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51.
根据CR传输线模型和QR电路之间的关系,建立了拟合其初值的计算方法,借助Z-View软件,可求得各元件精确值.根据电容(Ci)和电阻(Ri)随特征频率(f*)的分布,推导了元件相对增量与恒相位角元件(Q)指数参数n的关系. 结果表明, 当n小于0.5时,Ci比Ri增加得更快,从新的角度说明了n的物理意义及其和界面脱层之间的关系.作为应用实例,拟合了不同特征的电化学阻抗谱,分析了有机涂层/金属腐蚀体系阻抗变化的具体过程,区分了点蚀和脱层因素对阻抗谱的影响,从高阻抗体系同时得到了与不同空隙率有关的涂层电容和电阻值,并根据涂层体系的不均匀特征探讨了模型结构的物理意义. 相似文献
52.
Jaroslav Stejskal Otakar QuadratIrina Sapurina Josef ZemekAlicja Drelinkiewicz Magdalena HasikIvo K?ivka Jan Prokeš 《European Polymer Journal》2002,38(4):631-637
Silica gel microspheres 7 and 15 μm in diameter were coated with an overlayer of polyaniline camphorsulfonate or hydrochloride during the oxidative polymerization of aniline. Coated silica gel and polyaniline precipitate were separated using a difference in sedimentation rate. In an alternative approach, the microspheres were modified with polyaniline in the presence of 35 nm colloidal silica. This technique prevented the macroscopic precipitation of polyaniline. Coatings of neat, 3-aminopropyl- and octadecyl-modified silica gel with polyaniline hydrochloride were compared. The surface composition of coated microspheres was characterized by X-ray photoelectron spectroscopy. Potential applications of particles in electrorheology, organic catalysis, and in modeling of conductivity behavior in composites are demonstrated. 相似文献
53.
A.A. Ahmed I.M. Youssof A.F. Abbas O. Abou Eleinen 《Journal of Sol-Gel Science and Technology》1998,13(1-3):753-756
The chemical durability of lead glass tumblers (24% PbO) in a 4% (v/v) acetic acid solution before and after coating with sol-gel derived SiO2 films was assessed to determine the extent of reduction in Pb-leaching that can be achieved. It was found that by coating the internal surface of the glass tumblers with 1 ml of 10% TEOS solutions at 100°C and densifying the coating formed at 500°C for 1 h, it was possible to reduce Pb-leaching to about one quarter of that of the uncoated glass. 相似文献
54.
A method for improving separations of peptides and other positively charged species in capillary zone electrophoresis with untreated capillaries using acidic buffers containing tetraalkylammonium cations is described. Tetramethylammonium and tetrabutylammonium cations dynamically modify the capillary surface, leading to a reversal in the direction of the electroosmotic flow. As a result, the adsorption of positively charged peptides and proteins is minimized, and resolution and peak capacity are improved as the migration of cationic analytes is counterbalanced by the electroosmotic flow. The combining effect of reversing electroosmotic flow and cyclodextrin inclusion complexation on separations of closely related peptides and a protein mixture, as well as tryptic digest of hemoglobin is demonstrated. 相似文献
55.
Kiyoharu Tadanaga Kazuki Iwashita Tsutomu Minami Noboru Tohge 《Journal of Sol-Gel Science and Technology》1996,6(1):107-111
Nylon-6 substrates were coated with SiO2 thin films by the sol-gel method and their water permeability coefficient was evaluated. Methyltriethoxysilane (MTES) and tetraethoxysilane (TEOS) were used as starting materials. The addition of MTES to TEOS has enabled the formation of crack-free thin films on the substrates. The thin films strongly adhered to the substrates. The water permeability coefficients of nylon-6 substrates coated with these thin films decreased with the increase in the ratio of TEOS to the total alkoxides. The pretreatment of the nylon-6 substrates with -aminopropyltriethoxysilane was found to be effective to suppress the water permeability. The water permeability was suppressed by about 40% under the optimal condition. 相似文献
56.
The corrosion of printed circuit boards can be effectively prevented with a polyurethane conformal coating. In this study, the protective performance of PU coating was investigated systematically through electrochemical measurements and simulated exposure/immersion tests. Some fungi tests were also included. All experimental results show that a polyurethane coating effectively inhibits corrosion on printed circuit boards. The optimal thickness of the coating film should be about 60 μm. Long-term exposure tests showed that this coating material could preserve the reliability of the investigated printed circuit boards for more than 400 days in a 90% relative humidity environment at 25°C. 相似文献
57.
镀液中Ce^3+离子对锡镀层结构缺陷和可焊性的影响 总被引:1,自引:0,他引:1
应用荧光分析法、X光电子能谱法(XPS)及正电子湮没寿命谱法(PALS)等研究了从含硫酸铈添加剂的酸性光亮锡镀液获得的锡镀层结构缺陷与可焊性的关系。结果表明,电镀时Ce与Sn不发生共沉积,Ce~(3+)的主要作用是阻化Sn~(2+)的水解和氧化使镀液稳定,因而使锡镀层纯度提高、结构致密、表层氧含量减少,有利于提高镀层的可焊性。当Ce~(3+)浓度控制在3.5g/L左右时,可使镀层结构缺陷较少,可焊性较佳,说明结构缺陷是影响锡镀层可焊性的直接原因。 相似文献
58.
59.
John A. Rogers Zhenan Bao 《Journal of polymer science. Part A, Polymer chemistry》2002,40(20):3327-3334
Plastic electronic materials and high‐resolution printing methods may be important technologies for new classes of consumer electronic devices that are lightweight, mechanically flexible and bendable, and that can cover large areas at low cost. This article summarizes some of our recent work in this area. It focuses on the materials and patterning techniques that we used to produce plastic active‐matrix backplane circuits for a type of paperlike display. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 3327–3334, 2002 相似文献
60.