端羧基芳脂型超支化聚酯自组装性能的研究

利用聚电解质逐层浸渍 ( layer- by- layer dipping)法制备自组装膜是最近发展起来的进行表面改性的新方法[1～ 3] .一方面 ,从理论上来说 ,只要是带电荷的聚合物都可以利用该技术制备具有优异性能的自组装膜 ;另一方面 ,还可以通过调节溶液的 p H值和离子强度等控制阴阳离子的组装过程 ,从而控制自组装膜的内部结构和表面形态 ,为在纳米级范围内设计和控制聚合物聚集态内部结构提供了可能性 .近年来 ,具有高度支化结构的超支化分子由于具有独特的物理和化学性能而受到了广泛的关注 [4 ,5] ,但以聚电解质逐层浸渍法制备超支化分子自组装膜…     

聚酰亚胺中空纤维膜用于甲醇/甲基叔丁基醚的分离

甲醇／甲基叔丁基醚混合物的膜法分离，大多采用渗透汽化方法，少有采用蒸汽渗透法。用聚酰亚胺中空纤维膜，对以蒸汽渗透和渗透汽化两种方式分离甲醇／甲基叔丁基醚混合物（甲醇质量分数为0．01－0．30）的效果进行了对比。结果显示，在甲醇质量分数低于0．05时，蒸汽渗透较渗透汽化法的分离性能优越。     

超支化聚氨酯固体电解质导电性能的光谱学研究

用超支化聚氨酯 +线性聚氨酯作为基体 ,LiClO4作为离子源制得聚合物固体电解质 .用Raman光谱 ,FTIR光谱等光谱学方法研究了聚合物电解质中盐离子和聚合物基团之间的相互作用 .研究表明超支化聚氨酯对盐有较好的溶解作用 .研究还表明超支化聚氨酯加入有利于提高体系的电导率     

A low dielectric constant polyimide/polyoxometalate composite

A silane‐modified mono‐lacunary Keggin‐type polyoxometalate (POM), (Bu₄N)₄[SiW₁₁O₃₉{(CH₂?CH? Si)₂O}] (SiW₁₁? CH?CH₂), was obtained by reaction of vinyltrimethoxysilane with K₈(SiW₁₁O₃₉) in acidic MeCN/H₂O mixed solutions. Then, the modified polyoxometalate was physically blended with the pyromellitic dianhydride (PMDA)‐4,4′‐oxydianiline (ODA) poly(amic acid) and the blends were thermally imidized to form polyimide/ polyoxometalate composites. The X‐ray diffraction (XRD) analysis indicates that the polyoxometalate clusters cannot form crystalline structures in the composite, suggesting that the blending leads to improved compatibility between the polymer matrix and the modified polyoxometalate. The EDS (W‐mapping) studies on the composite films reveal that the polyoxometalate clusters are well dispersed in the polyimide matrix. The physical incorporation of modified POM into polyimide remarkably reduced the dielectric constant of the latter from 3.29 to 2.05 when 20 wt% of SiW₁₁? CH?CH₂ was used. Besides, the addition of the modified POM into polyimide increased the storage modulus of polyimide without severely affecting its thermal properties. Copyright © 2009 John Wiley & Sons, Ltd.     

基于超支化温敏聚合物制备温敏金纳米粒子

通过对不同分子量的超支化聚乙烯亚胺(hyperbranched polyethyleni mine,HPEI)的端基进行部分或完全异丁酰胺(isobutyric amide,IBAm)化,可以制备一系列具有不同低临界溶解温度(Lower Critical SolutionTemperature,LCST)的超支化温敏聚合物HPEI-IBAm。通过离子键或氢键之间的相互作用,所得超支化温敏聚合物可以吸附于柠檬酸钠还原并稳定的14nm的金纳米粒子(AuNP)的表面,从而得到具有温敏性质的金纳米粒子。所得温敏金的LCST都低于其相应的温敏聚合物,其差值在0.8至6℃之间。在pH值为9.18的缓冲溶液中,通过改变所用聚合物的分子量以及异丁酰胺基团的取代度,所得温敏金的LCST可控制在21.7~48.2℃之间。此外,所得温敏金的LCST也是pH值敏感的,通过溶液pH值的改变,所得温敏金的LCST值可以在更宽的范围内调节。增加溶液的碱性,LCST可能变化不大或降低,减小溶液的碱性会使LCST升高,直到消失。在偏酸的条件下,所得金复合物通常发生聚集,变得不稳定。此外,溶液中的盐度对所得温敏金的LCST也有影响,氯化钠和硫酸钠会降低其LCST,尤其是硫酸钠的效果更显著。     

