Synthesis and characterization of copper ink and direct printing of copper patterns by inkjet printing for electronic devices

Among the conventional metallic inks used in the printing process, silver exhibits high conductivity and thermal stability. Nevertheless, due to the high cost of silver, it cannot be extensively used for the fabrication of inks. As a competitive alternative, copper can be considered as a substitute for silver; however, copper ink oxidizes under certain atmospheric conditions. To meet these shortcomings, a cost effective, highly conductive, and oxidation-free copper-based ink has been synthesized in this study, wherein, oxidation of the copper particles in the copper-based ink was prevented by using copper complexes. The copper ink thus fabricated was printed on chemically treated Si/SiO₂ substrates followed by the characterization of the printed copper films. The results of this study confirmed that the synthesized copper ink exhibited properties suitable for its use in the inkjet printing process for fabrication of various electronic devices.     

The kinetics of homogeneous nucleation of silver nanoparticles stabilized by polymers

The formation of Ag nanoparticles synthesized by homogeneous nucleation, stabilized by polymers (PVA and PVP) was monitored by UV–Vis spectrophotometry and transmission electron microscopy. Our aim was to differentiate between the two main phases of particle formation, i.e. nucleation and growth and to characterize their rates with the help of appropriate kinetic equations. Time resolved spectrophotometric measurements revealed that particle formation is an autocatalytic process: a slow, continuous nucleation phase (3–5 min) is followed by a rapid, autocatalytic growth phase where the maximal particle size is 5–7 nm. By freezing the reaction mixture, the process of particle growth can be followed from 5 to 40 min on TEM pictures. The first order rate constants were calculated and they are strongly depend on the polymer concentration. If the growing particles are attached by PEI to the surface of a solid support, the formation of silver nanoparticles can also be followed by atomic force microscopy (AFM) and we can control the particle growth on mica surface. The cross section analysis of the pictures show, that the particle growing process can be also monitored at solid–liquid interface.     

Synthesis, characterization and comparison of sediment electro-codeposited nickel-micro and nano SiC composites

Nickel-silicon carbide composites were produced using 1 μm and 50 nm size powders from a conventional Watt's bath using tetra methyl ammonium hydroxide as the surfactant. Sediment codeposition technique with horizontal electrodes was used. The effect of silicon carbide concentration and bath operating parameters on the volume percents and deposition rates of coatings obtained with the two different particles was studied. Substantial improvements in mechanical properties such as hardness, wear resistance, scratch resistance and roughness were obtained with the nanocomposite material, as compared with composites containing microsized particles.     

The effect of the sputtering process ambient on the magnetic state and phase composition of the film nanocomposites (Fe0.45Co0.45Zr0.10) x (Al2O3)1−x

The effect of oxygen-containing ambient arising at sputtering of granular nanocomposites (Fe_0.45Co_0.45Zr_0.10) _x (Al₂O₃)_1−x (30 at.%≤x≤65 at.%) on their magnetic state and phase composition has been investigated. It was shown that the presence of oxygen resulted in the formation of oxide shells preventing the ferromagnetic interaction between Co_0.45Fe_0.45Zr_0.10 nanoparticles and also the formation of metallic percolative net beyond the percolation threshold (as opposed to the films prepared in pure argon atmosphere).     

Electrical characterization of Schottky diodes based on boron doped homoepitaxial diamond films by conducting probe atomic force microscopy

A large planar tungsten carbide (WC) Schottky diode on p-type homoepitaxial diamond was mainly investigated on a microscopic level by atomic force microscopy (AFM) and conducting probe atomic force microscopy (CP-AFM), allowing simultaneous topographic and local electrical resistance imaging measurements. These techniques revealed the existence of a specific microstructure on the WC Schottky contact consisting of electrically insulating islands surrounded by conductive paths. The islands are found to be insulating in the whole range of explored bias [−5 V, +5 V], whereas the current flowing between the islands is 1000 times lower at a reverse bias of −5 V than at a forward bias of +5 V, in agreement with the rectifying ratio found from macroscopic current–voltage (I–V) measurements. CP-AFM provides a prospective imaging tool which is well suited for analyzing the local electrical properties and instabilities of Schottky junctions.     

Electrodeposition of alginate with PEDOT/PSS coated MWCNTs to make an interpenetrating conducting hydrogel for neural interface

Neural interface is a critical component for the communication between the central nervous system and outside devices. But neural tissues withstand constant mechanical activity with outside devices which aggravates inflammation response. The investigation about soft interfacial modification materials for neural implants is a promising way to reduce the mechanical mismatch of neural tissues and implants. In this study, soft alginic acid gel and poly(3, 4-ethylenedioxythiophene)/poly(styrene sulfate)(PEDOT/PSS) coated multi-walled carbon nanotubes(MWCNT) was co-deposited on a microwire neural electrode, then PEDOT/PSS was electrochemically grown through the coating material to form a kind of soft interpenetrating networks (IPNs) for the improvement of neural interface. Compared to unmodified electrodes, the modified electrodes possess higher charge storage capacity (CSC) and lower electrochemical impedance, which would benefit the performance of stimulating and recording respectively. The IPNs are very soft after reswelling in brain tissue, and the cell experiment indicate its fantastic biocompatibility. Furthermore, acute neural recording experiments revealed that the IPNs reduced the noise floor. All these characteristics are greatly desired for the neural interface. Overall, we developed a soft interpenetrating conducting hydrogel coating material on the neural interface with excellent electrical and biological performance.     

