基于应变片的自由活塞斯特林制冷机位移测试研究

压缩活塞与排出器的位移大小及相位差对自由活塞斯特林制冷机的制冷性能具有极其重要的影响。文中通过对目前各种位移测试方法优缺点分析,结合自由活塞式斯特林制冷机自身特点,提出了采用应变片响应涡旋柔性弹簧形变来测量活塞和排出器位移的新方法。通过分析、设计和标定,建立了一套基于应变片的自由活塞斯特林制冷机位移测量系统。实验测试结果表明,该位移测量系统是可靠的,具有体积小、投资省等优点,且不需要特别的安装空间。     

催化鸡冠花红褪色动力学光度法测定痕量铜

稀硫酸介质中,基于痕量铜(Ⅱ)对溴酸钾氧化鸡冠花红褪色反应具有较强的催化作用.建立了一种高灵敏度测定痕量铜(Ⅱ)的新催化动力学法.在优化条件下,方法的线性范围为0.0024-0.56μg/mL,检出限为4.4×10-7g/L用于水样中痕量铜(Ⅱ)的测定,结果满意.     

Aminealkylthiol and dithiol self-assembly as adhesion promoter between copper substrate and epoxy resin

To improve adhesion between copper and epoxy resin in printed circuit board, a roughness treatment of copper has been widely used. Nevertheless, new adhesion promoters have to be developed to face the miniaturization and sophistication of the electronic device. Self-assembled monolayers have met increasing interest in this field by using them as coupling agent between copper and the epoxy resin.This paper presents the deposition of an epoxy resin on copper modified by amine alkylthiol and dithiol monolayers and highlights the benefit brought by the monolayer in terms of adhesion.The chemical linkage between the amine SAMs and the epoxy function has been proved by the deposition on a short epoxy fragment, the 2-(4-fluorophenoxy-methyl)oxirane. The deposition of an epoxy resin mixed with amine curing agent has then been successfully achieved on amine terminated SAMs. The resulting polymer is homogeneous and well adherent on their surface, while the adhesion is lower on bare copper and not existing on methyl terminated SAMs. The formation of chemical bond Cu-S and N-epoxy is thus essential to increase the adhesion strength between copper and the polymer.     

Effect of various adsorbates in dephasing and population decay of the Cu(1 0 0) image potential states

A theoretical study of the electron dynamics in image potential states on Cu(1 0 0) surfaces with different types of adsorbates is presented. Scattering of the image state electron by an adsorbate induces inter-band and intra-band transitions leading respectively to the population decay and to the dephasing of the image state. We compare results obtained with low coverage (typically 1 adsorbate atom per 1000 surface atoms) Cs, Ar, and a model electronegative adsorbates. As follows from our results, Cs adsorbates lead to both appreciable dephasing and decay, while electronegative adsorbates mostly affect the dephasing rate. The effect of low coverage Ar adsorbates is small, consistent with their neutrality.     

Chemistry of chloroethylenes on Cu(100): bonding and reactions

The bonding and reactions of chloroethylenes (vinyl chloride, trans- and cis-dichloroethylene, trichloroethylene) on a Cu(100) surface have been investigated by temperature-programmed desorption and reaction, near-edge X-ray absorption fine structure (NEXAFS) studies and measurements of changes of the surface work function. The monolayer molecules adsorb molecularly intact at 95 K via π coordination. The molecules orient with their molecular planes parallel to the surface with little increase (<0.02 Å) in the C---C bond distance compared with the gas phase values. The degree of thermal dissociation increases with the extent of halogenation, and no chlorine is present in the hydrocarbon reaction products liberated from the surface. Both cis- and trans-1.2-chloroethylene produce acetylene and a small amount of benzene, while dissociation of trichloroethylene generates acetylene and deposits a carbon residue on the surface. Vinyl chloride desorbs from Cu(100) without reaction.     

