Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

SYNTHESIS, CHARACTERIZATION OF DIAMIDE-DIIMIDE-DIAMINES BASED ON L-CYSTEINE AMINO ACID AND THEIR EFFECT ON THE THERMAL PROPERTIES OF DIGLYCIDYL ETHER OF BISPHENOL-A (DGEBA)

The curing behavior of diglycidyl ether of bisphenol-A(DGEBA) with aromatic diamide-diimide-diamines having aryl ether,sulfone and methylene linkages was studied by differential scanning calorimetry(DSC).Nine diamide-diimide-diamines of varying structure were synthesized by reacting 1 mole of dianhydride with 2 moles of L-cysteine(S) in a mixture of acetic acid and pyridine(3:2 V/V) followed by activation with thionyl chloride(SOCl_2) and then condensation with excess of diamines.Structural characterizat...     

A systematic study of the microwave and thermal cure kinetics of the DGEBA/DDS and DGEBA/DDM epoxy‐amine resin systems

The microwave and thermal cure processes for the epoxy-amine systems (epoxy resin diglycidyl ether of bisphenol A, DGEBA) with 4,4′-diaminodiphenyl sulphone (DDS) and 4,4′-diaminodiphenyl methane (DDM) have been investigated for 1 : 1 stoichiometries by using fiber-optic FT-NIR spectroscopy. The DGEBA used was in the form of Ciba-Geigy GY260 resin. The DDM system was studied at a single cure temperature of 373 K and a single stoichiometry of 20.94 wt% and the DDS system was studied at a stoichiometry of 24.9 wt% and a range of temperatures between 393 and 443 K. The best values of the kinetic rate parameters for the consumption of amines have been determined by a least squares curve fit to a model for epoxy/amine cure. The activation energies for the polymerization of the DGEBA/DDS system were determined for both cure processes and found to be 66 and 69 kJ mol⁻¹ for the microwave and thermal cure processes, respectively. No evidence was found for any specific effect of the microwave radiation on the rate parameters, and the systems were both found to be characterized by a negative substitution effect. Copyright © 2002 John Wiley & Sons, Ltd.     

External Stimuli Responsive Characteristics of Epoxy‐Polyamide/Starch Blend Films

Abstract

Polymeric films of varying crosslink densities and of different molar‐concentrations were prepared from the epoxidized oil/diglycedyl ether of bis‐phenol A (DGEBA) epoxy/polyamide/starch by blending at ambient temperature. The influences of external stimuli such as pH, temperature, ionic strength of the swelling media, and the type of buffer on the equilibrium swelling properties were investigated. Polymeric films showed a typical pH and temperature response such as low‐pH and low‐temperature have maximum swelling while a high‐pH and high‐temperature show almost complete deswelling. A change in the ionic strength of the swelling solution from 0.01 to 0.2 M caused a decrease in the equilibrium degree of swelling of polymeric films. Oscillatory swelling was also observed and investigated in response to changes in the pH of the solution. The morphology of selected polymeric films were explained by scanning electron microscopy (SEM) and correlated with mechanical strength.     

Reaction-induced phase separation in a semiinterpenetrating network of reactive ternary blends

Morphology and reaction mechanisms were probed on a model reactive ternary blend system of polycarbonate (PC), poly(methyl methacrylate) (PMMA), and diglycidylether of bisphenol-A (DGEBA) epoxy by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), and Fourier transform infrared spectroscopy (FTIR). Molecular interactions/reactions between the components in the blends after heating treatments are discussed. It was found that reactions took place among the components and that an interpenetrating network was built. The possible reaction mechanisms and the resulting structures after the heating treatments were probed. In the blends, PC and DGEBA reacted to form a network, while PMMA remained free. The semiinterpenetration, however, did not result in a network interlocked into a homogeneous state. The single T_g of the heated ternary DGEBA/PC/PMMA blends actually did not reflect a homogeneous interpenetrating network. Due to relatively small PMMA domains, the ternary blend network exhibited a single T_g. Upon etching the PMMA domains from the blend by acetone, a clearly interpenetrating network of reacted PC and epoxy was exposed and confirmed. The reactions leading to such a morphology are discussed with experimental evidence. © 1996 John Wiley & Sons, Inc.     