Structural transition of secondary phase oxide nanorods in epitaxial YBa2Cu3O7−δ films on vicinal substrates

A theoretical study of a structural transition of secondary phase oxide nanorods in epitaxial YBa₂Cu₃O_7?δ films on vicinal SrTiO₃ substrates is presented. Two possible types of film/substrate interface are considered, with one assuming complete coherence, while the other is defective as manifested by the presence of antiphase grain boundaries. Only in the former case does the increase of the vicinal angle of the substrate lead to a substantial change of the strain field in the film, resulting in a transition of the nanorod orientation from the normal to the in-plane direction of the film. The calculated threshold vicinal angle for the onset of the transition and lattice deformation of the YBa₂Cu₃O_7?δ film due to the inclusion of the nanorods is in very good agreement with experimental observations. This result sheds lights on the understanding of the role of the film/substrate lattice mismatch in controlling self-assembly of dopant nanostructures in matrix films.     

Influence of covalent and non-covalent modification of graphene on the mechanical,thermal and electrical properties of epoxy/graphene nanocomposites: a review

Abstract

Graphene is emerged as a highly sought after reinforcing filler for epoxy matrix in view of its superior electrical, mechanical and thermal properties. Dispersion of low concentration of graphene can significantly enhance the epoxy/graphene nanocomposites properties. Dispersion of graphene in epoxy matrix depends on processing protocols used, and interfacial interaction between epoxy matrix and graphene. Interfacial interaction between epoxy matrix and graphene can be achieved by covalent and non-covalent modification of graphene. This paper comprehensively review the influence of different processing protocols adopted for the processing of epoxy/graphene nanocomposites, and its effect on mechanical, thermal and electrical properties. In addition, covalent and non-covalent strategies adopted for modification of graphene, and its influence on mechanical, thermal and electrical properties of epoxy/graphene nanocomposites are extensively discussed. The future challenges associated with graphene reinforced epoxy nanocomposites processing have been discussed.     

Amorphous Cobalt Coordination Nanolayers Incorporated with Silver Nanowires: A New Electrode Material for Supercapacitors

The 2D amorphous cobalt coordination framework/silver nanowires nanocomposites (A‐CoL/Ag NC) are successfully synthesized by one‐step solution agitation at room temperature. The experimental data reveal that the hybrid provides sufficient contact between active materials and electrolyte, and facilitates the transfer of ions/electrons, resulting in high specific capacitance, high output potential, great rate capacity at high current density, and good cycle stability. As supercapacitor electrode materials, the as‐prepared A‐CoL/Ag NC electrode exhibits a great specific capacitance which can reach up to 1467 mF cm^?2 at 1.0 mA cm^?2, and 1060 mF cm^?2 even at 10.0 mA cm^?2. The A‐CoL/Ag NC// activated carbon asymmetric supercapacitor (AC ASC) displays a maximum energy density (110 W h kg^?1 at 760 W kg^?1) and maximum power density (6410 W kg^?1 at 63 W h kg^?1) in 3.0 m KOH. Moreover, the developed solid‐state A‐CoL/Ag NC//AC ASC has a broad operated potential window within 0–1.6 V, long cycle life (95.2% after cycling 7000 cycles), delivering an energy density of 151 W h kg^?1 (at 790 W kg^?1), and a power density of 7972 W kg^?1 (at 70 W h kg^?1). The well‐synthesized nanocomposite provides a novel way to synthesize prominent electrode materials for supercapacitors.     

Resistive switching behaviors of Cu/TaOx/TiN device with combined oxygen vacancy/copper conductive filaments

Forming-free and self-compliant bipolar resistive switching is observed in Cu/TaO_x/TiN conductive bridge random access memory. Generally, Pt has been investigated as an inert electrode. However, Pt is not desirable material in current semiconductor industry for mass production. In this study, all electrodes are adapted to complementary metal-oxide-semiconductor compatible materials. The self-compliant resistive switching is achieved via usage of TiN bottom electrode. Also, dissolved Cu ions in TaO_x lead to forming-free resistive switching behavior. The resistive switching mechanism is formation and rupture of combined oxygen vacancy/metallic copper conductive filament. We propose that Cu/TaO_x/TiN is a promising candidate for a conductive bridge random access memory structure.