不同封装方式对肖特基二极管高频性能的影响

肖特基二极管是太赫兹接收机的关键器件,通过在高频下对不同封装形式的肖特基二极管进行建模仿真,研究不同封装方式对肖特基二极管性能的影响。首先通过建立肖特基二极管的仿真模型,在高频结构仿真软件HFSS中对肖特基二极管在0~120 GHz频段进行仿真,得到该肖特基二极管的S参数,并对S参数仿真结果和实测结果进行对比,证明了该二极管模型的准确性。然后分别建立肖特基二极管的普通封装模型和肖特基二极管的倒装芯片(flip-chip)封装模型,并对这两种封装模型进行仿真,得到其在两种不同封装结构下的S参数,进而对两种不同封装方式的S参数的-3 dB带宽以及相位一致性进行对比分析。最终,对应用于太赫兹波段的肖特基二极管由于封装不同而带来的带宽以及相位的区别及其成因进行分析,论证了flip-chip封装更适合应用于太赫兹波段的肖特基二极管,与普通封装相比,该封装在高频下对肖特基二极管的电性能有比较大的改进。     

Recent Advances in PLA-Based Antibacterial Food Packaging and Its Applications

In order to reduce environmental pollution and resource waste, food packaging materials should not only have good biodegradable ability but also effective antibacterial properties. Poly(lactic acid) (PLA) is the most commonly used biopolymer for food packaging applications. PLA has good physical properties, mechanical properties, biodegradability, and cell compatibility but does not have inherent antibacterial properties. Therefore, antibacterial packaging materials based on PLA need to add antibacterial agents to the polymer matrix. Natural antibacterial agents are widely used in food packaging materials due to their low toxicity. The high volatility of natural antibacterial agents restricts their application in food packaging materials. Therefore, appropriate processing methods are particularly important. This review introduces PLA-based natural antibacterial food packaging, and the composition and application of natural antibacterial agents are discussed. The properties of natural antibacterial agents, the technology of binding with the matrix, and the effect of inhibiting various bacteria are summarized.     

LED感应局部加热封装试验研究

采用感应局部加热技术,对大功率发光二极管(LED)封装进行了试验研究。结果表明,由于感应加热对材料和结构具有选择性,封装过程中仅Cu-Sn合金焊料层加热,实现了芯片和覆铜陶瓷基板间的热键合。封装后的LED性能测试表明,该封装技术不仅降低了热阻,使LED在高电流下(4倍电流)仍能保持较低的工作温度,而且降低了热应力和整体高温对芯片结构的损坏,提高了器件性能和可靠性。     

GMIDA金属螫合聚合物的应用

螯合单体GMIDA既拥有对金属离子存在较强螯合作用的"半EDTA"结构,又能通过双键共价结合到材料表面引入功能性的螯合基团,这种功能性的高分子大大扩大了材料本身的应用范围.本综述首先对GMIDA聚合物的性质和合成方法进行简短的介绍,然后分析GMIDA聚合物在各个领域的应用,例如基于金属离子与蛋白质特殊的结合作用,GMI...     

水热法制备低维氮化硼纳米结构的研究进展

作为一种宽禁带绝缘材料，氮化硼由于其高导热性、强化学惰性和高热稳定性在热界面材料、光催化和电催化以及储能材料方面引起了广泛的研究兴趣.低维氮化硼纳米结构，如二维纳米片、一维纳米管、纳米棒、纳米线、零维纳米球和量子点等，具有高热导率（600 W/mK）和超宽带隙（5～6 eV），在高导热复合材料、热电材料及电子封装材料等领域具有很好的应用前景，其制备技术及相关性能研究是近年来材料科学领域的热点之一.主要详述了目前水热法制备低维氮化硼（BN）纳米结构的研究进展及存在的问题，并指出深入研究合成机理、研发新型水热制备方法将是今后本领域的重点研究方向.     

