单分散的二氧化硅微球表面印迹壳层的制备及其对食品包装材料中邻苯二甲酸二苄酯的检测

以邻苯二甲酸二苄酯(DBz P)为模板,以Stber和"种子生长法"相结合获得的二氧化硅微球为载体,采用表面印迹技术成功制备了纳米印迹壳层(MIPs)。采用红外光谱与扫描电镜对其结构和形貌进行表征,同时进行了一系列的吸附性能实验,结果表明,MIPs达到平衡吸附的时间约为30 min,吸附行为符合伪二级动力学。等温吸附实验结果表明,室温条件下MIPs的最大吸附量达47.35 mg/g。对不同温度条件下的等温实验数据进行拟合发现,Langmuir模型与实验数据的吻合度比Freundlich模型更高;Scatchard拟合结果证实该印迹壳层仅含1种结合位点,且印迹位点为均相分布。选择性吸附实验表明MIPs对DBz P的吸附明显高于其他结构类似物。MIPs经10次循环吸附后,吸附效率为83%,表明MIPs具有较长的使用寿命。采用超高效液相色谱(UPLC)技术,以MIPs为吸附剂提取食品包装材料中的DBzP,其加标回收率为88.8%~93.1%,相对标准偏差低于6%。MIPs可作为食品及其包装材料中DBz P提取的备选材料。     

基于焦耳热的光纤布喇格光栅电压传感器研究

设计了一种基于焦耳热的新型光纤布喇格光栅电压传感器以用于小电压的精确监测.实验中通过真空蒸镀法在光栅周围镀上一层金属镍,并将光栅密闭封装在充满气凝胶的铜管中.电压传感通过所镀金属镍层在通电过程中产生的焦耳热引起栅区温度升高,导致光纤光栅反射谱中心波长漂移,从而实现电压与光纤光栅中心波长漂移量的变换.实验表明,封装后的直流电压灵敏度达到520pm/V2,并可用于较低频率的交流传感,且系统结构简单、精度高、易于实现.     

以改进的迈克尔逊干涉仪测量LED封装材料的热膨胀系数

LED封装材料在封装的过程中由于热膨胀的缘故会产生应力,将对LED的发光效率产生较大影响。改装的迈克尔逊干涉仪用于测量二氧化钛/有机硅复合的LED封装材料在不同温度范围内的热膨胀系数,具有测量准确,分辨率高等优点。     

二极管激光器阵列封装工艺对smile效应影响因素分析

Smile效应是限制二极管激光器阵列应用的一个重要因素。研究了激光器封装工艺对smile效应的影响,研究结果表明,造成smile效应的因素主要有两个:一是焊接过程中芯片的焊接压力不均匀;二是芯片与热沉的热膨胀系数不匹配。使用低膨胀系数的压条可以改善焊接过程中芯片压力的均匀性,而增大焊料凝固过程中的降温速率可以降低芯片与热沉的收缩量的差距,这两种方法都有利于改善smile效应。最后通过实验结果证明了以上方法在实际操作中是可行有效的。     

Implementation of new IAEA isotope transport regulations

In the drive for continuous improvement in safety and control, the international regulations which govern the shipment of radioactive materials are being extended and updated. This will have an effect on the way in which Co-60 is transported to and from radiation processing plants. The nature of the regulatory changes is explored in this paper and the effect on users is discussed     

固相萃取-高效液相色谱法同时测定食品塑料包装材料中9种光稳定剂

建立了同时测定食品塑料包装材料中9种紫外光稳定剂含量的高效液相色谱方法。样品用甲醇-乙酸乙酯混合溶剂超声提取,经固相萃取小柱净化后,以ZORBAX SB-C18柱(250 mm×4.6 mm, 5 μm)为分离色谱柱,甲醇和水为流动相,梯度洗脱,以310 nm为检测波长进行定性、定量分析。该方法前处理简单、易操作,9种紫外光稳定剂分离效果良好。9种紫外光稳定剂在0.2～10 mg/L范围内呈良好的线性关系,线性相关系数大于0.999;方法检出限为0.05～0.1 mg/L;实际样品中的加标回收率为70.2%～89.0%,相对标准偏差为0.4%～4.5%。该方法简单、准确,能够满足食品塑料包装材料中紫外光稳定剂的检测要求。     

Characterization of a low concentrator photovoltaics module

Low concentration photovoltaic (LCPV) systems have the potential to reduce the cost per kWh of electricity compared to conventional flat-plate photovoltaics (PV) by up to 50%. The cost-savings are realised by replacing expensive PV cells with relatively cheaper optical components to concentrate incident solar irradiance onto a receiver and by tracking the sun along either 1 axis or 2 axes. A LCPV module consists of three interrelated subsystems, viz., the optical, electrical and the thermal subsystems, which must be considered for optimal module design and performance. Successful integration of these subsystems requires the balancing of cost, performance and reliability. In this study LCPV experimental prototype modules were designed, built and evaluated with respect to optimisation of the three subsystems and overall performance. This paper reports on the optical and electrical evaluation of a prototype LCPV module.     

Enhanced Quality Control of Recycled Paperboard for Food Packaging

A method is reported for the industrial quality control of recycled paperboard for food contact applications. Benzophenones, phthalates, and diisopropyl naphthalene were selected as contamination markers. These compounds are commonly found in recycled paperboard packaging and are known to migrate even into dry nonfatty foods. The method was used to analyze commercial recycled board and involved sample pretreatment by accelerated solvent extraction, evaporation, and purification of the extract, and analysis by gas chromatography–mass spectrometry. The accelerated solvent extraction yields were compared with those obtained by Soxhlet extraction and extraction by immersion, and the recoveries of optimized procedures were estimated. The optimized method showed good repeatability, intermediate precision, and sensitivity. Because of the simplicity and partial automation, this method has potential application for the characterization of recycled paperboard.     

锗-硼硅玻璃局部加热低温封接温度场研究

在光学读出非制冷红外热像仪焦平面阵列(FPA,Focal Plane Array)真空封装结构中,硼硅玻璃和双面镀增透膜的锗片分别作为透可见光和透红外光的窗口材料.由于锗窗上增透膜不能承受高温(<250℃),同时FPA也不能承受高温(<100℃),因此封装过程须在低温下进行,并对锗窗上的增透膜及FPA进行保护.本文提出了一种用于锗-硼硅玻璃低温扩散焊接的局部加热方法.该方法从导热系数较大的锗窗外表面加热(200℃),而导热系数较小的硼硅玻璃窗口外表面维持低温(60℃).有限元模拟计算结果表明,该加热过程稳态情况下待焊接区域温度约200℃,满足低温焊接的温度要求.锗窗上温度(200℃)低于250℃,且FPA区域的温升在75℃以下.用实验方法对模拟结果进行了验证,实验结果同模拟结果一致,证明该方法能够有效地保护FPA及锗窗上的增透膜.