通过大分子单体的“点击”反应合成超支化聚苯乙烯

用一端带有一个叠氮基,另一端带有两个炔基的聚苯乙烯(PSt)大分子单体,通过"点击"化学反应,成功制备了结构规整的超支化聚苯乙烯。首先,L-天冬氨酸经过溴化和酯化两步反应得到含有两个炔基的原子转移自由基聚合(ATRP)引发剂——2-溴代琥珀酸双炔丙基酯(BPBS),然后引发苯乙烯的ATRP,并通过NaN3的取代反应把末端溴转化为叠氮基,得到AB2型大分子单体(CH≡C)2-PS-N3。这种大分子单体通过"点击"反应聚合得到超支化聚苯乙烯,根据多角度激光光散射(MALLS)测试结果,最终产物重均聚合度DPw可达53,分子量分布Mw/Mn=1.53。     

Polyimide/polyoxometalate copolymer thin films: synthesis,thermal and dielectric properties

A mono‐lancunary keggin‐type decatungstosilicate (SiW₁₁) polyoxometalate (POM) modified by γ‐aminopropyltriethoxysilane (KH550) was incorporated into polyimide (PI) through copolymerization. Nuclear magnetic resonance (NMR), fourier transition infrared spectroscopy (FTIR), and wide angle X‐ray diffraction (WAXD) were used to characterize the structure and composition of the polyoxometalate–organosilane hybrid (SiW₁₁KH550) and PI/SiW₁₁KH550 copolymers. The differential scanning calorimetry (DSC) studies indicate that the glass transition temperature (T_g) of PI/SiW₁₁KH550 copolymers increases from 330°C (for neat PI) to 409°C (for the copolymer sample with 10 wt% of SiW₁₁KH550). Dielectric measurement showed that both the dielectric constant and the dielectric loss for the copolymer thin films decreased with the increase in SiW₁₁KH550 content, and the dielectric constant and dielectric loss values decreased to 2.1 and 3.54 × 10^?3, respectively, for the copolymer sample with 10 wt% of SiW₁₁KH550. The incorporation of SiW₁₁KH550 into polymer matrices is a promising approach to prepare PI films with a low dielectric constant and low dielectric loss. Copyright © 2009 John Wiley & Sons, Ltd.     

Pattern formation of polyimide by using photosensitive polybenzoxazole as a top layer

A versatile method for positive-type patterning of polyimide (PI) based on a two-layer photosensitive poly(benzoxazole) (PSPBO) and poly(amic acid) (PAA) film has been developed to provide a promising material in the field of microelectronics. This patterning system consisted of a pristine PAA thick bottom-layer and a poly(o-hydroxy amide) (PHA) thin top layer with 9,9-bis[4-(tert-butoxycarbonyl-methyloxy)phenyl]fluorene (TBMPF) as a dissolution inhibitor, and (5-propylsulfonyloxyimino-5H-thiophene-2-ylidene)-(2-methylphenyl)-acetonitrile (PTMA) as a photoacid generator (PAG). The PHA and PAA were prepared from 4,4′-(hexafluoroisopropylidene)-bis(o-aminophenol) and 4,4′-oxybis(benzoic acid) derivatives, and 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 4,4′-oxydianiline, respectively, in N,N-dimethylacetamide. This two-layer system based on PHA (150-nm thickness) and PAA (1.5-μm thickness) showed high sensitivity of 35 mJ/cm² and high contrast of 10.3 when exposed to a 365 nm line (i-line), post-baked at 100 °C for 2 min, and developed in a 2.38 wt.% tetramethylammonium hydroxide aqueous solution/5 wt.% iso-propanol at 25 °C. A clear positive image of a 4-μm line-and-space pattern was printed on a film which was exposed to 100 mJ/cm² of i-line by a contact-printing mode and fully converted to the corresponding PBO/PI pattern upon heating at 350 °C, confirmed by FT-IR spectroscopy. This two-layer system could be applied to the patterning of various PAAs.     

Synthesis and Characterization of Borax-Polyimide for Flame Retardant Applications

Polyamide-borax composites were prepared from solution of polyimide and the borax using N-methyl-2-pyrrolidone as a solvent. The Polyimide-borax composites films (PI-BX) characterized by FTIR, SEM and x-ray. The borax content significantly influences thermal behavior of the polymeric films, such as glass transition and decomposition temperatures of polyimide-borax composites. The glass transition temperatures of the composites were higher than that of the original polyimide. The flammability properties of them were demonstrated by cone calorimeter and indicate that the borax composites have significantly decreased in heat release rate, and mass loss rate. The PI-BX composites appears very good the flame retardant properties.     

利用混合溶剂消除ATRP反应制备多臂星形聚合物的凝胶现象

研究了带有苄氯基团的超支化聚苯乙烯引发苯乙烯和甲基丙烯酸甲酯的ATRP反应的动力学,在良溶剂氯苯中,该反应很容易发生凝胶.如果在氯苯溶剂中反应一段时间后,加入1,4-二氧六环作为不良溶剂,则能有效阻止凝胶反应,最终得到分子量超过百万的星形聚合物.