for acoustic waves. For elastostatics, the equation of equilibrium reduces to Laplace’s equation. The material can be monoclinic, orthotropic, tetragonal, hexagonal or cubic. There are also anisotropic elastic materials that uncouple all three displacement components. The governing equation for each of the uncoupled displacement can be cast in the form of the differential equation for acoustic waves in the case of dynamic or Laplace’s equation in the case of static. The material can be orthotropic, tetragonal, hexagonal or cubic. 相似文献
This paper studies quantitatively the generation of Lamb waves in thin bonded plates subjected to laser illumination, after considering the viscoelasticity of the adhesive layer. The displacements of such plates have been calculated in the frequency domain by using the finite element method, and the time domain response has been reconstructed by applying an inverse fast Fourier transform. Numerical results are presented showing the normal surface displacement for several configurations: a single aluminum plate, a three-layer bonded plate, and a two-layer plate. The characteristics of the laser-generated Lamb waves for each particular case have been investigated. In addition, the sensitivity of the transient responses to variations of material properties (elastic modulus, viscoelastic modulus, and thickness) of the adhesive layer has been studied in detail. 相似文献
The gecko adhesion phenomenon has stimulated efforts to produce synthetic patterned dry adhesives. Besides introducing surface patterns on dry adhesives, it is also highly desirable to understand their intrinsic material properties. This communication reports the viscoelastic behavior of non‐patterned epoxy elastomers exhibiting intrinsic adhesion that is much higher than that of elastomers typically used for structure patterning. The diverse molecular origin of the adhesion is revealed through the study of adhesion against various substrates.
The phenolic epoxy resin (F51) was siliconized by KH550 and the product was named as FKS. A hydroxyl-terminated polydimethylsiloxane (HTPDMS) which was modified with FKS was prepared. The siliconization reaction ensured a segment of siloxane on the side chain of F51. FT-IR and 1H-NMR were employed to confirm the chemical structure of FKS. Morphology observations revealed that the enhancement of mechanical properties of the silicone rubber systems can be attributed to good compatibility between FKS and silicone rubber matrix. Thermogravimetric analysis showed that the residual yield at 800?°C of silicone rubber composites increased significantly when compared with that of neat HTPDMS. The mechanical properties demonstrated that tensile strength and elongation at break of silicone rubber system increased distinctly after modification, especially when 30 phr siliconized F51 were added to the silicone rubber. Shear strength was improved gradually with the addition of FKS. These above observations emphasize the vital effect of FKS on the behavior of modified HTPDMS. 相似文献
In this research, a conductive adhesive based on epoxy resin as the polymer matrix and silver‐coated copper powder and silver‐coated reduced graphene oxide as conductive fillers was synthesized. Graphene oxide was synthesized by modified Hummer's method. It was reduced and modified by silver powder. Copper particles were coated with silver using the electroless plating method. Finally, conductive nanocomposite adhesives were prepared using conductive fillers with different weight fractions. The structural properties of fillers were identified by Fourier‐transform infrared (FTIR) and induced coupled plasma (ICP) analysis and the morphology of the samples by scanning electron microscopy (SEM). Finally, conductive properties, lap shear strength, and thermal stability of adhesive were evaluated. The conductive adhesive prepared with optimized properties have 70% weight percentage silver‐coated copper powder and 1% weight percentage silver‐coated reduced graphene oxide. The bulk resistivity of the optimum sample was 1.6 × 10‐2 Ω.cm, and the lap shear strength was 7.10 MPa. Also, thermogravimetric analysis showed that the weight loss of adhesive decreased from 88.72% to 30.55% during heating, which showed the addition of fillers improves the thermal stability of adhesive. 相似文献