10μm级聚酯薄膜介质电临界击穿场强初步研究

分析了聚酯薄膜电击穿可能的模型,如本征击穿模型和电一机械击穿模型,估算了两种模型下常用聚合物介质的临界击穿场强。实验研究了平板电极结构下10μm级聚酯薄膜的自击穿电压,得出了聚酯薄膜的临界击穿场强450-500kV／mm。实验结果与理论计算值比较表明：本征击穿模型下的聚酯薄膜临界击穿场强都远小于实验结果,电～机械击穿模型下聚酯薄膜临界击穿场强大于实验结果。     

Preparation and characterization of slice-like Cu2(OH)3NO3 superhydrophobic structure on copper foil

Superhydrophobic structure was prepared on copper foil via a facile solution-immersion method. Thus slice-like Cu₂(OH)₃NO₃ crystal was prepared on the surface of the copper foil by sequential immersing in an aqueous solution of sodium hydroxide and cupric nitrate. And the superhydrophobic structure was obtained by modifying the slice-like Cu₂(OH)₃NO₃ crystal with 1H,1H,2H,2H-perfluorodecyltriethoxysilane (FAS-17). The morphologies, chemical compositions and states, and hydrophobicity of the surface-modifying films on the copper foil substrates were analyzed by means of scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and water contact angle measurement. Moreover, the thermal stability of the slice-like structure was also evaluated using thermogravimetric analysis (TGA). It was found that roughening of the copper foil surface helped to increase the hydrophobicity to some extent, but no superhydrophobicity was obtained unless the slice-like Cu₂(OH)₃NO₃ crystal formed on the Cu substrate was modified with 1H,1H,2H,2H-perfluorodecyltriethoxysilane. Besides, the superhydrophobicity of the FAS-17-modified slice-like Cu₂(OH)₃NO₃ structure was closely related to the surface morphology. And this hydrophobic structure retained good superhydrophobic stability at elevated temperature and in long-term storage as well, which should be critical to the application of Cu-matrix materials in engineering.     

2-(2-喹啉偶氮)-5-二甲氨基苯胺光度法测定铜

在pH=4.0的磷酸盐缓冲介质中,CTMAB存在下,2-(2-喹啉偶氮)-5-二甲氨基苯胺(QADMAA)与铜反应生成2:1稳定络合物,络合物λmax=580nm,ε=1.14×105L·mol-1·cm-1.铜含量在0.01-0.6μg/mL内符合比耳定律,方法用于环境样品中铜的测定,结果令人满意.     

铜纳米阵列高效电解水产氧催化剂的制备

本文报道了一种利用简单的两步牺牲模板法,在泡沫铜基底表面完成了三维氧化铜纳米晶阵列的生长. 氧化铜纳米晶阵列具有良好的导电性,稳定性,在碱性溶液中有着优秀的电解水产氧催化性能. 氧化铜纳米晶阵列催化水的电化学氧化只需400 mV的过电势即可达到100 mA/cm²的电流密度,与其它铜基电解水产氧催化剂以及贵金属IrO₂相比都有着明显的优势. 氧化铜纳米晶阵列在270 mA/cm²左右的工作电流下连续工作10 h依然可以保持良好的稳定性,是相同的工作电压下IrO₂工作电流的10倍(约25 mA/cm²).     

Element segregation on the surfaces of pure aluminum foils

The surface segregation trend of trace elements in pure aluminum foils was investigated by density functional theory. The model of nine-layer Al(1 0 0) slab substituted partially by trace element atoms was proposed for calculating surface segregation energy. The calculating results show that (i) B, Mg, Si, Ga, Ge, Y, In, Sn, Sb, Pb and Bi exhibit negative segregation energy and possibly move to the surface, while Be, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu and Zr exhibit positive segregation energies and migrated into the bulk; (ii) the segregation energy was found to be related with the covalent radius, the relaxed position at the surface of the substituting atom and the surface energy; (iii) the segregation behavior of trace element generates lots of defects and dislocation, which can increase the initial pitting nucleation sites in the surface of aluminum foils; (iv) the impurity atom concentration was tested with Pb-doped surfaces, the calculated negative segregation energies in all coverage increases rapidly with the Pb coverage. These conclusions are helpful for designing of the chemical composition and to advance the tunnel etching of aluminum foils.