Pseudorotaxanes of Cyclodextrin and Diglycidyl Ether of Bisphenol A as Precursors of New Intramolecularly Reinforced Epoxy-based Thermosets

As a preliminary work in the search of potential monomers for new intramolecularly reinforced epoxy-based materials, this investigation has been aimed at the synthesis and the physico-chemical characterisation of the monomers formed by complexation between β- and γ-cyclodextrin (CD) and diglycidyl ether of bisphenol A (DGEBA). Results from steady-state fluorescence suggest that, even at high temperature, the DGEBA forms very stable complexes with both macrocycles (particularly with the β-CD) in aqueous solution. Regardless of the CD and according to the interproton distances obtained from the ROESY spectrum when compared with the simulated ones by semi-rigid docking, the oxirane ring of the DGEBA monomer can be found outside the cavity, while the bisphenol moiety firmly remains attached and buried in the CD. The stability of the adduct and the lack of steric hindrance at the epoxide functional points, make the complex very interesting for the synthesis of crosslinked epoxy based polymers, in which the bisphenol part would be covered and therefore protected by the CD. The semi-rigid docking scheme applied to this host–guest system reveals itself as a useful tool for the search of conformers that fit the experimental distances obtained by NMR, although its utility for the estimation of the free energies of binding is still limited.     

Novel flame‐retardant thermosets: Diglycidyl ether of bisphenol A as a curing agent of boron‐containing phenolic resins

Boron‐containing novolac resins were synthesized by the modification of a commercial novolac resin with different contents of bis(benzo‐1,3,2‐dioxaborolanyl)oxide. These novolac resins were crosslinked with diglycidyl ether of bisphenol A (DGEBA), and their thermal, thermodynamomechanical, and flame‐retardant properties were evaluated. The boron‐containing novolac resins were less thermally stable than the unmodified novolac resin. Their modification degree and DGEBA content were related to the crosslinking density of the materials. The boron‐containing novolac resins generated boric acid at high temperatures and gave an intumescent char that slowed down the degradation and prevented it from being total. They also showed good flame‐retardant properties. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1701–1710, 2006     

Complex specific heat capacity of two nanocomposite systems

Thermal investigations on two selected model-nanocomposites have been made. They differ with regard to the type of the anorganic nanoparticles that have been filled into an organic oligomer matrix. The properties of nanocomposites may vary between those of a simple mixture of independent components and those of a system, where specific interfacial interactions between the constituting parts lead to ‘new’ properties. Depending on the type of the nanoparticles filled into the matrix, the resulting properties might be closer to one or to the other extreme. We used temperature modulated differential scanning calorimetry (TMDSC) to investigate a matrix of the oligomer diglycidyl ether of bisphenol A (DGEBA) filled either with SiO₂- or Al₂O₃-nanoparticles. The dependence of the complex specific heat capacity () on the concentration of nanoparticles shows a clear difference between the two systems as far as the glass transition of the oligomer is concerned. The SiO₂ composite seems to behave more like a simple mixture, whereas the Al₂O₃ composite shows ‘new’ properties.     

Curing kinetics and thermal stability of diglycidyl ether of bisphenol

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS) were investigated by the dynamic differential scanning calorimetry. The imide-amines were prepared by reacting 1 mole of benzophenone 3,3′,4,4′-tetracarboxylic acid dianhydride (B) with 2.5 moles of 4,4′-diaminodiphenyl ether (E)/ or 4,4′-diaminodiphenyl methane (M)/ or 4,4′-diaminodiphenylsulfone (S) and designated as BE/ or BM/ or BS. The mixture of imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, 15 and 20°C min⁻¹) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide-amines as well as on the ratio of imide-amine: DDS used. A broad exotherm was observed in the temperature range of 180–230°C on curing with mixture of imide-amines and DDS. Curing of DGEBA with mixture of imide-amines and/or DDS resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction as determined in accordance to the Ozawa’s method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was highest in case of resins cured using mixture of DDS: BS (0.25:0.75; EBS-3), DDS: BM (0.5: 0.5; EBM-2) and DDS: BE (0.5: 0.5; EBE-2).     

Preparation and thermal properties of diglycidylether sulfone epoxy

A diglycidylether sulfone monomer (sulfone type epoxy monomer, SEP) was prepared from bis(4-hydroxyphenyl) sulfone (SDOL) and epichlorohydrin without any NaOH or KOH as basic catalyst. FT-IR, ¹H NMR, ¹³C NMR and mass spectroscopic instruments were utilized to determine the structure of the SEP monomer. The cured SEP epoxy material exhibited not only a higher T_g (163.81 °C) but also a higher T_g than pristine DGEBA (from 111.25 °C to 139.17 °C) when the SEP monomer moiety had been introduced into the DGEBA system. The thermal stability of cured epoxy herein was investigated by thermogravimetric analysis (TGA). The results demonstrated that the sulfone group of the cured SEP material decomposed at lower temperatures and formed thermally stable sulfate compounds, improving char yield and enhancing resistance against thermal oxidation. Additionally, the IPDT and char yield of the cured SEP epoxy (IPDT = 1455.75, char yield = 39.67%) exceeded those of conventional DGEBA epoxy (IPDT = 667.27, char yield = 16.25%).