负压抽液分装的数学模型

本文介绍了负压抽液分装的数学模型 .由于考虑到所讨论液态物质的渗透性及污染性大等特点 ,采用负压抽液的原理 ,根据能量守恒理论确定抽液所需的负压 (真空度 ) ;根据克拉珀龙方程、分子流运动论的 Knudsen公式等理论 ,确定达到额定压力 (真空度 )所需的时间 (即装置的起动时间 ) .据此设计了一套含有不完全真空保护系统的分装装置 ,用这套装置进行的实验和实际操作 ,其真空度、时间数据与确定值 (计算值 )基本相符 .表明所建立的数学模型正确 ,据此设计的这套装置已成功用于液态物质的分装 .     

直读光谱仪夹具法测定小试样的元素含量

本文提出用直读光谱仪夹具法测定小试样（如小圆钢、钢线等）的杂质元素含量。该方法简便、快速、准确。     

Encapsulating Planar Waveguide-Based Photonic Components with Polymer Coatings

Polymer encapsulation was applied to protect waveguide-based photonic components from moisture attack at the lowest cost. A thin-coating method was developed by analyzing the water transportation in polymers and by evaluating the impact of encapsulation on the waveguides. The results showed that a 7 μm-thick Parylene coating can provide sufficient protection to the wire bonds and fiber-to-waveguide coupling materials. The coated variable optical attenuator easily passed the damp heat test of Telcordia GR 1221. This coating did not have any stress or heat effect on the components, and it costs 90% less than hermetic packaging.     

Attaching Planar Waveguide Dies to Aluminum Using Low-Stress Thermal Conductive Adhesives

We analyzed stress and heat transfer in attached planar waveguides. Die attaching adhesives were known to be the key to avoiding stress buildup in and dissipating heat from waveguides. When adhesives have a shear modulus of less than 1 MPa and a thermal conductivity of 2 w/mk, a 0.1-0.2-mm-thick layer of adhesive can eliminate stress-related effects and efficiently dissipate 30-50 mW/mm² of heat, even if aluminum is used as a substrate. Supersoft thermal conductive adhesives were thus developed and used to attach 60-mm-long AWG dies to aluminum with excellent results.     

Compostability of bioplastic packaging materials: an overview

Packaging waste accounted for 78.81 million tons or 31.6% of the total municipal solid waste (MSW) in 2003 in the USA, 56.3 million tons or 25% of the MSW in 2005 in Europe, and 3.3 million tons or 10% of the MSW in 2004 in Australia. Currently, in the USA the dominant method of packaging waste disposal is landfill, followed by recycling, incineration, and composting. Since landfill occupies valuable space and results in the generation of greenhouse gases and contaminants, recovery methods such as reuse, recycling and/or composting are encouraged as a way of reducing packaging waste disposal. Most of the common materials used in packaging (i.e., steel, aluminum, glass, paper, paperboard, plastics, and wood) can be efficiently recovered by recycling; however, if packaging materials are soiled with foods or other biological substances, physical recycling of these materials may be impractical. Therefore, composting some of these packaging materials is a promising way to reduce MSW. As biopolymers are developed and increasingly used in applications such as food, pharmaceutical, and consumer goods packaging, composting could become one of the prevailing methods for disposal of packaging waste provided that industry, governments, and consumers encourage and embrace this alternative. The main objective of this article is to provide an overview of the current situation of packaging compostability, to describe the main mechanisms that make a biopolymer compostable, to delineate the main methods to compost these biomaterials, and to explain the main standards for assessing compostability, and the current status of biopolymer labeling. Biopolymers such as polylactide and poly(hydroxybutyrate) are increasingly becoming available for use in food, medical, and consumer goods packaging applications. The main claims of these new biomaterials are that they are obtained from renewable resources and that they can be biodegraded in biological environments such as soil and compost. Although recycling could be energetically more favorable than composting for these materials, it may not be practical because of excessive sorting and cleaning requirements. Therefore, the main focus is to dispose them by composting. So far, there is no formal agreement between companies, governments and consumers as to how this packaging composting will take place; therefore, the main drivers for their use have been green marketing and pseudo-environmental consciousness related to high fuel prices. Packaging compostability could be an alternative for the disposal of biobased materials as long as society as a whole is willing to formally address the challenge to clearly understand the cradle-to-grave life of a compostable package, and to include these new compostable polymers in food, manure, or yard waste composting facilities.